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Infineon Technologies CY62136FV30LL-45ZSXI

Part No.:
CY62136FV30LL-45ZSXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62136FV30LL-45ZSXI.pdf
Description:
IC SRAM 2MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
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Inventory:660

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Product details

Overview

CY62136FV30LL-45ZSXI from Cypress Semiconductor is a 2-Mbit (128 K × 16) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and industrial/automotive-A temperature rating (–40 °C to +85 °C). It delivers ultra-low standby current (1 µA typical), supports byte-wide writes via BHE/ BLE controls, and features automatic power-down on address inactivity - enabling battery-sensitive applications like portable medical monitors and handheld test equipment.

For engineers reviewing the CY62136FV30LL-45ZSXI datasheet, CY62136FV30LL-45ZSXI pinout, CY62136FV30LL-45ZSXI application, or CY62136FV30LL-45ZSXI equivalent, key selection criteria include its 48-ball VFBGA package compatibility, 16-bit data bus interface, MoBL® low-power architecture, and pin-for-pin equivalence with CY62136V and CY62136EV30 series SRAMs.

Technical Context

This SRAM implements a full CMOS 128K × 16 asynchronous memory array with independent byte enable (BHE/BLE) control for selective 8-bit writes, eliminating need for external masking logic. Its dual power-down modes - automatic CE-triggered (90% reduction) and full deselection (99% reduction) - are activated by CMOS-level inputs without external sequencing.

The device uses standard TTL-compatible input thresholds (VIH = 2.2 V min at VCC ≥ 2.7 V) and drives 2.4 V VOH / 0.4 V VOL under load, ensuring interoperability with mixed-voltage 3.3 V/2.5 V microcontroller buses. All timing parameters (tRC = 45 ns, tDOE = 22 ns, tHZOE = 18 ns) are guaranteed over full voltage and temperature range.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128 K × 16 bits - provides 2 Mbit density with native 16-bit parallel interface for efficient MCU data bus coupling
Access Time45 ns - enables direct interfacing with 22 MHz synchronous peripherals without wait states
Supply Voltage Range2.2 V to 3.6 V - supports single-supply operation across 2.5 V and 3.3 V system rails
Standby Current1 µA typical (5 µA max) - extends battery life in always-on sensor nodes and wearables
Operating Current1.6 mA typical at 1 MHz - minimizes thermal load in compact enclosed enclosures
Temperature Range–40 °C to +85 °C - qualified for industrial control and automotive infotainment head units
Package48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch) - enables high-density PCB layouts with minimal footprint

Pinout & Package

48-ball very fine-pitch ball grid array (VFBGA) package with 0.5 mm pitch, 6 mm × 8 mm body size, and JEDEC MO-276 compliant footprint. Pinout optimized for signal integrity: VCC/VSS pairs distributed across corners and edges; I/O pins grouped in two 8-bit banks (I/O0–I/O7, I/O8–I/O15); dedicated byte enables (BHE, BLE) adjacent to respective I/O banks.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address Inputs17-bit address bus supporting full 128K-word addressing; A16 enables 256K-word expansion mode when used with NC pins
I/O0–I/O7Data Bus (Low Byte)Bi-directional 8-bit data path active only when BLE = LOW; high-impedance when deselected or during write
I/O8–I/O15Data Bus (High Byte)Bi-directional 8-bit data path active only when BHE = LOW; isolated from low byte for independent access
CEChip EnableActive-low global select; forces full standby mode (ISB2 ≤ 5 µA) when HIGH and all inputs at CMOS levels
OEOutput EnableActive-low read strobe; controls output drivers only - does not affect internal power state
WEWrite EnableActive-low write strobe; initiates write cycle when CE and WE both LOW; timing-critical for tSD = 25 ns setup
BLEByte Low EnableActive-low enable for I/O0–I/O7; allows partial writes without disturbing high byte contents
BHEByte High EnableActive-low enable for I/O8–I/O15; supports 8-bit peripheral interfacing on 16-bit bus systems

Key Features

FeatureDesign Value
MoBL® Ultra-Low Power ArchitectureReduces active current to 1.6 mA at 1 MHz and standby to 1 µA - extends runtime in coin-cell-powered IoT edge nodes
Automatic Address-Inactivity Power DownReduces ICC by 90% when addresses stall - eliminates need for external sleep controllers in polling-based firmware
Independent Byte Write ControlEnables atomic 8-bit updates to either half of 16-bit word - avoids read-modify-write cycles in real-time control registers
Pb-Free VFBGA Packaging48-ball 0.5 mm pitch package meets RoHS and J-STD-020 reflow profiles - supports automated SMT assembly at 260 °C peak

Applications

Portable Medical MonitorsIndustrial PLC I/O Modules

Use Scenario: Continuous acquisition of ECG waveforms at 1 kS/s with local buffering before wireless transmission.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer storing 16-bit sample streams; interfaces directly to ARM Cortex-M4 ADC DMA controller.

Use Value: 45 ns access time eliminates DMA wait states; 1 µA standby current preserves battery charge during patient idle periods.

Use Scenario: Real-time logging of analog sensor inputs (temperature, pressure) with timestamping in DIN-rail mounted controllers.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding last-known-good values during brownout events; accessed via RS-485 master MCU.

Use Value: 2.2–3.6 V operation tolerates wide industrial rail fluctuations; –40 °C to +85 °C rating ensures reliability in unconditioned cabinets.

Automotive Infotainment Head UnitsHandheld Test & Measurement Equipment

Use Scenario: Storing decoded audio frames and UI bitmap assets during navigation voice guidance playback.

IC Role / Device Role / Timing Role: High-speed frame buffer between SoC video processor and display controller; operates in burst-read mode.

Use Value: Byte-enable capability allows selective refresh of UI elements without reloading full frame buffers - cuts bandwidth demand by 50%.

Use Scenario: Capturing oscilloscope waveform snapshots at 10 MS/s into on-device memory for post-acquisition analysis.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as circular capture buffer; clocked by FPGA-controlled address sequencer.

Use Value: 48-ball VFBGA footprint fits within tight 4-layer PCB space constraints; 75 °C/W θJA enables passive cooling in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS62WV12816BLL-45NLI45 ns access, same 128K × 16 organization, but 44-pin TSOP-II package and higher ISB (10 µA typical)Larger footprint and higher standby draw limit use in ultra-low-power portable designsSelect when board layout requires through-hole or larger pitch packages and thermal margin exceeds 10 °C
AS6C4008-45TIN45 ns access, 256K × 16 organization, 48-ball VFBGA, but wider VCC range (2.7–3.6 V) and no automotive qualificationHigher density suits firmware caching but lacks AEC-Q100 compliance for automotive deploymentsSelect for cost-sensitive industrial gateways where extended temperature range is not required

Compared with IS62WV12816BLL-45NLI and AS6C4008-45TIN, the CY62136FV30LL-45ZSXI uniquely combines automotive-A qualification, 1 µA standby, and 48-ball VFBGA in a 128K × 16 configuration - making it optimal for space-constrained, battery-backed automotive and portable medical systems requiring guaranteed low-power behavior.

Availability

CY62136FV30LL-45ZSXI is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC I/O modules, and automotive infotainment head units requiring stable component supply across extended product lifecycles.

Supply support for CY62136FV30LL-45ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and consumer applications.

The CY62136FV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power, high-speed data buffering in portable and energy-constrained embedded systems.

FAQ

What is the maximum operating frequency supported by CY62136FV30LL-45ZSXI?

The device does not operate synchronously and has no clock input. Its maximum effective throughput is determined by access time: 45 ns read/write cycle time supports up to ~22 MHz sustained random access. For burst transfers, actual bandwidth depends on bus protocol overhead and controller latency - measured worst-case tRC = 45 ns guarantees no wait states with 22 MHz peripherals.

Does CY62136FV30LL-45ZSXI require external pull-up resistors on BHE and BLE pins?

No. BHE and BLE are CMOS inputs with standard VIH/VIL thresholds (2.2 V min / 0.8 V max at VCC = 3.3 V). They must be driven to valid logic levels - floating states violate ISB1/ISB2 specifications and may increase standby current beyond 5 µA. External pull-ups are unnecessary if controlled by an MCU GPIO or ASIC output.

Can CY62136FV30LL-45ZSXI retain data at 1.5 V supply?

Yes. Data retention is guaranteed down to VDR = 1.5 V with ICCDR ≤ 4 µA (industrial/auto-A grade). This mode requires CE and byte enables held at CMOS levels while VCC drops to 1.5 V - enabling backup operation from supercapacitors or coin cells during main rail failure.

Is the 48-ball VFBGA package compatible with standard reflow profiles?

Yes. The Pb-free VFBGA package complies with J-STD-020D moisture sensitivity level 3 and supports peak reflow temperatures up to 260 °C. Recommended profile includes ramp rate ≤ 3 °C/s, soak at 150–200 °C for 60–120 s, and time above liquidus (217 °C) of 60–90 s - matching standard lead-free assembly lines.

CY62136FV30LL-45ZSXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
2Mbit
Memory Organization:
128K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62136FV30LL-45ZSXI FAQ

1.How can I place an order for CY62136FV30LL-45ZSXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62136FV30LL-45ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62136FV30LL-45ZSXI reliable?

The price and inventory of CY62136FV30LL-45ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62136FV30LL-45ZSXI is usually 5 days.

3.What payment methods are accepted for CY62136FV30LL-45ZSXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62136FV30LL-45ZSXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62136FV30LL-45ZSXI?

CY62136FV30LL-45ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62136FV30LL-45ZSXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62136FV30LL-45ZSXI?

For technical support, including CY62136FV30LL-45ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62136FV30LL-45ZSXI requirements.

6.How does Aetrix verify that CY62136FV30LL-45ZSXI is sourced from the original manufacturer or authorized distributors?

All CY62136FV30LL-45ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62136FV30LL-45ZSXI meets industry standards.

7.What is the process for return or replacement of CY62136FV30LL-45ZSXI?

All CY62136FV30LL-45ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62136FV30LL-45ZSXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62136FV30LL-45ZSXI part is unused and in its original packaging.

Return procedure for CY62136FV30LL-45ZSXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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