Infineon Technologies CY62128EV30LL-45ZXIT

Overview

CY62128EV30LL-45ZXIT from Cypress Semiconductor is a 1-Mbit (128K × 8) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply voltage, and industrial temperature range (–40 °C to +85 °C), designed for low-power portable memory buffering in handheld devices requiring fast random-access storage with ultra-low standby current (1 µA typical).

For engineers reviewing the CY62128EV30LL-45ZXIT datasheet, CY62128EV30LL-45ZXIT pinout, CY62128EV30LL-45ZXIT application, or CY62128EV30LL-45ZXIT equivalent, key selection criteria include its dual chip enable (CE1/CE2) architecture, MoBL® power-down behavior, TSOP/STSOP/SOIC package compatibility, and guaranteed 45 ns read/write timing at full industrial voltage and temperature range.

Technical Context

The CY62128EV30LL-45ZXIT implements a fully static 128K × 8 memory array with complementary metal oxide semiconductor (CMOS) process technology, enabling zero-refresh operation and deterministic timing across voltage and temperature. Its dual CE architecture (CE1 active-low, CE2 active-low logic) allows hierarchical memory banking and seamless expansion without external logic.

Automatic power-down activates when CE1 is HIGH or CE2 is LOW, reducing ICC to ≤4 µA while placing I/Os in high-impedance state-critical for battery-backed retention. Read and write cycles are strictly controlled by OE and WE timing relative to CE assertion, with tDOE = 22 ns and tPWE = 35 ns ensuring robust interface synchronization with microcontrollers and ASICs.

Key Specifications

Pinout & Package

Package: 32-pin Shrink Thin Small Outline Package (STSOP), 8.0 mm × 13.4 mm body, 0.5 mm pitch, lead-free (Pb-free) finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with IS62WV1288BLL-45NLI and AS6C1008-45TIN, the CY62128EV30LL-45ZXIT uniquely supports 2.2 V operation and offers the smallest STSOP footprint-making it optimal for next-gen wearable and automotive modules where voltage flexibility and board area are constrained.

Availability

CY62128EV30LL-45ZXIT is available at Aetrix Electronics and suitable for portable medical monitors, industrial HMI panels, smart meter data loggers, and automotive infotainment head units requiring stable component supply with guaranteed long-term manufacturability.

Supply support for CY62128EV30LL-45ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB-C/USB-PD solutions.

The CY62128EV30 belongs to Cypress's MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power portable electronics where extended battery runtime and small-form-factor packaging are primary design drivers.

FAQ

What is the minimum VCC required to retain data in CY62128EV30LL-45ZXIT?

The device guarantees data retention down to 1.5 V (VDR), as specified in the Data Retention Characteristics table. At this voltage, ICCDR is ≤3 µA, and the part enters low-power retention mode automatically when CE1 is HIGH or CE2 is LOW-no external control signal is needed to initiate retention.

Can CY62128EV30LL-45ZXIT operate reliably at 2.2 V across the full industrial temperature range?

Yes. The Electrical Characteristics table explicitly lists 2.2 V as the minimum VCC for industrial-grade operation (–40 °C to +85 °C), and all AC timing parameters-including 45 ns access time-are guaranteed across this full voltage and temperature envelope per Rev. *N datasheet.

How does the dual CE architecture (CE1 and CE2) improve system design?

CE1 and CE2 implement OR logic for chip disable: CE1 HIGH OR CE2 LOW forces standby. This allows direct connection to two separate address decoder outputs-e.g., one for upper memory map and one for lower-enabling seamless 256K+ memory expansion without additional logic gates or CPLDs.

Is the NC pin (Pin 26 in STSOP) safe to tie to ground?

Yes. Per the Pin Configuration diagrams and Product Portfolio table, Pin 26 is designated NC (No Connect) and is not bonded on the die. It may be left floating or tied to GND for mechanical stability-no electrical impact on functionality or reliability occurs in either case.