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Infineon Technologies CY62137FV30LL-45BVXI

Part No.:
CY62137FV30LL-45BVXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62137FV30LL-45BVXI.pdf
Description:
IC SRAM 2MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:420

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Product details

Overview

CY62137FV30LL-45BVXI from Cypress Semiconductor is a 2-Mbit (128 K × 16) MoBL® CMOS static RAM with 45 ns access time, 2.2 V–3.6 V supply voltage, and industrial temperature range (–40 °C to +85 °C). It delivers ultra-low active current (1.6 mA at 1 MHz), 1 µA typical standby current, and supports byte-level power-down for portable battery-powered systems including cellular handsets and handheld instrumentation.

For engineers reviewing the CY62137FV30LL-45BVXI datasheet, CY62137FV30LL-45BVXI pinout, CY62137FV30LL-45BVXI application, or CY62137FV30LL-45BVXI equivalent, key selection criteria include 45 ns read cycle time, dual-byte enable (BHE/ BLE) control, automatic power-down on CE or BHE/ BLE deassertion, and Pb-free 48-ball VFBGA packaging compatible with legacy CY62137CV/CV25/CV30/CV33 families.

Technical Context

This SRAM implements a 128K × 16-bit array with full CMOS architecture optimized for low-power, high-speed operation in portable electronics. Its logic block includes independent byte-enable decoding (I/O0–I/O7 via BLE, I/O8–I/O15 via BHE), automatic power-down circuitry triggered by CE HIGH or simultaneous BHE/BLE HIGH, and tristate output control synchronized to OE, CE, and byte enables.

Switching behavior is defined by strict timing parameters: tRC = 45 ns, tDOE = 22 ns, tHZOE ≤ 18 ns, and tPD = 45 ns. Data retention operates down to VCC = 1.5 V with ICCDR ≤ 4 µA, enabling extended battery backup without external refresh.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128 K × 16-bit (2 Mbit); enables single-word 16-bit data transfers without external multiplexing
Access Time (tAA) 45 ns max; guarantees deterministic read latency for real-time microcontroller interfaces
VCC Range 2.2 V–3.6 V; supports direct interfacing with 2.5 V and 3.3 V logic domains
Standby Current (ISB2) ≤ 5 µA (industrial); reduces system quiescent power by >99% during sleep modes
Active Current (ICC) 13 mA max at fmax; enables sustained burst reads at full speed without thermal throttling
Data Retention Voltage 1.5 V min; allows memory state hold during brown-out or battery-swapping events
Package 48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch); supports high-density PCB layouts with fine-pitch routing

Pinout & Package

Package: 48-ball very fine-pitch ball grid array (VFBGA), RoHS-compliant, 6 mm × 8 mm footprint, 0.5 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address inputs 17-bit address bus supporting full 128K-word addressing; A16 enables 256K-word expansion in higher-density variants
I/O0–I/O15 Bidirectional data bus 16-bit parallel interface; split into two 8-bit bytes controlled independently by BLE (I/O0–I/O7) and BHE (I/O8–I/O15)
CE Chip Enable Active LOW global select; forces automatic power-down and high-Z outputs when HIGH
OE Output Enable Active LOW read control; disables outputs (high-Z) when HIGH, independent of CE state
WE Write Enable Active LOW write strobe; initiates write cycles when CE and WE both LOW
BLE / BHE Byte Low / Byte High Enable Independent 8-bit write masking; enables partial-word writes and reduces dynamic power per access
VCC / VSS Power / Ground Dual VCC pins (balls D1, E1) and dual VSS pins (balls F1, G1) minimize IR drop and improve noise immunity
NC No Connect Balls D3, H1, G2, H6, H3 are unconnected; reserved for die size scaling to 4 Mb–64 Mb variants

Key Features

Feature Design Value
MoBL® Ultra-Low Power Architecture 1.6 mA typical active current at 1 MHz and 45 ns speed-enables >100 hr battery life in standby-cycled portable devices
Automatic Power-Down Reduces ICC to ≤5 µA when CE HIGH or both BHE/BLE HIGH-eliminates need for external power-gating logic
Byte-Level Write Control Independent BLE/BHE pins allow 8-bit sub-word writes-cuts bus switching activity and dynamic power by up to 50%
Pb-Free VFBGA Packaging 48-ball, 0.5 mm pitch package meets IPC/JEDEC J-STD-020 moisture sensitivity level 3-supports standard reflow profiles
Pin Compatibility Direct replacement for CY62137CV/CV25/CV30/CV33, CY62137V, and CY62137EV30-enables drop-in upgrade path in existing designs

Applications

Cellular Handset Memory Portable Medical Instrumentation

Use Scenario: Storing real-time sensor buffers and UI state in GSM/UMTS feature phones with tight battery budget.

IC Role / Device Role / Timing Role: Primary working memory for baseband processor; 45 ns access satisfies TDMA frame timing constraints.

Use Value: 1 µA standby current extends talk time by >15% versus prior-generation SRAMs; byte-write capability reduces EMI during partial updates.

Use Scenario: Capturing and staging ECG waveform samples in handheld diagnostic devices operating on coin-cell batteries.

IC Role / Device Role / Timing Role: High-reliability buffer between analog front-end and low-power MCU; data retention at 1.5 V ensures integrity during battery swap.

Use Value: Automatic power-down cuts idle power to <5 µA-enabling >6-month shelf life without recharge; VFBGA footprint saves board space in compact enclosures.

Industrial Handheld Terminals Wearable Fitness Monitors

Use Scenario: Logging barcode scan results and inventory metadata in warehouse scanners subjected to wide ambient temperature swings.

IC Role / Device Role / Timing Role: Non-refresh volatile storage for firmware overlay and transaction logs; industrial –40 °C to +85 °C rating ensures field reliability.

Use Value: 2.2 V–3.6 V operation tolerates Li-ion battery discharge curve; 48-ball VFBGA withstands mechanical shock and thermal cycling.

Use Scenario: Caching accelerometer and heart-rate sensor streams in wrist-worn trackers with aggressive size and weight targets.

IC Role / Device Role / Timing Role: Low-leakage scratchpad memory for motion algorithm preprocessing; MoBL® architecture minimizes self-heating.

Use Value: 10 pF input/output capacitance reduces signal integrity burden on 2-layer flex PCBs; BLE/BHE control enables efficient sensor fusion packet assembly.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV12816BLL-45NLI Same 128K × 16 organization, 45 ns speed, and industrial temp range; 3.3 V only (3.0–3.6 V), no 2.2 V support Lacks byte power-down and automatic standby; requires external logic for deep-sleep entry Select when 3.3 V rail stability is guaranteed and MoBL® ultra-low standby is not required
ON Semiconductor NVSRAM NCS2116M16-45G Non-volatile SRAM with integrated EEPROM backup; 45 ns access but higher ICC (25 mA active), larger 54-pin TSOP package Provides data retention after power loss-eliminates need for external backup battery or capacitor Select when data persistence across power cycles is mandatory, despite higher cost and power

Compared with IS62WV12816BLL-45NLI and NCS2116M16-45G, CY62137FV30LL-45BVXI uniquely balances 2.2 V operation, 1 µA standby, and byte-selectable power-down-making it optimal for battery-constrained portable systems where volatility is acceptable and voltage headroom is limited.

Availability

CY62137FV30LL-45BVXI is available at Aetrix Electronics and suitable for cellular handset memory, portable medical instrumentation, and industrial handheld terminals requiring stable component supply, long-term lifecycle support, and Pb-free compliance.

Supply support for CY62137FV30LL-45BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable solutions for embedded systems.

CY62137FV30 belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power portable electronics where extended battery runtime and small form factor are critical design constraints.

FAQ

What is the minimum VCC required to retain data in CY62137FV30LL-45BVXI?

The device guarantees data retention down to VCC = 1.5 V under industrial conditions, with maximum data retention current (ICCDR) of 4 µA. This allows memory contents to persist during brown-out events or battery replacement without external backup capacitors or non-volatile storage.

How does automatic power-down activate, and what signals trigger it?

Automatic power-down activates when Chip Enable (CE) is HIGH, or when both Byte High Enable (BHE) and Byte Low Enable (BLE) are HIGH. In either condition, the device enters ultra-low-power mode with ICC ≤ 5 µA, and all outputs go high-impedance regardless of OE or WE state.

Can CY62137FV30LL-45BVXI operate reliably at 2.2 V while maintaining 45 ns access time?

Yes-the 45 ns access time specification is fully guaranteed across the entire industrial VCC range (2.2 V–3.6 V). Electrical characteristics tables confirm tAA ≤ 45 ns and tRC ≤ 45 ns at VCC = 2.2 V, with corresponding VOH/VOL levels meeting CMOS interface requirements.

Is the 48-ball VFBGA package compatible with standard reflow soldering processes?

Yes-the package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤ 260 °C). Dual VCC/VSS balls and symmetric layout enhance thermal uniformity and reduce warpage risk during assembly.

CY62137FV30LL-45BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
2Mbit
Memory Organization:
128K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62137FV30LL-45BVXI FAQ

1.How can I place an order for CY62137FV30LL-45BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62137FV30LL-45BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62137FV30LL-45BVXI reliable?

The price and inventory of CY62137FV30LL-45BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62137FV30LL-45BVXI is usually 5 days.

3.What payment methods are accepted for CY62137FV30LL-45BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62137FV30LL-45BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62137FV30LL-45BVXI?

CY62137FV30LL-45BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62137FV30LL-45BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62137FV30LL-45BVXI?

For technical support, including CY62137FV30LL-45BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62137FV30LL-45BVXI requirements.

6.How does Aetrix verify that CY62137FV30LL-45BVXI is sourced from the original manufacturer or authorized distributors?

All CY62137FV30LL-45BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62137FV30LL-45BVXI meets industry standards.

7.What is the process for return or replacement of CY62137FV30LL-45BVXI?

All CY62137FV30LL-45BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62137FV30LL-45BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62137FV30LL-45BVXI part is unused and in its original packaging.

Return procedure for CY62137FV30LL-45BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62137FV30LL-45BVXI Tags

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