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Infineon Technologies CY62146EV30LL-45BVXI

Part No.:
CY62146EV30LL-45BVXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62146EV30LL-45BVXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:962

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Product details

Overview

CY62146EV30LL-45BVXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and industrial/automotive-A temperature rating (–40 °C to +85 °C). It delivers ultra-low active current (3.5 mA at 1 MHz) and standby current (2.5 µA typical), supporting battery-sensitive portable electronics via MoBL® architecture.

For engineers reviewing the CY62146EV30LL-45BVXI datasheet, CY62146EV30LL-45BVXI pinout, CY62146EV30LL-45BVXI application, or CY62146EV30LL-45BVXI equivalent, key selection criteria include VFBGA-48 package compatibility, byte-enable-controlled 16-bit data access, automatic CE power-down behavior, and guaranteed 45 ns read/write timing across full voltage and temperature range.

Technical Context

This SRAM implements a synchronous, non-volatile-retentive memory array organized as 256K words × 16 bits, with independent Byte High Enable (BHE) and Byte Low Enable (BLE) for selective 8-bit writes. Its CMOS design enables deterministic timing-tRC = 45 ns, tAA = 45 ns, tDOE = 22 ns-with all AC parameters specified over –40 °C to +85 °C and 2.2–3.6 V.

The device supports three low-power states: active (ICC = 3.5 mA typ @ 1 MHz), automatic CE power-down (ISB1 = 2.5 µA typ), and full standby (ISB2 = 2.5 µA typ), triggered by CE HIGH and stable address bus. Input/output pins enter high-impedance state during deselection, OE HIGH, BHE/ BLE HIGH, or write cycles.

Key Specifications

Parameter Value and Actual Design Meaning
Memory size 4 Mbit (256K × 16) - provides 512 KB of fast, non-refreshing RAM for embedded control buffers or display frame storage
Access time 45 ns - guarantees deterministic read latency for real-time microcontroller interfaces operating up to ~22 MHz
Supply voltage 2.2 V to 3.6 V - compatible with single-supply 2.5 V or 3.3 V systems without level-shifting
Operating temperature –40 °C to +85 °C - qualified for industrial and automotive-A environments without derating
Standby current 2.5 µA typical - enables multi-year battery life in always-on sensor nodes or backup memory applications
Active current 3.5 mA at f = 1 MHz - supports burst-mode operation with minimal thermal impact in space-constrained modules
Data retention voltage 1.5 V minimum - allows graceful degradation into data-hold mode during brown-out conditions

Pinout & Package

Package: 48-ball Very Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address inputs 18-bit address bus supporting full 256K-word addressing; A16/A17 used for higher-density variants but NC on this 4-Mbit version
I/O0–I/O15 Bidirectional data bus 16-bit parallel interface; split into two 8-bit lanes via BHE/BLE for byte-level writes without full bus contention
CE Chip enable Primary device select; HIGH forces automatic power-down and Hi-Z I/Os; LOW enables read/write operations
OE Output enable Controls output drivers only; must be LOW with CE LOW for valid reads; does not affect power state
WE Write enable Active-LOW signal initiating write cycles; overlapping with CE LOW and BHE/BLE LOW defines write boundaries
BHE, BLE Byte enable controls Independent gating of upper/lower 8-bit data lanes; enables partial writes while preserving adjacent byte integrity
VCC, VSS Power and ground Dual VCC balls (pins E1, F1) and dual VSS balls (pins D1, G1) reduce IR drop and improve noise immunity
NC No-connect Pins H1, G2, H6 are unconnected die pads reserved for 8/16/32-Mbit variants; must remain floating or grounded per layout guidelines

Key Features

Feature Design Value
MoBL® ultra-low power architecture Reduces active current by >60% vs. legacy 3.3 V SRAMs, enabling extended runtime in coin-cell-powered IoT endpoints
Automatic CE power-down Slashes current to 2.5 µA when addresses stabilize, eliminating need for external sleep-state logic in firmware
Byte-selectable write capability Allows independent update of upper or lower 8-bit bytes without read-modify-write cycles, reducing bus traffic and latency
High-impedance output control Guarantees I/O pins enter Hi-Z within 18 ns of OE/CE/BHE/BLE deassertion, preventing bus contention in shared-memory systems
Wide VCC tolerance (2.2–3.6 V) Supports direct integration with Li-ion battery rails (3.0–3.6 V) and regulated 2.5 V domains without external regulators

Applications

Portable Medical Sensors Automotive Body Control Modules

Use Scenario: Continuous acquisition of ECG/SpO₂ waveforms in wearable patch monitors with intermittent Bluetooth LE transmission.

IC Role / Device Role / Timing Role: High-speed buffer storing 1–2 seconds of raw sensor data prior to compression and wireless upload.

Use Value: 45 ns access time enables real-time capture at ≥1 kHz sampling; 2.5 µA standby current extends battery life beyond 7 days on a CR2032 cell.

Use Scenario: Storing configuration profiles, fault logs, and PWM calibration tables in door module ECUs.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding critical settings updated during ignition-off maintenance windows.

Use Value: Data retention down to 1.5 V allows safe logging during battery voltage sag; –40 °C to +85 °C rating ensures reliability across under-hood thermal cycling.

Industrial PLC I/O Expansion Cards Smart Energy Meter Data Buffers

Use Scenario: Local buffering of analog input scan results and digital output command queues in modular I/O sub-units.

IC Role / Device Role / Timing Role: Dual-port accessible RAM interfaced to FPGA logic for concurrent acquisition and host CPU readout.

Use Value: 16-bit bus width matches common FPGA data paths; byte-enable support simplifies partial register updates without full word reads.

Use Scenario: Temporary storage of tariff-based energy consumption snapshots before secure transfer to flash memory.

IC Role / Device Role / Timing Role: High-reliability volatile buffer isolating metering ASIC from flash write latency and wear constraints.

Use Value: 45 ns cycle time synchronizes cleanly with metrology SoC clock domains; 3.6 V max rating accommodates wide-input DC-DC outputs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV25616BLL-45NLI Same density (256K × 16), 45 ns speed, but 2.7–3.6 V only; no 2.2 V support; 55-ball TSOP-II package Lacks low-voltage operation below 2.7 V; unsuitable for battery-sag scenarios requiring <2.7 V retention Select when system uses fixed 3.3 V rail and board space permits larger TSOP-II footprint
ON Semiconductor NVSRAM NVTFS25616L-45G Non-volatile SRAM with integrated EEPROM backup; 45 ns access; 2.7–3.6 V; requires external capacitor for store/restore Provides automatic data retention on power loss; adds complexity and cost for pure volatile use cases Choose only if deterministic power-fail data preservation is mandatory and capacitor area is available

Compared with IS62WV25616BLL-45NLI and NVTFS25616L-45G, CY62146EV30LL-45BVXI uniquely balances ultra-wide voltage operation (2.2–3.6 V), industry-leading 2.5 µA standby, and compact VFBGA-48 packaging-making it optimal for space- and battery-constrained portable and automotive edge nodes where true volatility is acceptable.

Availability

CY62146EV30LL-45BVXI is available at Aetrix Electronics and suitable for portable medical sensors, automotive body control modules, industrial PLC I/O expansion cards, and smart energy meter data buffers requiring stable component supply across long production lifecycles.

Supply support for CY62146EV30LL-45BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, delivering power management, sensing, connectivity, and security solutions for industrial, automotive, and IoT markets.

CY62146EV30LL-45BVXI belongs to Infineon's MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power, high-speed volatile memory in portable and energy-sensitive embedded systems.

FAQ

What is the maximum clock frequency supported for read/write operations?

The CY62146EV30LL-45BVXI does not operate on a clock signal-it is an asynchronous SRAM. Its 45 ns access time supports reliable operation with microcontrollers or FPGAs generating address/strobe sequences at up to ~22 MHz effective bus rate. Timing margins depend on PCB trace length, loading, and VCC stability-not internal clocking.

Can BHE and BLE be tied permanently to logic HIGH or LOW?

Yes-BHE and BLE may be hardwired to VCC or GND depending on system needs. Tying BLE LOW enables only lower-byte writes; tying both HIGH disables all writes. However, doing so forfeits byte-select flexibility and may increase unnecessary power draw if unused pins float. Pull-up/down resistors are recommended for unused enables.

Does this part support data retention during complete power removal?

No-CY62146EV30LL-45BVXI is a volatile SRAM and loses all data when VCC drops below 1.5 V or is removed entirely. It supports data retention only during brown-out conditions (VCC ≥ 1.5 V) with CE HIGH, consuming ≤8.8 µA. For non-volatile storage, external EEPROM or battery-backed SRAM is required.

Is the VFBGA-48 package lead-free and RoHS compliant?

Yes-the CY62146EV30LL-45BVXI in the "BVXI" suffix is explicitly Pb-free and RoHS-compliant per Infineon's documentation. The package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3), requiring bake conditioning before reflow if exposed to ambient >12 months.

CY62146EV30LL-45BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62146EV30LL-45BVXI FAQ

1.How can I place an order for CY62146EV30LL-45BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62146EV30LL-45BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62146EV30LL-45BVXI reliable?

The price and inventory of CY62146EV30LL-45BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62146EV30LL-45BVXI is usually 5 days.

3.What payment methods are accepted for CY62146EV30LL-45BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62146EV30LL-45BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62146EV30LL-45BVXI?

CY62146EV30LL-45BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62146EV30LL-45BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62146EV30LL-45BVXI?

For technical support, including CY62146EV30LL-45BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62146EV30LL-45BVXI requirements.

6.How does Aetrix verify that CY62146EV30LL-45BVXI is sourced from the original manufacturer or authorized distributors?

All CY62146EV30LL-45BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62146EV30LL-45BVXI meets industry standards.

7.What is the process for return or replacement of CY62146EV30LL-45BVXI?

All CY62146EV30LL-45BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62146EV30LL-45BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62146EV30LL-45BVXI part is unused and in its original packaging.

Return procedure for CY62146EV30LL-45BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62146EV30LL-45BVXI Tags

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