Infineon Technologies CY62137FV30LL-45BVXIT
- Part No.:
- CY62137FV30LL-45BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62137FV30LL-45BVXIT.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,417
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Product details
Overview
CY62137FV30LL-45BVXIT from Cypress Semiconductor is a 2-Mbit (128 K × 16) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and industrial temperature rating (–40 °C to +85 °C). It features ultra-low standby current (1 µA typical), byte power-down capability, and automatic power-down when deselected-enabling extended battery life in portable electronics such as cellular handsets and handheld medical devices.
For engineers reviewing the CY62137FV30LL-45BVXIT datasheet, CY62137FV30LL-45BVXIT pinout, CY62137FV30LL-45BVXIT application, or CY62137FV30LL-45BVXIT equivalent, key selection considerations include its 48-ball VFBGA package, dual-byte enable (BHE/BLE) architecture, 128K × 16 organization, MoBL® low-power design, and compatibility with legacy CY62137 series SRAMs.
Technical Context
This SRAM implements a fully static, asynchronous memory array with independent high- and low-byte control via BHE and BLE pins, enabling partial-word writes without external logic. Its CMOS design achieves 1.6 mA typical active current at 1 MHz and supports data retention down to 1.5 V.
The device uses address decoding across A0–A16 (17-bit address bus) and I/O0–I/O15 (16-bit bidirectional data bus), with CE, OE, and WE controlling chip select, output enable, and write enable functions respectively. Power-down is triggered by CE HIGH or simultaneous BHE/BLE HIGH, reducing ICC to ≤5 µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 2 Mbit (128 K × 16) - supports 16-bit wide data paths without external multiplexing |
| Access time | 45 ns - enables direct interface with microcontrollers operating up to ~12 MHz bus frequency |
| Supply voltage | 2.2 V–3.6 V - compatible with single-supply 2.5 V or 3.3 V systems and mixed-voltage designs |
| Standby current | 1 µA typical / 5 µA max (industrial) - critical for battery-powered sleep modes |
| Active current | 1.6 mA typical at 1 MHz - balances speed and power for portable real-time buffering |
| Data retention voltage | 1.5 V minimum - allows graceful low-power suspend-to-RAM operation during brownout |
| Operating temperature | –40 °C to +85 °C - qualified for industrial-grade embedded control and communications equipment |
Pinout & Package
Package: 48-ball VFBGA (Very Fine-Pitch Ball Grid Array), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 128K-word addressing; no address latching required |
| I/O0–I/O7 | Low-byte bidirectional data | Controlled by BLE; enables 8-bit partial writes/reads without disturbing high byte |
| I/O8–I/O15 | High-byte bidirectional data | Controlled by BHE; supports independent high-byte access in 16-bit systems |
| CE | Chip enable | Active-low global enable; forces standby mode and high-Z outputs when HIGH |
| OE | Output enable | Active-low read control; disables outputs (high-Z) when HIGH during read cycles |
| WE | Write enable | Active-low write strobe; initiates write when CE and WE both LOW |
| BHE | Byte high enable | Active-low control for I/O8–I/O15; must be LOW for high-byte write/read |
| BLE | Byte low enable | Active-low control for I/O0–I/O7; must be LOW for low-byte write/read |
| VCC | Power supply | Two dedicated VCC balls (pins D1, G1) reduce IR drop and improve noise immunity |
| VSS | Ground | Three dedicated VSS balls (pins E1, F1, H2) enhance grounding integrity and signal return path |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® ultra-low power architecture | Reduces standby current to 1 µA typical-extends battery runtime in always-on portable devices |
| Dual byte enable (BHE/BLE) | Enables independent 8-bit access to upper/lower data bytes without external gating logic |
| Automatic power-down mode | Enters sub-5 µA standby automatically when CE HIGH or both BHE/BLE HIGH-no software overhead |
| Pb-free 48-ball VFBGA package | 6 mm × 8 mm footprint with 0.5 mm pitch-supports high-density PCB layouts and thermal management |
| Pin compatibility with CY62137CV/CV25/CV30/CV33, CY62137V, CY62137EV30 | Allows drop-in replacement in existing designs using earlier 2-Mbit SRAM variants |
Applications
| Cellular Handset Memory Buffer | Portable Medical Monitor Data Cache |
|---|---|
Use Scenario: Stores real-time sensor data and UI frame buffers in GSM/UMTS handsets during active call or idle mode. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer interfacing directly with baseband processor's 16-bit data bus and address lines. Use Value: 45 ns access time meets processor wait-state requirements; 1 µA standby current extends talk time by >12% versus standard SRAMs. | Use Scenario: Caches ECG waveform samples and configuration parameters in battery-powered patient monitors. IC Role / Device Role / Timing Role: Nonvolatile-critical fast-access memory holding live acquisition data between MCU processing bursts. Use Value: Byte-enable capability allows efficient 8-bit peripheral register updates without disturbing cached waveform data in adjacent bytes. |
| Industrial PLC I/O Mapping RAM | Wearable Fitness Tracker Sensor Hub |
Use Scenario: Holds mapped I/O status and control registers in compact programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Static RAM providing deterministic read/write latency for real-time I/O scanning cycles. Use Value: Industrial temperature rating (–40 °C to +85 °C) ensures reliable operation in uncontrolled cabinet environments; 2.2–3.6 V range accommodates aging DC-DC outputs. | Use Scenario: Buffers accelerometer, gyroscope, and heart-rate sensor streams before compression and Bluetooth transmission. IC Role / Device Role / Timing Role: Low-leakage SRAM acting as temporary FIFO between sensor hub MCU and wireless transceiver. Use Value: Automatic power-down reduces average system current by 87% during motion-sensing idle intervals-extending charge cycle by 3.2 days. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-10TLI | 10 ns access time, 3.3 V only (3.0–3.6 V), 44-pin TSOP II package | Higher speed but narrower voltage range; lacks byte power-down and automatic standby | Select when system requires <10 ns timing and uses fixed 3.3 V rail; avoid if battery voltage varies below 3.0 V |
| AS6C4008-55TIN | 55 ns access time, 2.7–3.6 V, 44-pin TSOP II, 4-Mbit (256K × 16) | Slower but higher density; no BHE/BLE support-requires external byte masking logic | Choose for cost-sensitive designs needing >2 Mbit capacity and where 55 ns latency is acceptable |
Compared with IS61LV25616AL-10TLI and AS6C4008-55TIN, the CY62137FV30LL-45BVXIT uniquely delivers 45 ns speed with 2.2 V minimum operation, integrated byte control, and sub-5 µA industrial standby-making it optimal for energy-constrained, voltage-flexible portable systems requiring deterministic 16-bit access.
Availability
CY62137FV30LL-45BVXIT is available at Aetrix Electronics and suitable for cellular handset memory buffers, portable medical monitor data caches, and industrial PLC I/O mapping requiring stable component supply across long-lifecycle embedded programs.
Supply support for CY62137FV30LL-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power semiconductor solutions for embedded systems, IoT, and automotive applications.
The CY62137FV30 belongs to the MoBL® (More Battery Life™) SRAM product line-engineered specifically for portable electronics demanding ultra-low standby current, wide voltage operation, and seamless integration with battery-powered microcontrollers.
FAQ
What is the minimum VCC required to retain data in CY62137FV30LL-45BVXIT?
The device guarantees data retention down to 1.5 V VCC, as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤4 µA under industrial conditions. This allows safe suspend-to-RAM operation during brownout events without external backup capacitors or nonvolatile storage.
Does CY62137FV30LL-45BVXIT require external pull-up resistors on BHE and BLE pins?
No-BHE and BLE are CMOS-compatible inputs with no internal pull-ups. However, to meet ISB1/ISB2 standby current specifications, they must be actively driven to valid CMOS logic levels (≤0.2 V for LOW, ≥VCC–0.2 V for HIGH); floating states increase leakage and violate datasheet limits.
Can CY62137FV30LL-45BVXIT operate reliably at 2.2 V with 45 ns access time?
Yes-the 45 ns access time is fully characterized and guaranteed over the entire industrial voltage range (2.2 V–3.6 V). The Electrical Characteristics table explicitly lists tAA, tACE, and tRC parameters with min/max values confirmed at 2.2 V, ensuring timing compliance in low-voltage battery-depleted conditions.
How does the automatic power-down feature activate in CY62137FV30LL-45BVXIT?
Automatic power-down activates when either CE is HIGH or both BHE and BLE are HIGH. In this state, internal circuitry reduces ICC to ≤5 µA while placing all I/Os in high-impedance. No clock or control sequence is needed-the transition occurs synchronously with input level changes, eliminating firmware intervention.
CY62137FV30LL-45BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62137FV30LL-45BVXIT FAQ
1.How can I place an order for CY62137FV30LL-45BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62137FV30LL-45BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62137FV30LL-45BVXIT reliable?
The price and inventory of CY62137FV30LL-45BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62137FV30LL-45BVXIT is usually 5 days.
3.What payment methods are accepted for CY62137FV30LL-45BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62137FV30LL-45BVXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62137FV30LL-45BVXIT?
CY62137FV30LL-45BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62137FV30LL-45BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62137FV30LL-45BVXIT?
For technical support, including CY62137FV30LL-45BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62137FV30LL-45BVXIT requirements.
6.How does Aetrix verify that CY62137FV30LL-45BVXIT is sourced from the original manufacturer or authorized distributors?
All CY62137FV30LL-45BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62137FV30LL-45BVXIT meets industry standards.
7.What is the process for return or replacement of CY62137FV30LL-45BVXIT?
All CY62137FV30LL-45BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62137FV30LL-45BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62137FV30LL-45BVXIT part is unused and in its original packaging.
Return procedure for CY62137FV30LL-45BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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