Infineon Technologies CY62146ELL-45ZSXAT
- Part No.:
- CY62146ELL-45ZSXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62146ELL-45ZSXAT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62146ELL-45ZSXAT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) CMOS static RAM with 45 ns access time, 4.5–5.5 V supply range, and ultra-low standby current (2.5 µA typical). It features byte-wide control (BHE/ BLE), automatic CE power-down, and TTL-level compatibility-designed for battery-sensitive industrial and automotive-A applications requiring reliable non-volatile data buffering.
For engineers reviewing the CY62146ELL-45ZSXAT datasheet, CY62146ELL-45ZSXAT pinout, CY62146ELL-45ZSXAT application, or CY62146ELL-45ZSXAT equivalent, key selection criteria include its 44-pin TSOP II package, 256K × 16 organization, 45 ns read cycle, 7 µA max ISB2, and BHE/ BLE-controlled 8-bit I/O partitioning in embedded memory subsystems.
Technical Context
The CY62146ELL-45ZSXAT implements a fully static 256K × 16 RAM array with independent byte enable logic for high- and low-byte access. Its CMOS architecture supports TTL-compatible input thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V) and delivers guaranteed 45 ns tRC across –40 °C to +85 °C.
Power management relies on dual-stage control: CE-driven automatic power-down reduces ICC to ≤7 µA when deselected, while data retention operates down to 2.0 V with ICCDR ≤ 8.8 µA. Output drivers support 2.1 mA sink capability and high-impedance tri-state control via OE, CE, BHE, and BLE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (256K words × 16 bits); enables single-chip replacement of two 256K × 8 SRAMs in 16-bit bus systems. |
| Access Time | 45 ns max tRC; ensures timing compliance with 10 MHz bus clocks and legacy microcontrollers like Intel 80C186. |
| VCC Range | 4.5 V to 5.5 V; supports direct integration with 5 V logic rails without level-shifting in industrial control modules. |
| Standby Current | 2.5 µA typical / 7 µA max ISB2; extends battery life >10× vs. standard SRAMs in always-on sensor nodes. |
| Operating Current | 3.5 mA typical at 1 MHz fCLK; limits thermal rise in sealed enclosures during periodic data logging. |
| Data Retention | 2.0 V min VDR with ≤8.8 µA ICCDR; maintains memory state during brown-out events in automotive body controllers. |
| Package | 44-pin TSOP II (ZSXAT suffix); surface-mount compatible with IPC-7351B footprint for automated PCB assembly. |
Pinout & Package
Package: 44-pin Thin Small Outline Package (TSOP) Type II, 400 mil width, lead-free (Pb-free), RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word decoding; A17 is MSB for 512 KB address space. |
| I/O0–I/O7 | Low-Byte Data I/O | Bi-directional 8-bit data path enabled only when BLE = LOW; isolated from bus during high-Z states. |
| I/O8–I/O15 | High-Byte Data I/O | Bi-directional 8-bit data path enabled only when BHE = LOW; supports interleaved 16-bit transfers. |
| CE | Chip Enable | Active-LOW global select; forces automatic power-down and high-Z outputs when HIGH (VCC – 0.2 V). |
| OE | Output Enable | Active-LOW read control; disables outputs (high-Z) when HIGH, independent of CE state. |
| WE | Write Enable | Active-LOW write strobe; initiates write cycle when CE and WE both LOW; controls data latching timing. |
| BLE | Byte Low Enable | Active-LOW control for I/O0–I/O7; allows partial writes without disturbing high-byte contents. |
| BHE | Byte High Enable | Active-LOW control for I/O8–I/O15; enables independent 8-bit updates in mixed-width memory maps. |
| VCC | Power Supply | Two dedicated pins (pins 31 & 32) reduce IR drop and improve noise immunity on 5 V rail. |
| VSS | Ground | Two dedicated pins (pins 35 & 36) provide low-inductance return paths for I/O switching currents. |
| NC | No Connect | Pins 10 & 13 are unconnected on die; must remain unpopulated or left floating per design guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active current to 3.5 mA at 1 MHz and standby to 2.5 µA-critical for portable medical monitors with 72-hour battery runtime. |
| Byte-Enable Controlled I/O Partitioning | Enables simultaneous access to high/low bytes via independent BHE/ BLE signals-eliminates need for external byte-masking logic in ARM9-based HMI controllers. |
| TTL-Level Input Compatibility | Accepts VIH ≥ 2.2 V and VIL ≤ 0.8 V-directly interfaces with legacy 5 V microcontrollers (e.g., PIC18F87J11) without level shifters. |
| Automatic CE Power-Down Mode | Reduces power consumption by >99% when CE is HIGH-activates instantly without software overhead in CAN gateway sleep modes. |
| 44-pin TSOP II Mechanical Standardization | Matches JEDEC MO-143AC footprint-enables drop-in replacement in existing industrial PLC memory modules with no PCB redesign. |
Applications
| Industrial Programmable Logic Controller (PLC) | Automotive Body Control Module (BCM) |
|---|---|
|
Use Scenario: Real-time I/O mapping and firmware parameter storage in DIN-rail mounted PLCs operating continuously at 70 °C ambient. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory for ladder logic execution buffers and configuration registers. Use Value: 45 ns tRC ensures deterministic response within 10 ms scan cycles; 7 µA ISB2 prevents thermal runaway during extended idle periods. |
Use Scenario: Storing door lock status, window position, and lighting profiles in vehicle BCMs exposed to –40 °C to +85 °C temperature swings. IC Role / Device Role / Timing Role: Battery-backed data retention memory interfacing directly with Freescale S12X MCU's 16-bit external bus. Use Value: 2.0 V VDR and 8.8 µA ICCDR maintain memory integrity during 12 V battery dips to 6 V; TSOP II package withstands automotive vibration. |
| Portable Medical Diagnostic Device | Smart Energy Meter with Tamper Detection |
|
Use Scenario: ECG waveform buffering and calibration coefficient storage in handheld ultrasound probes powered by Li-ion batteries. IC Role / Device Role / Timing Role: Low-power SRAM for real-time signal processing pipelines with burst-mode ADC data capture. Use Value: 2.5 µA ISB2 extends probe runtime beyond 8 hours per charge; byte-enable control minimizes bus contention during dual-sensor sampling. |
Use Scenario: Secure metering log storage and cryptographic key caching in ANSI C12.19-compliant smart meters deployed in outdoor utility cabinets. IC Role / Device Role / Timing Role: Tamper-resilient memory for event timestamps and firmware rollback signatures accessed via MSP430FR59xx FRAM controller. Use Value: 4.5–5.5 V VCC range tolerates wide input fluctuations from switching power supplies; Pb-free TSOP II meets RoHS/REACH field-deployment requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-10TLI | 10 ns faster access (10 ns vs. 45 ns), but higher ISB2 (25 µA max) and narrower VCC (3.0–3.6 V only). | Requires 3.3 V system rail and voltage translation for 5 V MCU interfaces; unsuitable for direct 5 V legacy designs. | Select only if migrating to 3.3 V platforms and needing sub-15 ns timing-verify I/O voltage compatibility with host processor. |
| AS6C4008-55TIN | Same 45 ns speed and 5 V operation, but larger 44-pin SOJ package (not TSOP II) and higher ISB2 (15 µA max). | SOJ footprint incompatible with TSOP II PCBs; requires board rework and increases assembly cost due to through-hole insertion. | Consider only for legacy SOJ socketed systems where TSOP II reflow is not feasible-no mechanical or thermal advantage over CY62146ELL. |
Compared with IS61LV25616AL-10TLI and AS6C4008-55TIN, the CY62146ELL-45ZSXAT uniquely balances 5 V TTL compatibility, ultra-low 7 µA standby, and TSOP II manufacturability-making it the sole choice for cost-sensitive, thermally constrained 5 V industrial upgrades.
Availability
CY62146ELL-45ZSXAT is available at Aetrix Electronics and suitable for industrial programmable logic controllers, automotive body control modules, and portable medical diagnostic devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62146ELL-45ZSXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and memory solutions-with annual revenue exceeding €14 billion and operations in 35+ countries.
This device belongs to Infineon's MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power data buffering in battery-operated and thermally constrained industrial and automotive-A grade systems.
FAQ
Is CY62146ELL-45ZSXAT compatible with 5 V TTL microcontrollers without level shifting?
Yes. The device accepts VIH ≥ 2.2 V and VIL ≤ 0.8 V across its full 4.5–5.5 V VCC range, matching standard 5 V TTL logic thresholds. It has been validated with Intel 80C186 and Motorola 68HC11 families-no external level shifters are required for signal integrity or timing compliance.
What is the maximum junction temperature under continuous operation at 85 °C ambient?
With θJA = 55.52 °C/W and max ICC = 20 mA at VCC = 5.5 V, power dissipation is 110 mW. At 85 °C ambient, junction temperature reaches 85 + (110 mW × 55.52) ≈ 91.1 °C-well below the 125 °C absolute maximum rating, ensuring safe operation in sealed enclosures.
Can BHE and BLE be used simultaneously for 16-bit reads/writes?
Yes. When both BHE and BLE are LOW, all 16 I/O lines (I/O0–I/O15) are active for full-word access. The truth table on page 11 confirms concurrent byte enable operation during CE/OE/WE-controlled cycles-enabling native 16-bit bus efficiency without external gating logic.
Does the device retain data during brief VCC interruptions, and what is the minimum hold voltage?
Yes. At VCC ≥ 2.0 V, the device enters data retention mode with ICCDR ≤ 8.8 µA. The tCDR (chip deselect to retention) is instantaneous, and tR (recovery time) is 45 ns-allowing seamless resumption after brown-outs as short as 100 µs, provided VCC remains ≥2.0 V during interruption.
CY62146ELL-45ZSXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62146ELL-45ZSXAT FAQ
1.How can I place an order for CY62146ELL-45ZSXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62146ELL-45ZSXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62146ELL-45ZSXAT reliable?
The price and inventory of CY62146ELL-45ZSXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62146ELL-45ZSXAT is usually 5 days.
3.What payment methods are accepted for CY62146ELL-45ZSXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62146ELL-45ZSXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62146ELL-45ZSXAT?
CY62146ELL-45ZSXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62146ELL-45ZSXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62146ELL-45ZSXAT?
For technical support, including CY62146ELL-45ZSXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62146ELL-45ZSXAT requirements.
6.How does Aetrix verify that CY62146ELL-45ZSXAT is sourced from the original manufacturer or authorized distributors?
All CY62146ELL-45ZSXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62146ELL-45ZSXAT meets industry standards.
7.What is the process for return or replacement of CY62146ELL-45ZSXAT?
All CY62146ELL-45ZSXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62146ELL-45ZSXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62146ELL-45ZSXAT part is unused and in its original packaging.
Return procedure for CY62146ELL-45ZSXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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