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Infineon Technologies CY62137VLL-70ZSXET

Part No.:
CY62137VLL-70ZSXET
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62137VLL-70ZSXET.pdf
Description:
IC SRAM 2MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,495

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Product details

Overview

CY62137VLL-70ZSXET from Cypress Semiconductor is a 2-Mbit (128K × 16) CMOS static RAM with 55 ns/70 ns access time, operating across 2.7–3.6 V and supporting industrial (–40°C to +85°C) and automotive (–40°C to +125°C) temperature ranges. It features byte-level write control via BHE/BLE, automatic CE-driven power-down reducing standby current to 1 µA, and TTL-compatible I/O for seamless integration into memory subsystems of portable telecom and embedded controllers.

For engineers reviewing the CY62137VLL-70ZSXET datasheet, CY62137VLL-70ZSXET pinout, CY62137VLL-70ZSXET application, or CY62137VLL-70ZSXET equivalent, key selection criteria include its 70 ns read cycle time, 1 µA ISB2 standby current at 3.6 V, dual-byte enable architecture, and TSOP II (44-pin) package compatibility with space-constrained PCB layouts.

Technical Context

The CY62137VLL-70ZSXET implements a fully decoded 128K × 16 SRAM array with independent high- and low-byte write enables (BHE/BLE), enabling partial-word writes without external logic. Its power-down circuitry activates automatically when CE is HIGH or during address inactivity, achieving >99% current reduction versus active mode.

It supports three distinct read modes (address-, OE-, and BHE/BLE-controlled) and four write modes (WE-, CE-, WE+OE-, and BHE/BLE+OE-controlled), all defined by precise timing windows including tACE ≤ 70 ns, tDOE ≤ 35 ns, and tHZOE ≤ 25 ns under 30 pF load. All I/O pins enter high-impedance state during deselection, output disable, or write cycles.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 2 Mbit (128K words × 16 bits); supports full parallel data bus interface without multiplexing.
Access Time 70 ns max read cycle time; ensures compatibility with 14 MHz bus clocks in legacy microcontroller systems.
VCC Range 2.7 V to 3.6 V; matches Li-ion battery discharge profile and eliminates need for external LDO in portable designs.
Standby Current 1 µA typical (ISB2, industrial grade); enables multi-year battery life in always-on memory retention applications.
Operating Temp –40°C to +85°C (industrial); validated for use in base station control cards and industrial HMIs without derating.
Package 44-pin TSOP Type II (10.16 mm × 18.42 mm); surface-mount compatible with standard reflow profiles and IPC-7351B land patterns.
Input Capacitance 6 pF max (CIN); minimizes signal integrity impact on high-speed address/data buses.

Pinout & Package

Package: 44-pin Thin Small Outline Package (TSOP Type II), forward pinout orientation, lead-free (Pb-free) compliant per RoHS.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address Input 17-bit address bus supporting full 128K-word addressing; no internal latching required.
I/O0–I/O7 Data I/O (Low Byte) Bi-directional 8-bit data path enabled only when BLE = LOW; tri-stated otherwise.
I/O8–I/O15 Data I/O (High Byte) Bi-directional 8-bit data path enabled only when BHE = LOW; independent of low-byte control.
CE Chip Enable Active-low chip select; drives automatic power-down when HIGH, placing all outputs in high-Z state.
OE Output Enable Active-low control for output drivers; HIGH forces I/O pins into high-impedance input mode.
WE Write Enable Active-low write strobe; initiates write when CE and WE both LOW; defines write cycle timing reference.
BHE / BLE Byte High/Low Enable Independent active-low controls for high- and low-byte write/read; enables 8-bit sub-word access.
VCC / VSS Power / Ground Dual VCC (pins 11, 33) and dual VSS (pins 12, 34) reduce IR drop and improve noise immunity.
NC No Connect Pins 23 and 41 are unconnected to die; must be left floating or tied to ground per layout best practice.

Key Features

Feature Design Value
MoBL® Ultra-Low Power 1 µA typical standby current (ISB2) at 3.6 V and 25°C - extends battery life in handheld medical monitors.
Byte-Selectable Write Independent BHE/BLE inputs allow simultaneous or staggered 8-bit writes without external byte-masking logic.
Automatic Power-Down Hardware-triggered current reduction (>99%) upon CE deassertion or address stability - no software intervention needed.
TTL-Compatible I/O VIL ≤ 0.8 V, VOH ≥ 2.4 V at VCC = 2.7 V - interoperable with legacy 3.3 V and mixed-voltage microcontrollers.
Industrial & Automotive Grades Qualified per AEC-Q100 (automotive) and extended temp industrial spec - suitable for under-hood ECUs and factory automation PLCs.

Applications

Cellular Baseband Memory Industrial HMI Buffer

Use Scenario: Stores firmware patches and real-time voice codec buffers in 2G/3G cellular modems operating on single-cell Li-ion supply.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding critical boot code and DSP parameter tables; accessed at 14 MHz burst rate.

Use Value: 70 ns access time meets modem baseband processor timing budget; 1 µA ISB2 enables >5-year shelf life in powered-off state.

Use Scenario: Acts as display frame buffer and command queue in panel-mounted HMIs used in CNC machine tool control cabinets.

IC Role / Device Role / Timing Role: Parallel-access scratchpad memory interfaced to ARM9-based controller; supports dual-port-like operation via BHE/BLE.

Use Value: TSOP II footprint allows dense stacking with FPGA and LCD driver ICs; –40°C to +85°C rating ensures reliability in uncooled enclosures.

Automotive Telematics ECU Medical Infusion Pump Log Storage

Use Scenario: Holds GPS position history and diagnostic trouble codes (DTCs) in vehicle telematics modules deployed across global temperature zones.

IC Role / Device Role / Timing Role: Automotive-grade SRAM retaining volatile log data during ignition cycles; powered from always-on 3.3 V rail.

Use Value: AEC-Q100 qualified operation up to +125°C ambient enables placement near engine bay electronics; 2.7 V min VCC supports cold-crank brownout conditions.

Use Scenario: Stores drug delivery audit trails and calibration logs in Class II infusion pumps requiring FDA 21 CFR Part 11 compliance.

IC Role / Device Role / Timing Role: Secure, non-volatile buffer for time-stamped therapy events; retains data during AC power loss using backup capacitor.

Use Value: Data retention down to 1.0 V VCC enables >24-hour hold-up time with 100 µF capacitor; low leakage (<7.5 µA) prevents premature discharge.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV12816BLL-70NLI Same density, speed, and TSOP II package; 1.5 µA ISB2 (vs. 1 µA), wider VCC range (2.5–3.6 V). Higher standby current reduces battery life margin in ultra-low-power portable devices. Select when broader voltage tolerance is prioritized over minimal ISB2.
Renesas R1LV0216R-70JL 70 ns speed, same 128K × 16 organization; requires external pull-ups on BHE/BLE; no automotive qualification. Lacks AEC-Q100 certification and automatic power-down - unsuitable for automotive or safety-critical logging. Choose only for cost-sensitive industrial control where automotive compliance is not required.

Compared with IS62WV12816BLL-70NLI and R1LV0216R-70JL, the CY62137VLL-70ZSXET delivers lower standby current, integrated power-down logic, and automotive qualification - making it optimal for battery-powered and mission-critical embedded systems where reliability and energy efficiency are co-prioritized.

Availability

CY62137VLL-70ZSXET is available at Aetrix Electronics and suitable for cellular modem design, industrial HMI development, and automotive telematics ECU production requiring stable component supply across extended temperature ranges and long lifecycle support.

Supply support for CY62137VLL-70ZSXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip (PSoC), memory, and USB-C solutions for industrial, automotive, and consumer markets.

The CY62137V series belongs to Cypress's MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power portable electronics where extended battery runtime and rapid wake-from-standby are essential design requirements.

FAQ

What is the minimum VCC required to retain data in CY62137VLL-70ZSXET?

Data retention is guaranteed down to VCC = 1.0 V, with typical retention current ICCDR of 0.5 µA (industrial) and 10 µA (automotive) at that voltage. This enables use with small backup capacitors in power-fail scenarios, supporting >24-hour hold-up time in medical and industrial logging applications.

Does CY62137VLL-70ZSXET require external pull-up resistors on BHE/BLE pins?

No. BHE and BLE are CMOS-compatible active-low inputs with no internal pull-ups; however, they must be driven actively to VCC or GND in normal operation. Leaving them floating is prohibited - external pull-up or pull-down is required only in reset/hardware initialization states per system design.

Can CY62137VLL-70ZSXET operate reliably at 3.6 V and +85°C continuously?

Yes. The industrial-grade CY62137VLL-70ZSXET is fully characterized and guaranteed for continuous operation at VCC = 3.6 V and TA = +85°C, with ICC ≤ 20 mA (max) and tRC ≤ 70 ns. Thermal resistance ΘJA = 60 °C/W ensures junction temperature remains within safe limits on standard 2-layer PCBs.

How does the automatic power-down feature activate without software control?

Power-down activates autonomously when CE is HIGH or when address lines remain stable for >100 ns (per internal timer). No firmware or external logic is needed - the internal circuit monitors CE state and address transitions, reducing ICC to ISB2 levels within 70 ns (tPD) after CE goes HIGH.

CY62137VLL-70ZSXET Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
2Mbit
Memory Organization:
128K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
70ns
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62137VLL-70ZSXET FAQ

1.How can I place an order for CY62137VLL-70ZSXET through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62137VLL-70ZSXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62137VLL-70ZSXET reliable?

The price and inventory of CY62137VLL-70ZSXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62137VLL-70ZSXET is usually 5 days.

3.What payment methods are accepted for CY62137VLL-70ZSXET?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62137VLL-70ZSXET transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62137VLL-70ZSXET?

CY62137VLL-70ZSXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62137VLL-70ZSXET order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62137VLL-70ZSXET?

For technical support, including CY62137VLL-70ZSXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62137VLL-70ZSXET requirements.

6.How does Aetrix verify that CY62137VLL-70ZSXET is sourced from the original manufacturer or authorized distributors?

All CY62137VLL-70ZSXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62137VLL-70ZSXET meets industry standards.

7.What is the process for return or replacement of CY62137VLL-70ZSXET?

All CY62137VLL-70ZSXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62137VLL-70ZSXET, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62137VLL-70ZSXET part is unused and in its original packaging.

Return procedure for CY62137VLL-70ZSXET:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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