Infineon Technologies CY62137FV30LL-45ZSXA
- Part No.:
- CY62137FV30LL-45ZSXA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62137FV30LL-45ZSXA.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62137FV30LL-45ZSXA from Cypress Semiconductor is a 2-Mbit (128 K × 16) MoBL® Automotive CMOS static RAM with 45 ns access time, 2.2 V–3.6 V supply voltage, and –40 °C to +85 °C operating range (Automotive-A grade). It features byte power down, automatic power-down on deselect, and ultra-low standby current (1 µA typical). Used in automotive infotainment head units for temporary display buffer storage.
For engineers reviewing the CY62137FV30LL-45ZSXA datasheet, CY62137FV30LL-45ZSXA pinout, CY62137FV30LL-45ZSXA application, or CY62137FV30LL-45ZSXA equivalent, key selection criteria include automotive temperature compliance, 16-bit bus interface timing, low-voltage standby current, and TSOP II package compatibility with legacy CY62137 family designs.
Technical Context
This SRAM implements a full CMOS architecture with independent byte enable (BHE/BLE) control, enabling selective 8-bit writes to upper or lower data bytes without affecting adjacent memory locations. Its automatic power-down logic activates when CE is HIGH or both BHE and BLE are HIGH, reducing ICC to ≤5 µA.
The device supports three distinct operational modes: active read (CE/OE LOW, WE HIGH), active write (CE/WE LOW, BHE or BLE LOW), and standby (CE HIGH or BHE/BLE HIGH), with guaranteed 45 ns tRC and 22 ns tDOE at VCC = 3.0 V and TA = 25 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 2 Mbit (128 K × 16) - provides 16-bit parallel data bus interface with 128K addressable words |
| Access time | 45 ns - guarantees maximum read latency under Automotive-A conditions (–40 °C to +85 °C, VCC = 2.2–3.6 V) |
| Supply voltage | 2.2 V–3.6 V - enables direct interfacing with 2.5 V and 3.3 V microcontrollers without level shifters |
| Standby current | 1 µA typical / 5 µA max (Automotive-A) - reduces battery drain during vehicle sleep mode |
| Operating temperature | –40 °C to +85 °C - qualified per AEC-Q100 Grade 2 for under-hood and cabin-mounted ECUs |
| Package | 44-pin TSOP II - surface-mount footprint compatible with automated SMT assembly and legacy CY62137 pinouts |
| Byte write control | BHE/BLE inputs - allow independent 8-bit writes to I/O8–I/O15 or I/O0–I/O7 without read-modify-write cycles |
Pinout & Package
44-pin Thin Small Outline Package (TSOP II), 400 mil body width, 0.8 mm pitch, JEDEC MO-141AC compliant. Pin 1 index marked by notch or dot; pins 1–22 on top row, 23–44 on bottom row.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting 128K word addressing (217 = 131,072 locations) |
| I/O0–I/O7 | Data bus (lower byte) | Bi-directional 8-bit data path enabled when BLE = LOW during read/write |
| I/O8–I/O15 | Data bus (upper byte) | Bi-directional 8-bit data path enabled when BHE = LOW during read/write |
| CE | Chip enable | Active-LOW global select; forces standby mode and high-Z outputs when HIGH |
| OE | Output enable | Active-LOW control for output drivers; does not affect write operations |
| WE | Write enable | Active-LOW signal initiating write cycle; must be LOW with CE and BHE/BLE to store data |
| BHE | Byte high enable | Active-LOW control for upper data byte (I/O8–I/O15); used with BLE for full 16-bit access |
| BLE | Byte low enable | Active-LOW control for lower data byte (I/O0–I/O7); enables partial writes without disturbing upper byte |
| VCC | Power supply | Two dedicated pins (pins 31, 32) reduce IR drop and improve noise immunity on 2.2–3.6 V rail |
| VSS | Ground | Two dedicated pins (pins 35, 36) provide low-inductance return paths for I/O and core logic |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® low-power architecture | Reduces active ICC to 1.6 mA at 1 MHz and standby ISB to 1 µA typical, extending battery life in always-on modules |
| Automotive-A qualification | Validated across –40 °C to +85 °C with full AC/DC parametric testing per AEC-Q100 requirements |
| Pin-compatible upgrade path | Direct replacement for CY62137CV/CV25/CV30/CV33, CY62137V, and CY62137EV30 in existing TSOP II layouts |
| Byte-selective write capability | Enables efficient 8-bit updates to display buffers or CAN message queues without full-word read-modify-write overhead |
| Automatic power-down on deselect | Reduces power consumption by >99% when CE HIGH or both BHE/BLE HIGH, eliminating external power-gating circuitry |
Applications
| Automotive Instrument Cluster | ADAS Camera Buffer Memory |
|---|---|
|
Use Scenario: Stores real-time rendered gauge graphics and warning icons for digital instrument clusters with 60 Hz refresh rate. IC Role / Device Role / Timing Role: High-speed parallel SRAM providing zero-latency pixel data access to GPU or display controller. Use Value: 45 ns tAA ensures full 1280×480 frame buffer reads complete within 16.7 ms, meeting strict timing budgets for safety-critical displays. |
Use Scenario: Buffers uncompressed 12-bit RAW image frames from 1.3 MP automotive camera sensors before JPEG compression. IC Role / Device Role / Timing Role: Dual-port-capable SRAM supporting simultaneous sensor write and processor read via byte-enable isolation. Use Value: Independent BHE/BLE control allows concurrent 8-bit writes from sensor interface and 8-bit reads to DSP, avoiding FIFO bottlenecks. |
| Infotainment Head Unit UI Cache | Telematics Control Unit Log Buffer |
|
Use Scenario: Caches frequently accessed UI assets (fonts, icons, menu trees) in Android-based automotive head units. IC Role / Device Role / Timing Role: Low-voltage SRAM interfaced directly to ARM Cortex-A53 application processor's 16-bit external bus interface. Use Value: 2.2 V minimum VCC supports operation during cold-cranking events where battery dips to 6 V, maintaining UI responsiveness. |
Use Scenario: Stores diagnostic trouble codes (DTCs), GPS position logs, and cellular handover history in LTE-connected TCUs. IC Role / Device Role / Timing Role: Nonvolatile backup memory supplementing flash, retaining critical logs during ignition-off periods. Use Value: 1 µA typical ISB enables >10-year data retention on coin-cell backup, exceeding ISO 16750-2 long-term storage requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV12816BLL-45NLI | 45 ns access, same 128K × 16 organization, but rated –40 °C to +85 °C only (no Automotive-E option); 3.3 V only (3.135–3.465 V) | Lacks dual-voltage support and AEC-Q100 Grade 2 certification; suitable for non-safety-critical cabin modules only | Select if system uses fixed 3.3 V rail and does not require extended temperature validation or automotive qualification documentation |
| AS6C1008-45TIN | 45 ns access, 128K × 8 organization; requires two devices for 16-bit bus; 2.7–3.6 V supply; –40 °C to +85 °C | Doubles PCB area and routing complexity; no byte-enable architecture - full 8-bit writes only | Choose only if legacy design already uses AS6C1008 and board space allows dual-SRAM layout with shared address/control lines |
Compared with IS62WV12816BLL-45NLI and AS6C1008-45TIN, CY62137FV30LL-45ZSXA uniquely delivers automotive-grade reliability, 2.2–3.6 V flexibility, and true 16-bit byte-select capability in a single TSOP II package-reducing BOM count and qualification effort for new ECU designs.
Availability
CY62137FV30LL-45ZSXA is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS camera subsystems, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for CY62137FV30LL-45ZSXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications.
CY62137FV30 belongs to the MoBL® Automotive SRAM product line, engineered specifically for low-power, high-reliability data buffering in automotive electronic control units operating across extreme temperature ranges.
FAQ
What is the maximum clock frequency supported by CY62137FV30LL-45ZSXA?
CY62137FV30LL-45ZSXA is an asynchronous SRAM and does not use a clock signal. Its maximum operational speed is defined by access time: 45 ns read cycle time (tRC) and 45 ns write cycle time (tWC) under Automotive-A conditions. System timing depends on external controller's ability to meet setup/hold requirements relative to CE, OE, WE, and address transitions-not a clock frequency.
Does CY62137FV30LL-45ZSXA support data retention at 1.5 V?
Yes. The device guarantees data retention at VCC ≥ 1.5 V with ICCDR ≤ 4 µA (Automotive-A grade). This enables use with supercapacitor or coin-cell backup during main power loss, maintaining stored configuration or fault logs for up to 10 years when combined with its 1 µA typical standby current.
Can CY62137FV30LL-45ZSXA operate reliably during automotive cold-cranking?
Yes. With a minimum operating voltage of 2.2 V and validated operation down to –40 °C, it meets ISO 16750-2 cold-cranking profiles where battery voltage may dip to 6 V (≈2.2 V at 3.3 V regulator output). Its 45 ns timing remains guaranteed across the full –40 °C to +85 °C range without derating.
Is the TSOP II package of CY62137FV30LL-45ZSXA RoHS and AEC-Q100 compliant?
Yes. The CY62137FV30LL-45ZSXA carries full AEC-Q100 Grade 2 qualification (–40 °C to +85 °C) and is RoHS-compliant (lead-free, halogen-free). The TSOP II package uses matte tin lead finish and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3), requiring bake prior to reflow if exposed >168 hours at <30 °C/60% RH.
CY62137FV30LL-45ZSXA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62137FV30LL-45ZSXA FAQ
1.How can I place an order for CY62137FV30LL-45ZSXA through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62137FV30LL-45ZSXA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62137FV30LL-45ZSXA reliable?
The price and inventory of CY62137FV30LL-45ZSXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62137FV30LL-45ZSXA is usually 5 days.
3.What payment methods are accepted for CY62137FV30LL-45ZSXA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62137FV30LL-45ZSXA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62137FV30LL-45ZSXA?
CY62137FV30LL-45ZSXA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62137FV30LL-45ZSXA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62137FV30LL-45ZSXA?
For technical support, including CY62137FV30LL-45ZSXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62137FV30LL-45ZSXA requirements.
6.How does Aetrix verify that CY62137FV30LL-45ZSXA is sourced from the original manufacturer or authorized distributors?
All CY62137FV30LL-45ZSXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62137FV30LL-45ZSXA meets industry standards.
7.What is the process for return or replacement of CY62137FV30LL-45ZSXA?
All CY62137FV30LL-45ZSXA units undergo pre-shipment inspection (PSI). If there is an issue with CY62137FV30LL-45ZSXA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62137FV30LL-45ZSXA part is unused and in its original packaging.
Return procedure for CY62137FV30LL-45ZSXA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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