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Infineon Technologies CY62138FV30LL-45ZAXAT

Part No.:
CY62138FV30LL-45ZAXAT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
32-TFSOP (0.465", 11.80mm Width)
Datasheet:
AetrixCY62138FV30LL-45ZAXAT.pdf
Description:
IC SRAM 2MBIT PARALLEL 32STSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,820

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Product details

Overview

CY62138FV30LL-45ZAXAT from Cypress Semiconductor is a 2-Mbit (256 K × 8) MoBL® CMOS static RAM optimized for low-power portable systems. It delivers 45 ns access time, operates across 2.2 V–3.6 V supply, and draws only 1.6 mA typical active current at 1 MHz - enabling extended battery life in handheld devices such as cellular telephones and medical wearables.

For engineers reviewing the CY62138FV30LL-45ZAXAT datasheet, CY62138FV30LL-45ZAXAT pinout, CY62138FV30LL-45ZAXAT application, or CY62138FV30LL-45ZAXAT equivalent, key selection criteria include ultra-low standby current (≤5 µA), dual chip enable architecture (CE1/CE2), automatic power-down on deselect, and compatibility with 36-ball VFBGA and 32-pin TSOP II packages.

Technical Context

The CY62138FV30LL-45ZAXAT implements a synchronous, non-volatile-retentive SRAM core with complementary metal oxide semiconductor (CMOS) process technology. Its dual CE architecture enables hierarchical memory banking and seamless expansion across multiple devices without external logic.

It supports three distinct operational states: active read/write (CE1 LOW & CE2 HIGH), high-impedance tri-state output (OE HIGH or CE deselected), and automatic power-down (CE1 HIGH or CE2 LOW), with guaranteed data retention down to 1.5 V and ≤4 µA ICCDR current.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 256 K × 8 = 2 Mbit; supports byte-wide data bus interface without address multiplexing
Access Time 45 ns max; ensures timing compliance in 22 MHz synchronous bus systems
VCC Range 2.2 V to 3.6 V; compatible with single-supply Li-ion/Li-poly battery rails and regulated 3.3 V domains
Active Current 1.6 mA typical at 1 MHz; reduces thermal load and extends runtime in always-on subsystems
Standby Current ≤5 µA max; enables multi-week sleep mode in battery-backed real-time clocks and sensor buffers
Data Retention VCC 1.5 V min; maintains stored contents during brown-out or backup-battery operation
Operating Temp –40 °C to +85 °C; qualified for industrial and automotive-A environments

Pinout & Package

Package: 36-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 0.5 mm pitch, 6 mm × 8 mm footprint, RoHS-compliant Pb-free finish.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256 K-word decoding; no internal latching
I/O0–I/O7 Bidirectional Data I/O 8-bit tri-state data bus; high-impedance when CE1 HIGH, CE2 LOW, or OE HIGH
CE1, CE2 Chip Enable Controls Complementary CE pair: device enabled only when CE1 = LOW AND CE2 = HIGH; enables bank isolation
WE Write Enable Active-LOW write strobe; initiates write cycle when CE1/CE2 active and WE transitions LOW
OE Output Enable Active-LOW control for output buffer; overrides WE state during read operations
VCC, VSS Power Supply Single 2.2–3.6 V supply; decoupling required per ball map; VSS = ground reference
NC No Connect Two NC balls (A17, A16); not bonded on die; must be left unconnected or grounded per layout guidelines

Key Features

Feature Design Value
MoBL® Ultra-Low Power Architecture 1.6 mA active current at 1 MHz and ≤5 µA standby current reduce system-level power budget by >90% vs. legacy SRAMs
Dual Chip Enable (CE1/CE2) Enables hierarchical memory mapping and eliminates need for external address decoders in multi-SRAM systems
Automatic Power-Down on Deselect Device enters sub-5 µA standby automatically when CE1 HIGH or CE2 LOW - no software or external control required
Wide Voltage Operation (2.2–3.6 V) Supports direct connection to single-cell Li-ion batteries (2.7–4.2 V) with integrated LDO or buck converter output
Pb-Free VFBGA & TSOP II Packaging 36-ball VFBGA (6 × 8 mm) offers 40% board area reduction vs. 32-pin TSOP II; both packages support automated reflow

Applications

Portable Medical Sensors Industrial HMI Buffers

Use Scenario: Continuous acquisition of ECG/PPG waveforms in wearable patch monitors with intermittent BLE transmission.

IC Role / Device Role / Timing Role: High-speed, low-leakage SRAM buffer storing raw sensor samples between wireless bursts.

Use Value: 1.6 mA active current and 5 µA standby extend battery life beyond 7 days on a 120 mAh coin cell.

Use Scenario: Local display refresh memory in panel-mounted PLC HMIs operating in factory environments.

IC Role / Device Role / Timing Role: Nonvolatile-cached frame buffer holding GUI assets and status variables during UI redraw cycles.

Use Value: 45 ns access time ensures flicker-free 60 Hz screen updates; –40 °C to +85 °C rating guarantees reliability in uncontrolled enclosures.

Automotive Telematics Loggers IoT Edge Node Event Queues

Use Scenario: Crash-event pre-buffering in OBD-II dongles capturing CAN bus diagnostics prior to ignition-off.

IC Role / Device Role / Timing Role: Battery-backed SRAM retaining last 30 seconds of vehicle bus traffic during power loss.

Use Value: Data retention down to 1.5 V allows safe capture even during rapid VCC collapse; automotive-A qualification ensures AEC-Q100 alignment.

Use Scenario: Intermittent environmental sensing nodes aggregating temperature/humidity data before LPWAN transmission.

IC Role / Device Role / Timing Role: Low-power scratchpad memory staging sensor readings and metadata before RF payload assembly.

Use Value: Dual CE architecture permits dynamic partitioning between sensor input and radio transmit buffers - reducing external logic count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV2568BLL-45NLI Same 256K × 8 organization, 45 ns speed, but uses single CE and lacks CE2; standby current 10 µA max Requires redesign of CE logic; unsuitable for hierarchical banking; higher leakage limits battery runtime Select only if board space constraints prohibit dual-CE routing and 5 µA standby is not required
Renesas R1LV256A-45L-FB Identical 256K × 8, 45 ns, and 2.2–3.6 V range; includes built-in write protect (WP) pin; standby current 3 µA max WP pin adds hardware-level write protection for firmware storage; slightly tighter thermal resistance (θJA = 36.2 °C/W) Preferred for safety-critical logging where accidental writes must be prevented; requires WP signal routing

Compared with IS62WV2568BLL-45NLI and R1LV256A-45L-FB, the CY62138FV30LL-45ZAXAT uniquely combines dual CE control, 5 µA max standby, and automotive-A qualification - making it optimal for battery-constrained, expandable memory systems requiring robust power management.

Availability

CY62138FV30LL-45ZAXAT is available at Aetrix Electronics and suitable for portable medical sensors, industrial HMI buffers, and automotive telematics loggers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY62138FV30LL-45ZAXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and consumer applications, with emphasis on low-power innovation and signal integrity.

The CY62138FV30 belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for energy-constrained portable electronics where nanowatt-scale standby and milliamp-level active current directly determine usable runtime.

FAQ

What is the minimum VCC required to retain data in CY62138FV30LL-45ZAXAT?

The device guarantees data retention down to VCC = 1.5 V, as specified in the Data Retention Characteristics table (page 6). At this voltage, ICCDR remains ≤4 µA under industrial/automotive-A conditions. Retention time is indefinite as long as VCC ≥ 1.5 V and ambient temperature stays within –40 °C to +85 °C - no external capacitor or backup source is needed.

Can CY62138FV30LL-45ZAXAT operate with CE1 and CE2 tied together?

No - CE1 and CE2 must be driven with complementary logic: CE1 LOW and CE2 HIGH to enable the device. Tying them together violates the functional truth table and forces the device into permanent standby (ISB2 mode), preventing read/write access. The dual CE architecture is intentional for memory banking and cannot be shorted.

Is the 36-ball VFBGA package of CY62138FV30LL-45ZAXAT compatible with standard reflow profiles?

Yes - the Pb-free VFBGA package is qualified for IPC/JEDEC J-STD-020D-compliant reflow, including peak temperatures up to 260 °C for ≤60 seconds. Thermal resistance data (θJA = 38.49 °C/W) confirms suitability for standard two-layer PCBs with appropriate thermal vias under the VFBGA pad array.

Does CY62138FV30LL-45ZAXAT require an external clock or timing controller?

No - it is an asynchronous SRAM with no clock input. All timing is governed by CE1, CE2, OE, and WE edge transitions relative to address and data setup/hold windows (e.g., tAA = 45 ns, tSD = 25 ns). System timing is controlled entirely by the host processor's bus interface logic.

CY62138FV30LL-45ZAXAT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
32-TFSOP (0.465", 11.80mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
2Mbit
Memory Organization:
256K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-sTSOP

CY62138FV30LL-45ZAXAT FAQ

1.How can I place an order for CY62138FV30LL-45ZAXAT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62138FV30LL-45ZAXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62138FV30LL-45ZAXAT reliable?

The price and inventory of CY62138FV30LL-45ZAXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62138FV30LL-45ZAXAT is usually 5 days.

3.What payment methods are accepted for CY62138FV30LL-45ZAXAT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62138FV30LL-45ZAXAT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62138FV30LL-45ZAXAT?

CY62138FV30LL-45ZAXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62138FV30LL-45ZAXAT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62138FV30LL-45ZAXAT?

For technical support, including CY62138FV30LL-45ZAXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62138FV30LL-45ZAXAT requirements.

6.How does Aetrix verify that CY62138FV30LL-45ZAXAT is sourced from the original manufacturer or authorized distributors?

All CY62138FV30LL-45ZAXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62138FV30LL-45ZAXAT meets industry standards.

7.What is the process for return or replacement of CY62138FV30LL-45ZAXAT?

All CY62138FV30LL-45ZAXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62138FV30LL-45ZAXAT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62138FV30LL-45ZAXAT part is unused and in its original packaging.

Return procedure for CY62138FV30LL-45ZAXAT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62138FV30LL-45ZAXAT Tags

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