Infineon Technologies CY62136VNLL-70BAXAT
- Part No.:
- CY62136VNLL-70BAXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
CY62136VNLL-70BAXAT.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,441
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62136VNLL-70BAXAT from Cypress Semiconductor is a 2-Mbit (128K × 16) CMOS static RAM with MoBL® low-power architecture, designed for battery-sensitive portable systems. It operates at 55 ns access time over 2.7V–3.6V supply, supports industrial and automotive temperature ranges (–40°C to +125°C), and features automatic CE-controlled power-down reducing standby current to 1 µA - enabling extended runtime in cellular handsets and handheld instrumentation.
For engineers reviewing the CY62136VNLL-70BAXAT datasheet, CY62136VNLL-70BAXAT pinout, CY62136VNLL-70BAXAT application, or CY62136VNLL-70BAXAT equivalent, key selection criteria include byte-enable control (BHE/ BLE), TTL-compatible I/O, ultra-low ISB2 standby current, and TSOP II package compatibility for space-constrained PCB layouts.
Technical Context
The CY62136VNLL-70BAXAT implements a full 128K × 16 asynchronous SRAM array with independent high- and low-byte write enables (BHE/BLE), allowing partial-word writes without read-modify-write cycles. Its dual power-down modes - automatic address-stable detection (99% current reduction) and CE-driven standby - are hardware-triggered with no software overhead.
Timing is fully asynchronous: read cycle time (tRC) is 55 ns max, address-to-data (tAA) and CE-to-output (tACE) are both 55 ns, and OE/CE/BLE/BHE-to-output enable/disable delays are specified down to 5 ns (tLZOE/tLZCE). All I/Os enter high-impedance state under four conditions: CE HIGH, OE HIGH, BHE/BLE HIGH, or during active write (CE LOW & WE LOW).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 2 Mbit (128K words × 16 bits); supports 16-bit data bus interface without external multiplexing. |
| Access Time | 55 ns max; ensures compatibility with 18 MHz bus timing in legacy microcontroller systems. |
| VCC Range | 2.7 V to 3.6 V; matches Li-ion battery discharge profile and eliminates need for LDO regulation in portable designs. |
| ISB2 Standby Current | 1 µA typical at 25°C; enables multi-year battery life in always-on memory-retention applications. |
| Operating Temp | –40°C to +125°C (Automotive-E grade); qualified for under-hood and industrial control environments. |
| I/O Voltage Compatibility | TTL-compatible inputs/outputs; interfaces directly with 3.3V logic families without level shifters. |
| Data Retention VCC | 1.0 V minimum; allows memory contents to persist during deep sleep or brown-out conditions. |
Pinout & Package
Package: 44-pin TSOP Type II (Thin Small Outline Package), 400 mil width, standard lead-free finish per JEDEC MO-143AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word addressing; A16 enables 2-Mbit density. |
| I/O0–I/O7 | Low-Byte Data I/O | Bi-directional 8-bit data path enabled when BLE = LOW; isolated during high-byte writes. |
| I/O8–I/O15 | High-Byte Data I/O | Bi-directional 8-bit data path enabled when BHE = LOW; operates independently of low-byte path. |
| CE | Chip Enable | Active-LOW global select; forces device into standby (ISB2) when HIGH, enabling system-level power gating. |
| OE | Output Enable | Active-LOW output control; places I/Os in high-Z when HIGH, allowing bus sharing. |
| WE | Write Enable | Active-LOW write strobe; initiates write when CE and WE both LOW; defines write cycle timing boundary. |
| BLE / BHE | Byte Low/High Enable | Independent active-LOW controls for 8-bit sub-word writes; eliminates need for external byte masking logic. |
| VCC / VSS | Power / Ground | Dual VCC pins (pins 1 & 44) and dual VSS pins (pins 22 & 23) reduce IR drop and improve noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power | 1 µA typical ISB2 current at 25°C enables >10-year battery life in RTC-backed memory retention. |
| Automatic Address-Stable Power-Down | Reduces ICC by 99% when address lines are static - no software or external control required. |
| Independent Byte Enables (BHE/BLE) | Enables true 8-bit writes on either half of 16-bit bus, eliminating read-modify-write overhead in firmware. |
| TTL-Compatible I/O | Direct interface with 3.3V microcontrollers and FPGAs without level-shifting components or design complexity. |
| Industrial & Automotive Qualification | Qualified across –40°C to +125°C (Automotive-E), supporting deployment in engine control units and industrial HMIs. |
Applications
| Cellular Handset Memory | Portable Medical Instrumentation |
|---|---|
Use Scenario: Storing real-time sensor buffers and configuration data in GSM/UMTS feature phones with single-cell Li-ion supply. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state data storage for baseband processor DMA transfers. Use Value: 55 ns access time and 2.7–3.6 V operation align precisely with BB processor bus timing and battery voltage range. | Use Scenario: Holding waveform history and calibration coefficients in handheld ECG or glucose meters requiring long shelf life. IC Role / Device Role / Timing Role: Non-volatile shadow memory backup via external controller, retaining data at 1.0 V VCC during shutdown. Use Value: 1 µA ISB2 and 1.0 V data retention enable >5-year shelf life without supercapacitor or coin-cell support. |
| Industrial HMI Display Buffer | Automotive Body Control Module |
Use Scenario: Serving as frame buffer for monochrome LCDs in factory-floor operator panels exposed to wide ambient temperatures. IC Role / Device Role / Timing Role: Dual-port-capable SRAM interfaced to MCU and display controller via shared 16-bit bus with OE/CE arbitration. Use Value: TSOP II package fits tight board space; –40°C to +85°C industrial rating ensures reliability in unconditioned enclosures. | Use Scenario: Caching door-lock status, mirror position, and lighting profiles in BCMs where EEPROM wear-out is a concern. IC Role / Device Role / Timing Role: High-reliability volatile memory used for frequent parameter updates, backed by non-volatile storage on power-down. Use Value: Automotive-E qualification (–40°C to +125°C) and 100 µA ISB1 ensure robustness in under-dash thermal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV12816BLL-55MLI | Same 128K × 16 organization, 55 ns speed, but uses 48-pin TSOP I; no BHE/BLE - single 16-bit write only. | Lacks byte-write capability; requires external logic for 8-bit updates; lower ISB2 (0.5 µA) but no automotive qualification. | Select when cost is primary and byte-level writes are unnecessary; verify PCB footprint compatibility. |
| Renesas R1LV25616AS-5SI#S0 | 55 ns access, 2.7–3.6 V, automotive-grade (–40°C to +105°C), but only offers industrial temp option for -55 variant; no BHE/BLE. | Higher ISB2 (5 µA) and narrower temp range than CY62136VNLL-70BAXAT's Automotive-E grade. | Choose if Renesas ecosystem alignment or long-term supply assurance outweighs byte-enable and extended temp needs. |
Compared with IS62WV12816BLL-55MLI and R1LV25616AS-5SI#S0, the CY62136VNLL-70BAXAT uniquely delivers byte-selectable writes, 1 µA ISB2, and full –40°C to +125°C operation - making it optimal for thermally demanding, battery-limited, and firmware-efficient embedded systems.
Availability
CY62136VNLL-70BAXAT is available at Aetrix Electronics and suitable for cellular handset design, portable medical instrumentation, industrial HMI development, and automotive body control modules requiring stable component supply across extended temperature and low-power constraints.
Supply support for CY62136VNLL-70BAXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable solutions for embedded systems.
The CY62136VN series belongs to Cypress's MoBL® (More Battery Life) SRAM portfolio, engineered specifically for ultra-low-power, high-reliability data buffering in portable and automotive electronics where battery longevity and thermal resilience are critical.
FAQ
What is the maximum clock frequency supported by CY62136VNLL-70BAXAT?
The CY62136VNLL-70BAXAT is an asynchronous SRAM and does not use a clock signal. Its performance is defined by access time (55 ns max) and cycle time (55 ns min read/write), enabling reliable operation with bus frequencies up to ~18 MHz in systems with zero wait states and compatible setup/hold timing.
Does CY62136VNLL-70BAXAT support partial-word writes without external logic?
Yes - it supports true 8-bit partial-word writes via dedicated Byte Low Enable (BLE) and Byte High Enable (BHE) inputs. When BLE is LOW, only I/O0–I/O7 are written; when BHE is LOW, only I/O8–I/O15 are written - no external masking logic or read-modify-write sequences required.
Can CY62136VNLL-70BAXAT retain data at 1.0 V VCC?
Yes - its data retention voltage (VDR) is specified at 1.0 V minimum. At this voltage, with CE HIGH and inputs stabilized, the device maintains stored data while drawing ≤7.5 µA (ICC DR), enabling use in brown-out or ultra-low-power sleep modes.
Is the 44-pin TSOP II footprint compatible with other Cypress MoBL® SRAMs?
Yes - the 44-pin TSOP II (MO-143AC) footprint is standardized across Cypress's 2-Mbit MoBL® SRAM family, including CY62136VN variants with different speed grades (e.g., -55, -70) and temperature options, enabling drop-in replacement within same package type.
CY62136VNLL-70BAXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (7x7)
CY62136VNLL-70BAXAT FAQ
1.How can I place an order for CY62136VNLL-70BAXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62136VNLL-70BAXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62136VNLL-70BAXAT reliable?
The price and inventory of CY62136VNLL-70BAXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62136VNLL-70BAXAT is usually 5 days.
3.What payment methods are accepted for CY62136VNLL-70BAXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62136VNLL-70BAXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62136VNLL-70BAXAT?
CY62136VNLL-70BAXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62136VNLL-70BAXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62136VNLL-70BAXAT?
For technical support, including CY62136VNLL-70BAXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62136VNLL-70BAXAT requirements.
6.How does Aetrix verify that CY62136VNLL-70BAXAT is sourced from the original manufacturer or authorized distributors?
All CY62136VNLL-70BAXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62136VNLL-70BAXAT meets industry standards.
7.What is the process for return or replacement of CY62136VNLL-70BAXAT?
All CY62136VNLL-70BAXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62136VNLL-70BAXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62136VNLL-70BAXAT part is unused and in its original packaging.
Return procedure for CY62136VNLL-70BAXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62136VNLL-70BAXAT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

