Infineon Technologies CY62146G30-45BVXIT

Overview

CY62146G30-45BVXIT from Cypress Semiconductor is a 4-Mbit (256K × 16) MoBL® Static RAM with embedded single-bit error-correcting code (ECC), operating at 45 ns access time over 2.2–3.6 V supply, featuring ERR output pin for real-time error indication and ultra-low 3.5 µA typical standby current. It is used in industrial control modules requiring data integrity under extended temperature cycling.

For engineers reviewing the CY62146G30-45BVXIT datasheet, CY62146G30-45BVXIT pinout, CY62146G30-45BVXIT application, or CY62146G30-45BVXIT equivalent, this page delivers verified package mapping (48-ball VFBGA), ECC correction behavior, byte-enable write control (BHE/ BLE), TTL-compatible I/O timing, and dual/single CE configuration support - all confirmed from Cypress Document 001-95420 Rev. *E.

Technical Context

This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles, signaled via the dedicated ERR output pin asserted HIGH. Its memory array uses standard CMOS architecture with row/column decoding across A0–A17 address lines and I/O0–I/O15 bidirectional data bus.

It supports two chip enable modes: single CE (CE active LOW) or dual CE (CE1 LOW + CE2 HIGH), with independent byte write control via BHE (I/O8–I/O15) and BLE (I/O0–I/O7). All I/Os enter HI-Z state when deselected or during OE/BLE/BHE deassertion.

Key Specifications

Pinout & Package

Package: 48-ball VFBGA (5.0 mm × 5.0 mm × 0.75 mm), RoHS-compliant, ball pitch 0.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Compared with IS62WV25616BLL-45NLI and MT45W8MW16BGX-45IT, CY62146G30-45BVXIT uniquely integrates autonomous ECC correction with a dedicated ERR output, eliminating host-side computation and enabling immediate fault visibility in safety-augmented systems.

Availability

CY62146G30-45BVXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical device firmware storage, avionics data loggers, and railway signaling controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY62146G30-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on low-power, robust timing, and functional safety.

CY62146G30-45BVXIT belongs to the MoBL® (Mobile Low-power) SRAM product line, engineered specifically for battery-sensitive and ECC-dependent embedded systems where data integrity and standby efficiency are co-primary requirements.

FAQ

Does CY62146G30-45BVXIT support automatic write-back after ECC correction?

No. Per Cypress Document 001-95420 Rev. *E Note 2, this device does not support automatic write-back on error detection. Corrected data remains in the read path only; the original memory location retains the uncorrected value unless explicitly rewritten by the host system.

What is the function of the ERR pin, and how is it electrically driven?

The ERR pin is an open-drain output that asserts HIGH during a single-bit error correction event. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) and remains inactive (HIGH-Z) otherwise. Its assertion duration matches the read cycle time and is synchronized to the OE-controlled data window.

Can CY62146G30-45BVXIT operate at 1.8 V supply voltage?

No. This variant (CY62146G30-45BVXIT) is rated for 2.2 V to 3.6 V only. The 1.65–2.2 V speed grade is designated as CY62146G18; using 1.8 V on this part violates the specified operating range and may result in timing violations or ECC failure.

How are NC pins handled in the 48-ball VFBGA package?

NC pins (e.g., balls A16, C1, D1, E1, F1, G1, H1, H2, H3, H4, H5, H6) are not bonded to the die and serve no internal function. They are reserved for future density expansion or mechanical reinforcement and must remain unconnected on PCB layout per Cypress specification.