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Infineon Technologies CY62136FV30LL-45BVXIT

Part No.:
CY62136FV30LL-45BVXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62136FV30LL-45BVXIT.pdf
Description:
IC SRAM 2MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,430

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Product details

Overview

CY62136FV30LL-45BVXIT from Cypress Semiconductor is a 2-Mbit (128 K × 16) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and ultra-low standby current (1 µA typical). It supports industrial/automotive-A temperature range (–40 °C to +85 °C) and features automatic power-down on deselect, byte-wide write enable (BHE/ BLE), and high-impedance I/O during disable - deployed in battery-powered portable electronics requiring deterministic timing and low quiescent power.

For engineers reviewing the CY62136FV30LL-45BVXIT datasheet, CY62136FV30LL-45BVXIT pinout, CY62136FV30LL-45BVXIT application, or CY62136FV30LL-45BVXIT equivalent, key selection criteria include verified 45 ns read cycle time, validated 1 µA ISB2 standby current at 3.6 V, confirmed 48-ball VFBGA package mapping, and functional compatibility with CY62136V and CY62136EV30 for memory expansion in space-constrained embedded systems.

Technical Context

The CY62136FV30LL-45BVXIT implements a fully static 128K × 16 SRAM array with dual-byte write control via independent BHE and BLE inputs, enabling selective 8-bit writes without masking logic. Its CMOS architecture delivers deterministic 45 ns tRC and tAA timing under industrial voltage (2.2–3.6 V) and temperature (–40 °C to +85 °C) conditions.

Power management is handled through CE-driven automatic power-down: when CE is HIGH and address lines are stable, ISB1 drops to ≤5 µA; full deselection (CE HIGH, OE HIGH, BHE/ BLE HIGH) forces ISB2 ≤5 µA while placing all I/Os into high-Z state - critical for MoBL®-targeted portable applications where >99% power reduction during idle is required.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128 K × 16 bits - provides 2 Mbit density with parallel 16-bit data bus for efficient microcontroller interfacing.
Access Time (tAA)45 ns max - guarantees deterministic read latency for real-time firmware execution in industrial controllers.
Supply Voltage Range2.2 V to 3.6 V - supports direct interface with 2.5 V and 3.3 V logic domains without level-shifting.
Standby Current (ISB2)≤5 µA at 3.6 V - enables multi-year battery life in always-on IoT sensor nodes with infrequent memory access.
Operating Current (ICC)≤18 mA at fmax - ensures thermal stability in compact sealed enclosures without forced cooling.
Temperature Range–40 °C to +85 °C - qualified for industrial automation and automotive-A cabin electronics deployment.
Package48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch) - enables high-density PCB layout in handheld medical devices.

Pinout & Package

48-ball very fine-pitch ball grid array (VFBGA) package with 0.5 mm pitch, 6 mm × 8 mm body size, and JEDEC MO-276 compliant footprint. Thermal resistance θJA = 75 °C/W (still air, 2-layer board).

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address Inputs17-bit address bus supporting full 128K-word addressing; A16 enables 256K-word expansion mode when used with higher-density variants.
I/O0–I/O15Bidirectional Data Bus16-bit parallel interface; high-impedance state asserted when CE HIGH, OE HIGH, or BHE/ BLE HIGH - prevents bus contention.
CEChip EnableActive LOW global select; drives automatic power-down when HIGH, reducing ICC to ≤5 µA.
OEOutput EnableActive LOW read strobe; controls output drivers only - does not affect internal power state.
WEWrite EnableActive LOW write strobe; initiates write cycle when CE and WE both LOW; timing-critical for tSD = 25 ns data setup.
BHE / BLEByte High/Low EnableIndependent active LOW enables for upper/lower 8-bit bytes; allows partial writes without external gating logic.
VCC / VSSPower / GroundDual VCC pins (Balls A16, D3) and dual VSS pins (Balls E1, H1) reduce IR drop and improve noise immunity.
NCNo ConnectBalls D3, H1, G2, H6, H3 are unconnected - reserved for future density scaling (4 Mb to 64 Mb).

Key Features

FeatureDesign Value
MoBL® Ultra-Low Power ArchitectureReduces active current to 1.6 mA at 1 MHz and standby to 1 µA typical - extends battery runtime in portable telemetry units.
Automatic CE Power-DownReduces power consumption by >99% when CE is HIGH and addresses stable - eliminates need for external sleep controllers.
Byte-Selectable Write ControlEnables independent 8-bit writes via BHE/ BLE without external byte-mask logic - saves PCB area and routing complexity.
Pb-Free VFBGA Packaging48-ball VFBGA meets RoHS and JEDEC MO-276 standards - supports automated reflow assembly and thermal reliability in harsh environments.
Pin CompatibilityDirect replacement for CY62136V, CY62136CV30, and CY62136EV30 - simplifies BOM rationalization and legacy design refresh.

Applications

Portable Medical MonitorsIndustrial PLC I/O Modules

Use Scenario: Continuous ECG waveform buffering in handheld patient monitors with coin-cell battery power budget.

IC Role / Device Role / Timing Role: Primary data buffer storing 16-bit sampled analog front-end output; 45 ns tAA ensures zero-latency FIFO refill during burst acquisition.

Use Value: 1 µA ISB2 standby current enables >3-year shelf life without battery replacement; VFBGA footprint fits within 12 mm² board area constraint.

Use Scenario: Real-time status logging in DIN-rail mounted programmable logic controllers with isolated fieldbus interfaces.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM for configuration registers and fault history; operates across –40 °C to +85 °C ambient without derating.

Use Value: Dual VCC/VSS pins suppress ground bounce during simultaneous I/O toggling; 2.2–3.6 V range accommodates wide-input DC-DC converter outputs.

Automotive Cabin InfotainmentWireless Sensor Node Gateways

Use Scenario: Audio buffer in rear-seat entertainment systems requiring low EMI and thermal stability near display backlight drivers.

IC Role / Device Role / Timing Role: Low-noise 16-bit data path between DSP and audio codec; high-Z I/O state prevents signal coupling during mute intervals.

Use Value: 75 °C/W θJA enables operation at 85 °C ambient without heatsink; Pb-free VFBGA passes AEC-Q100 stress testing.

Use Scenario: Edge-processing buffer in LoRaWAN gateways aggregating sensor data before RF transmission.

IC Role / Device Role / Timing Role: Temporary storage for encrypted payload packets prior to AES encryption and modulation; byte-enable support reduces MCU GPIO usage.

Use Value: 45 ns tRC allows full 128K-word readout in <6 ms - faster than LoRa transmit preamble duration, eliminating pipeline stalls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS62WV12816BLL-45NLI45 ns access, 2.5–3.6 V supply, 44-pin TSOP II package - lacks BHE/ BLE byte enables and automatic CE power-down.Requires external byte-mask logic and external sleep controller for equivalent low-power operation.Select when TSOP II mounting is mandatory and system-level power management already exists.
AS6C1008-45TIN45 ns access, 2.7–3.6 V supply, 32-pin SOJ package - no VFBGA option, higher ISB (10 µA typical), no automotive qualification.Not suitable for space-constrained or extended-temperature deployments; limited to commercial-grade applications.Select only for cost-sensitive, non-automotive, through-hole prototyping where board area is not constrained.

Compared with IS62WV12816BLL-45NLI and AS6C1008-45TIN, the CY62136FV30LL-45BVXIT uniquely integrates byte-select write control, automatic CE power-down, and automotive-A qualification in a Pb-free VFBGA - delivering lower system-level BOM count, longer battery life, and broader environmental compliance without trade-offs in speed or density.

Availability

CY62136FV30LL-45BVXIT is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC I/O modules, and automotive cabin infotainment systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY62136FV30LL-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and consumer electronics with emphasis on low-power innovation and signal integrity.

The MoBL® (More Battery Life™) SRAM product line targets portable and energy-harvesting applications where sub-microamp standby current, deterministic timing, and small-footprint packaging are critical system requirements.

FAQ

What is the maximum operating frequency supported by CY62136FV30LL-45BVXIT?

The device does not operate at a clock frequency but supports a minimum read cycle time (tRC) of 45 ns, corresponding to a maximum effective throughput of approximately 22.2 MHz for consecutive reads. This timing is guaranteed across the full industrial temperature range (–40 °C to +85 °C) and 2.2–3.6 V supply, with no internal clock generator or PLL circuitry present.

Does CY62136FV30LL-45BVXIT require external pull-up resistors on BHE and BLE pins?

No external pull-ups are required. BHE and BLE are CMOS-compatible inputs with VIH(min) = 1.8 V (at VCC ≥ 2.2 V) and VIL(max) = 0.6 V. They must be driven to valid logic levels (not left floating) to meet ISB1/ISB2 specifications, but standard microcontroller GPIOs or FPGA outputs can directly drive them without passive components.

Can CY62136FV30LL-45BVXIT retain data at 1.5 V supply?

Yes - data retention is specified down to VDR = 1.5 V, with ICCDR ≤4 µA at that voltage. The device enters data retention mode automatically when CE is HIGH and VCC remains ≥1.5 V; no additional control signals or sequencing is needed beyond maintaining CE HIGH and stable VCC.

Is the 48-ball VFBGA footprint compatible with standard reflow soldering processes?

Yes - the package complies with JEDEC MO-276 and supports standard lead-free reflow profiles (peak temperature 260 °C, 60-second dwell). Its 0.5 mm pitch and dual-row ball layout are compatible with Class 7 placement accuracy and stencil-defined solder paste deposition, achieving >99.9% first-pass yield in certified SMT lines.

CY62136FV30LL-45BVXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
2Mbit
Memory Organization:
128K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62136FV30LL-45BVXIT FAQ

1.How can I place an order for CY62136FV30LL-45BVXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62136FV30LL-45BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62136FV30LL-45BVXIT reliable?

The price and inventory of CY62136FV30LL-45BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62136FV30LL-45BVXIT is usually 5 days.

3.What payment methods are accepted for CY62136FV30LL-45BVXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62136FV30LL-45BVXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62136FV30LL-45BVXIT?

CY62136FV30LL-45BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62136FV30LL-45BVXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62136FV30LL-45BVXIT?

For technical support, including CY62136FV30LL-45BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62136FV30LL-45BVXIT requirements.

6.How does Aetrix verify that CY62136FV30LL-45BVXIT is sourced from the original manufacturer or authorized distributors?

All CY62136FV30LL-45BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62136FV30LL-45BVXIT meets industry standards.

7.What is the process for return or replacement of CY62136FV30LL-45BVXIT?

All CY62136FV30LL-45BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62136FV30LL-45BVXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62136FV30LL-45BVXIT part is unused and in its original packaging.

Return procedure for CY62136FV30LL-45BVXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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