Infineon Technologies CY62136EV30LL-45ZSXIT
- Part No.:
- CY62136EV30LL-45ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62136EV30LL-45ZSXIT.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62136EV30LL-45ZSXIT from Infineon Technologies (formerly Cypress) is a 2-Mbit (128K × 16) low-power CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and ultra-low standby current (1 µA typical). It supports byte-level write control via BHE/ BLE and automatic power-down when deselected - designed for battery-sensitive portable systems including cellular handsets and handheld medical devices.
For engineers reviewing the CY62136EV30LL-45ZSXIT datasheet, CY62136EV30LL-45ZSXIT pinout, CY62136EV30LL-45ZSXIT application, or CY62136EV30LL-45ZSXIT equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), VFBGA-48 package compatibility, MoBL® low-active-power architecture, and CE/OE/BHE/ BLE timing compliance per Rev. *J specification.
Technical Context
The device implements a full CMOS SRAM array organized as 128K words × 16 bits, with independent high- and low-byte enable (BHE/ BLE) for selective 8-bit writes. Its logic block integrates address decoding, sense amplifiers, and data drivers with tri-state I/O control driven by CE, OE, BHE, and BLE states.
Automatic power-down activates when CE is HIGH and all inputs are held at valid CMOS levels, reducing ICC to ≤7 µA. Read/write operations require precise setup/hold timing relative to CE, WE, OE, and byte enables - with tAA = 45 ns, tDOE = 22 ns, and tHZOE ≤ 18 ns - ensuring deterministic interface behavior in synchronous memory subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Mbit (128K × 16) - provides 256 KB of fast, non-refreshing data storage |
| Access Time | 45 ns - guarantees deterministic read latency under worst-case industrial conditions |
| Supply Voltage | 2.2 V to 3.6 V - supports single-supply operation across Li-ion battery discharge profiles |
| Standby Current | 1 µA typical / 7 µA max - enables multi-week battery life in always-on sleep modes |
| Active Current | 2 mA typical at 1 MHz - minimizes dynamic power during burst data transfers |
| Operating Temp | –40°C to +85°C - qualified for industrial-grade embedded and portable equipment |
| Data Retention | 1.0 V minimum VCC - maintains stored data during deep-sleep at ultra-low voltage |
Pinout & Package
Supplied in Pb-free 48-ball Very Fine Ball Grid Array (VFBGA) package with 0.5 mm pitch, footprint compatible with JEDEC MO-276AB. Pinout supports standard SRAM bus interface with dedicated address (A0–A16), data (I/O0–I/O15), and control (CE, OE, WE, BHE, BLE) terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus selecting one of 128K locations |
| I/O0–I/O7 | Data Bus (Low Byte) | Bi-directional 8-bit path enabled only when BLE = LOW |
| I/O8–I/O15 | Data Bus (High Byte) | Bi-directional 8-bit path enabled only when BHE = LOW |
| CE | Chip Enable | Active-LOW global select; forces standby mode when HIGH |
| OE | Output Enable | Active-LOW control for read data output; disables outputs when HIGH |
| WE | Write Enable | Active-LOW signal initiating write cycle when CE = LOW |
| BLE | Byte Low Enable | Active-LOW control enabling I/O0–I/O7 for write/read |
| BHE | Byte High Enable | Active-LOW control enabling I/O8–I/O15 for write/read |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active current to 2 mA at 1 MHz and standby to 1 µA - extends battery runtime without sacrificing speed |
| Byte-Selectable Write Control | Independent BHE/ BLE pins allow partial-word writes, minimizing bus traffic and system-level power |
| Automatic Power-Down on Deselect | CE HIGH triggers hardware-initiated power gating - eliminates need for external power management logic |
| Industrial Temperature Range Support | Validated operation from –40°C to +85°C ensures reliability in harsh environments without derating |
| Pb-Free VFBGA-48 Packaging | 0.5 mm pitch, JEDEC MO-276AB-compliant footprint enables high-density PCB layout and automated assembly |
Applications
| Cellular Handset Baseband | Portable Medical Monitor |
|---|---|
Use Scenario: Real-time buffering of sensor data and voice codec streams during intermittent RF transmission. IC Role / Device Role / Timing Role: High-speed, low-leakage SRAM serving as working memory for DSP subsystems with strict 45 ns read latency requirement. Use Value: Enables continuous 24-hour operation on single-cell Li-ion battery due to 1 µA ISB2 and automatic CE power-down. | Use Scenario: Storing ECG waveform samples and calibration parameters in battery-powered diagnostic handhelds. IC Role / Device Role / Timing Role: Non-volatile-retentive buffer interfacing directly with microcontroller's 16-bit parallel bus at 2.5 V nominal supply. Use Value: Supports >10-year data retention at 1.0 V VCC, meeting IEC 62304 Class C safety-critical data integrity requirements. |
| Industrial PLC I/O Module | Wearable Fitness Tracker |
Use Scenario: Temporary storage of fieldbus message payloads and status registers in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: Parallel SRAM providing deterministic access for real-time EtherCAT slave processing with <45 ns tAA. Use Value: Maintains functional operation across –40°C to +85°C ambient without thermal throttling or refresh overhead. | Use Scenario: Caching motion sensor fusion results and Bluetooth LE packet buffers in compact wrist-worn form factors. IC Role / Device Role / Timing Role: Low-profile VFBGA-48 SRAM enabling minimal PCB area usage while supporting burst-mode accelerometer reads. Use Value: Achieves 30% longer charge cycle vs. comparable 3.3 V SRAMs due to 2.2 V minimum VCC and sub-µA standby leakage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV12816BLL-45NLI | 45 ns access, 2.5–3.6 V supply, 128K × 16 organization, TSOP-44 only - no VFBGA option | Lacks BHE/ BLE byte control; requires full 16-bit writes - increases system-level power in partial-write scenarios | Select when board layout uses TSOP-44 and byte-select functionality is not required |
| AS6C4008-45TIN | 45 ns access, 2.7–3.6 V supply, 256K × 16 density, SOJ-44 - higher voltage floor and larger capacity | Higher minimum VCC limits use in 2.2–2.5 V battery systems; no industrial temp grade available | Select only for 3.3 V systems requiring >2 Mbit density and SOJ-44 mechanical compatibility |
Compared with IS62WV12816BLL-45NLI and AS6C4008-45TIN, CY62136EV30LL-45ZSXIT uniquely delivers byte-select capability, 2.2 V operation, and VFBGA-48 packaging - making it the sole choice for space-constrained, battery-operated designs needing partial-word writes and extended temperature compliance.
Availability
CY62136EV30LL-45ZSXIT is available at Aetrix Electronics and suitable for cellular handset baseband, portable medical monitors, and industrial PLC I/O modules requiring stable component supply, long-term lifecycle assurance, and Pb-free manufacturing compliance.
Supply support for CY62136EV30LL-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the MoBL® SRAM portfolio, delivering high-reliability semiconductor solutions for automotive, industrial, and IoT markets.
This part belongs to the MoBL® (More Battery Life™) Static RAM product line - engineered specifically for ultra-low-power portable electronics where extended battery life, fast access, and industrial temperature resilience are mandatory design requirements.
FAQ
What is the maximum clock frequency supported for read/write cycles?
CY62136EV30LL-45ZSXIT does not use a clock signal - it is an asynchronous SRAM. Maximum effective throughput is determined by access time (45 ns) and cycle time (45 ns), enabling up to ~22.2 MHz sustained random access rate. Timing is controlled solely by CE, OE, WE, and byte enable edges per the switching characteristics table in Rev. *J datasheet.
Can this SRAM retain data at voltages below 2.2 V?
Yes - data retention is guaranteed down to 1.0 V VCC (VDR), with ICCDR ≤ 3 µA at that level. This allows the device to maintain memory contents during deep-sleep modes where system supply is reduced to extend battery life, provided CE remains HIGH and inputs are held at valid logic levels.
Is the 48-ball VFBGA package RoHS and REACH compliant?
Yes - CY62136EV30LL-45ZSXIT is manufactured as Pb-free per JEDEC J-STD-609 Category 1, with NiPdAu surface finish on solder balls. Full RoHS Directive 2011/65/EU and REACH SVHC compliance documentation is available through Infineon's product change notifications and material declarations portal.
How does automatic power-down differ from standby mode?
Automatic power-down is a hardware feature triggered when CE is HIGH and all control inputs (BHE, BLE, OE, WE) are held at valid CMOS levels - reducing ICC to ≤7 µA without software intervention. Standby mode is the functional state entered during that condition; both terms refer to the same low-power operational state defined by ISB2 in the datasheet.
CY62136EV30LL-45ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62136EV30LL-45ZSXIT FAQ
1.How can I place an order for CY62136EV30LL-45ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62136EV30LL-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62136EV30LL-45ZSXIT reliable?
The price and inventory of CY62136EV30LL-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62136EV30LL-45ZSXIT is usually 5 days.
3.What payment methods are accepted for CY62136EV30LL-45ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62136EV30LL-45ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62136EV30LL-45ZSXIT?
CY62136EV30LL-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62136EV30LL-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62136EV30LL-45ZSXIT?
For technical support, including CY62136EV30LL-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62136EV30LL-45ZSXIT requirements.
6.How does Aetrix verify that CY62136EV30LL-45ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY62136EV30LL-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62136EV30LL-45ZSXIT meets industry standards.
7.What is the process for return or replacement of CY62136EV30LL-45ZSXIT?
All CY62136EV30LL-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62136EV30LL-45ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62136EV30LL-45ZSXIT part is unused and in its original packaging.
Return procedure for CY62136EV30LL-45ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62136EV30LL-45ZSXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

