Infineon Technologies CY62137FV30LL-45BVXI
- Part No.:
- CY62137FV30LL-45BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62137FV30LL-45BVXI.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:420
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Product details
Overview
CY62137FV30LL-45BVXI from Cypress Semiconductor is a 2-Mbit (128 K × 16) MoBL® CMOS static RAM with 45 ns access time, 2.2 V–3.6 V supply voltage, and industrial temperature range (–40 °C to +85 °C). It delivers ultra-low active current (1.6 mA at 1 MHz), 1 µA typical standby current, and supports byte-level power-down for portable battery-powered systems including cellular handsets and handheld instrumentation.
For engineers reviewing the CY62137FV30LL-45BVXI datasheet, CY62137FV30LL-45BVXI pinout, CY62137FV30LL-45BVXI application, or CY62137FV30LL-45BVXI equivalent, key selection criteria include 45 ns read cycle time, dual-byte enable (BHE/ BLE) control, automatic power-down on CE or BHE/ BLE deassertion, and Pb-free 48-ball VFBGA packaging compatible with legacy CY62137CV/CV25/CV30/CV33 families.
Technical Context
This SRAM implements a 128K × 16-bit array with full CMOS architecture optimized for low-power, high-speed operation in portable electronics. Its logic block includes independent byte-enable decoding (I/O0–I/O7 via BLE, I/O8–I/O15 via BHE), automatic power-down circuitry triggered by CE HIGH or simultaneous BHE/BLE HIGH, and tristate output control synchronized to OE, CE, and byte enables.
Switching behavior is defined by strict timing parameters: tRC = 45 ns, tDOE = 22 ns, tHZOE ≤ 18 ns, and tPD = 45 ns. Data retention operates down to VCC = 1.5 V with ICCDR ≤ 4 µA, enabling extended battery backup without external refresh.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128 K × 16-bit (2 Mbit); enables single-word 16-bit data transfers without external multiplexing |
| Access Time (tAA) | 45 ns max; guarantees deterministic read latency for real-time microcontroller interfaces |
| VCC Range | 2.2 V–3.6 V; supports direct interfacing with 2.5 V and 3.3 V logic domains |
| Standby Current (ISB2) | ≤ 5 µA (industrial); reduces system quiescent power by >99% during sleep modes |
| Active Current (ICC) | 13 mA max at fmax; enables sustained burst reads at full speed without thermal throttling |
| Data Retention Voltage | 1.5 V min; allows memory state hold during brown-out or battery-swapping events |
| Package | 48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch); supports high-density PCB layouts with fine-pitch routing |
Pinout & Package
Package: 48-ball very fine-pitch ball grid array (VFBGA), RoHS-compliant, 6 mm × 8 mm footprint, 0.5 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 128K-word addressing; A16 enables 256K-word expansion in higher-density variants |
| I/O0–I/O15 | Bidirectional data bus | 16-bit parallel interface; split into two 8-bit bytes controlled independently by BLE (I/O0–I/O7) and BHE (I/O8–I/O15) |
| CE | Chip Enable | Active LOW global select; forces automatic power-down and high-Z outputs when HIGH |
| OE | Output Enable | Active LOW read control; disables outputs (high-Z) when HIGH, independent of CE state |
| WE | Write Enable | Active LOW write strobe; initiates write cycles when CE and WE both LOW |
| BLE / BHE | Byte Low / Byte High Enable | Independent 8-bit write masking; enables partial-word writes and reduces dynamic power per access |
| VCC / VSS | Power / Ground | Dual VCC pins (balls D1, E1) and dual VSS pins (balls F1, G1) minimize IR drop and improve noise immunity |
| NC | No Connect | Balls D3, H1, G2, H6, H3 are unconnected; reserved for die size scaling to 4 Mb–64 Mb variants |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | 1.6 mA typical active current at 1 MHz and 45 ns speed-enables >100 hr battery life in standby-cycled portable devices |
| Automatic Power-Down | Reduces ICC to ≤5 µA when CE HIGH or both BHE/BLE HIGH-eliminates need for external power-gating logic |
| Byte-Level Write Control | Independent BLE/BHE pins allow 8-bit sub-word writes-cuts bus switching activity and dynamic power by up to 50% |
| Pb-Free VFBGA Packaging | 48-ball, 0.5 mm pitch package meets IPC/JEDEC J-STD-020 moisture sensitivity level 3-supports standard reflow profiles |
| Pin Compatibility | Direct replacement for CY62137CV/CV25/CV30/CV33, CY62137V, and CY62137EV30-enables drop-in upgrade path in existing designs |
Applications
| Cellular Handset Memory | Portable Medical Instrumentation |
|---|---|
|
Use Scenario: Storing real-time sensor buffers and UI state in GSM/UMTS feature phones with tight battery budget. IC Role / Device Role / Timing Role: Primary working memory for baseband processor; 45 ns access satisfies TDMA frame timing constraints. Use Value: 1 µA standby current extends talk time by >15% versus prior-generation SRAMs; byte-write capability reduces EMI during partial updates. |
Use Scenario: Capturing and staging ECG waveform samples in handheld diagnostic devices operating on coin-cell batteries. IC Role / Device Role / Timing Role: High-reliability buffer between analog front-end and low-power MCU; data retention at 1.5 V ensures integrity during battery swap. Use Value: Automatic power-down cuts idle power to <5 µA-enabling >6-month shelf life without recharge; VFBGA footprint saves board space in compact enclosures. |
| Industrial Handheld Terminals | Wearable Fitness Monitors |
|
Use Scenario: Logging barcode scan results and inventory metadata in warehouse scanners subjected to wide ambient temperature swings. IC Role / Device Role / Timing Role: Non-refresh volatile storage for firmware overlay and transaction logs; industrial –40 °C to +85 °C rating ensures field reliability. Use Value: 2.2 V–3.6 V operation tolerates Li-ion battery discharge curve; 48-ball VFBGA withstands mechanical shock and thermal cycling. |
Use Scenario: Caching accelerometer and heart-rate sensor streams in wrist-worn trackers with aggressive size and weight targets. IC Role / Device Role / Timing Role: Low-leakage scratchpad memory for motion algorithm preprocessing; MoBL® architecture minimizes self-heating. Use Value: 10 pF input/output capacitance reduces signal integrity burden on 2-layer flex PCBs; BLE/BHE control enables efficient sensor fusion packet assembly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV12816BLL-45NLI | Same 128K × 16 organization, 45 ns speed, and industrial temp range; 3.3 V only (3.0–3.6 V), no 2.2 V support | Lacks byte power-down and automatic standby; requires external logic for deep-sleep entry | Select when 3.3 V rail stability is guaranteed and MoBL® ultra-low standby is not required |
| ON Semiconductor NVSRAM NCS2116M16-45G | Non-volatile SRAM with integrated EEPROM backup; 45 ns access but higher ICC (25 mA active), larger 54-pin TSOP package | Provides data retention after power loss-eliminates need for external backup battery or capacitor | Select when data persistence across power cycles is mandatory, despite higher cost and power |
Compared with IS62WV12816BLL-45NLI and NCS2116M16-45G, CY62137FV30LL-45BVXI uniquely balances 2.2 V operation, 1 µA standby, and byte-selectable power-down-making it optimal for battery-constrained portable systems where volatility is acceptable and voltage headroom is limited.
Availability
CY62137FV30LL-45BVXI is available at Aetrix Electronics and suitable for cellular handset memory, portable medical instrumentation, and industrial handheld terminals requiring stable component supply, long-term lifecycle support, and Pb-free compliance.
Supply support for CY62137FV30LL-45BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable solutions for embedded systems.
CY62137FV30 belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power portable electronics where extended battery runtime and small form factor are critical design constraints.
FAQ
What is the minimum VCC required to retain data in CY62137FV30LL-45BVXI?
The device guarantees data retention down to VCC = 1.5 V under industrial conditions, with maximum data retention current (ICCDR) of 4 µA. This allows memory contents to persist during brown-out events or battery replacement without external backup capacitors or non-volatile storage.
How does automatic power-down activate, and what signals trigger it?
Automatic power-down activates when Chip Enable (CE) is HIGH, or when both Byte High Enable (BHE) and Byte Low Enable (BLE) are HIGH. In either condition, the device enters ultra-low-power mode with ICC ≤ 5 µA, and all outputs go high-impedance regardless of OE or WE state.
Can CY62137FV30LL-45BVXI operate reliably at 2.2 V while maintaining 45 ns access time?
Yes-the 45 ns access time specification is fully guaranteed across the entire industrial VCC range (2.2 V–3.6 V). Electrical characteristics tables confirm tAA ≤ 45 ns and tRC ≤ 45 ns at VCC = 2.2 V, with corresponding VOH/VOL levels meeting CMOS interface requirements.
Is the 48-ball VFBGA package compatible with standard reflow soldering processes?
Yes-the package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤ 260 °C). Dual VCC/VSS balls and symmetric layout enhance thermal uniformity and reduce warpage risk during assembly.
CY62137FV30LL-45BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62137FV30LL-45BVXI FAQ
1.How can I place an order for CY62137FV30LL-45BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62137FV30LL-45BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62137FV30LL-45BVXI reliable?
The price and inventory of CY62137FV30LL-45BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62137FV30LL-45BVXI is usually 5 days.
3.What payment methods are accepted for CY62137FV30LL-45BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62137FV30LL-45BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62137FV30LL-45BVXI?
CY62137FV30LL-45BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62137FV30LL-45BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62137FV30LL-45BVXI?
For technical support, including CY62137FV30LL-45BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62137FV30LL-45BVXI requirements.
6.How does Aetrix verify that CY62137FV30LL-45BVXI is sourced from the original manufacturer or authorized distributors?
All CY62137FV30LL-45BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62137FV30LL-45BVXI meets industry standards.
7.What is the process for return or replacement of CY62137FV30LL-45BVXI?
All CY62137FV30LL-45BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62137FV30LL-45BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62137FV30LL-45BVXI part is unused and in its original packaging.
Return procedure for CY62137FV30LL-45BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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