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Infineon Technologies CY62146G30-45ZSXI

Part No.:
CY62146G30-45ZSXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62146G30-45ZSXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
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Inventory:622

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Product details

Overview

CY62146G30-45ZSXI from Cypress Semiconductor is a 4-Mbit (256K × 16) MoBL® SRAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, and an ERR output pin for real-time error indication. It operates at 45 ns access time across 2.2–3.6 V supply, draws only 3.5 µA typical standby current, and is packaged in a 48-ball VFBGA for space-constrained industrial memory subsystems.

For engineers reviewing the CY62146G30-45ZSXI datasheet, CY62146G30-45ZSXI pinout, CY62146G30-45ZSXI application, or CY62146G30-45ZSXI equivalent, this device supports byte-level write control via BHE/ BLE, ECC-enabled data integrity in mission-critical buffers, and dual-chip-enable addressing for multi-bank memory expansion.

Technical Context

This SRAM integrates dedicated ECC encoder/decoder logic within the memory array path, performing on-the-fly single-bit error correction during read cycles and asserting the ERR pin high upon detection. Its architecture separates row/column decoding, sense amplification, and ECC processing to maintain deterministic 45 ns timing under all valid VCC and temperature conditions.

The device supports two chip enable configurations (single CE or dual CE1/CE2), independent byte write enables (BHE for I/O8–I/O15, BLE for I/O0–I/O7), and HI-Z tri-state control on all I/Os when deselected - enabling clean bus sharing in multiprocessor or FPGA-based systems without external bus transceivers.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (256K words × 16 bits) - provides 512 KB of parallel-access data storage with full word-wide I/O capability.
Access Time 45 ns - guarantees maximum read latency at 22.22 MHz clock rate for synchronous system integration.
Supply Voltage 2.2 V to 3.6 V - compatible with modern low-voltage microcontrollers and FPGAs without level-shifting.
Standby Current 3.5 µA typical - enables ultra-low-power retention in battery-backed or energy-harvested systems.
ECC Function Single-bit error correction with ERR pin assertion - delivers autonomous data integrity verification without host CPU intervention.
Package 48-ball VFBGA (6.0 mm × 8.0 mm, 0.8 mm pitch) - supports high-density PCB layouts with thermal and electrical performance optimized for industrial ambient.
I/O Interface TTL-compatible inputs/outputs - ensures direct interfacing with legacy and mixed-voltage logic families without interface ICs.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), JEDEC MO-249 compliant, 6.0 mm × 8.0 mm body, 0.8 mm ball pitch, lead-free (RoHS-compliant).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word addressing; no internal latching - requires stable address during CE/OE/WE setup.
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel data path; direction controlled by WE state; HI-Z when CE inactive or OE/BLE/BHE deasserted.
CE (Chip Enable) Device Selection Active-low single-chip-enable input; places entire I/O bus in HI-Z when high - enables memory-mapped peripheral sharing.
WE (Write Enable) Write Control Active-low signal initiating write cycle; data latched on falling edge - synchronizes with address setup for reliable write timing.
OE (Output Enable) Read Control Active-low signal enabling output drivers; must be asserted with CE and stable address to read valid data.
BHE / BLE Byte Write Enables BHE controls upper byte (I/O8–I/O15); BLE controls lower byte (I/O0–I/O7); both low required for full-word writes.
ERR Error Indication Output Open-drain active-high output asserted during ECC correction event - directly interfaces with interrupt controllers or status registers.
VCC / VSS Power / Ground Dual VCC pins (balls A16, D1) and multiple VSS balls (C1, E1, F2, G3, H4) ensure low-impedance power delivery and noise suppression.

Key Features

Feature Design Value
Embedded ECC engine On-die hardware correction of single-bit errors per 16-bit word - eliminates need for software ECC routines and reduces host processor overhead.
Ultra-low ISB2 standby current 8.7 µA maximum at 85°C - extends battery life in always-on industrial logging and telemetry nodes.
Multi-voltage operation Valid across 2.2–3.6 V range - allows seamless integration into mixed-supply systems with 3.3 V I/O and 2.5 V core domains.
Byte-selectable write architecture Independent BHE/ BLE control enables partial-word updates without read-modify-write sequences - critical for real-time control register updates.
ERR pin with open-drain output Direct interrupt signaling to MCU or FPGA - enables immediate fault logging or fail-safe state transition without polling.

Applications

Industrial PLC Data Buffer Medical Imaging Frame Store

Use Scenario: Storing real-time sensor fusion data and control command history in programmable logic controllers with extended uptime requirements.

IC Role / Device Role / Timing Role: High-reliability SRAM buffer with ECC protection against cosmic-ray-induced bit flips in unattended factory-floor deployments.

Use Value: Prevents silent data corruption in safety-critical control loops; ERR pin triggers automatic diagnostics before corrupted values propagate to actuator outputs.

Use Scenario: Holding uncompressed grayscale image frames (e.g., 512×512 @ 16 bpp) during acquisition and preprocessing in portable ultrasound devices.

IC Role / Device Role / Timing Role: Low-latency, low-power frame buffer interfaced directly to image sensor controller and DSP pipeline.

Use Value: 45 ns access time sustains >22 MHz pixel clock rates; 3.5 µA standby preserves battery charge between imaging sessions.

Avionics Health Monitor Cache Test & Measurement Instrument Memory

Use Scenario: Caching flight parameter logs and diagnostic snapshots in airborne health monitoring units where radiation tolerance is mandatory.

IC Role / Device Role / Timing Role: Radiation-hardened-by-design SRAM with ECC for non-volatile data integrity in high-altitude environments.

Use Value: Single-event upset (SEU) mitigation without external scrubbing logic; ERR assertion feeds into DO-254-compliant fault reporting chain.

Use Scenario: Capturing high-speed analog waveform samples in digital oscilloscopes and logic analyzers with deep memory depth requirements.

IC Role / Device Role / Timing Role: Parallel-access memory bank synchronized to ADC sampling clocks and pattern generator timing engines.

Use Value: Dual CE support enables seamless ping-pong buffering; TTL compatibility simplifies interface to legacy FPGA I/O banks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV25616EDBLL-10MLI No integrated ECC; requires external error handling; 10 ns faster (10 ns access), but higher 15 mA active current. Lacks autonomous error reporting; suitable only where host firmware implements ECC or data integrity is non-critical. Select when speed outweighs reliability needs and host has ECC processing capacity.
AS6C4008-55TIN 4-Mbit × 8-bit organization; no ERR pin; 55 ns access; 2.7–3.6 V only; no ECC support. Requires external byte-width adaptation; unsuitable for systems requiring transparent single-bit correction. Choose only for cost-sensitive, non-safety-critical designs with fixed 8-bit bus architecture.

Compared with IS61WV25616EDBLL-10MLI and AS6C4008-55TIN, CY62146G30-45ZSXI uniquely delivers hardware-accelerated ECC with interrupt-capable ERR signaling in a 16-bit bus format - making it the sole option among these three for zero-software-overhead data integrity in industrial and avionics memory buffers.

Availability

CY62146G30-45ZSXI is available at Aetrix Electronics and suitable for industrial PLC data buffers, medical imaging frame stores, avionics health monitor caches, and test & measurement instrument memory requiring stable component supply across extended product lifecycles.

Supply support for CY62146G30-45ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-reliability memory, PSoC programmable SoCs, and USB/USB-C solutions for industrial and automotive markets.

CY62146G30-45ZSXI belongs to the MoBL® (Mobile Bit-Low-power) SRAM product line, engineered for ultra-low standby power and ECC-enhanced data integrity in harsh-environment embedded systems.

FAQ

Does CY62146G30-45ZSXI support automatic write-back after ECC correction?

No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite the corrected data back to the memory cell. Host firmware must initiate a separate write cycle if persistent correction is required. This behavior is explicitly documented in the datasheet Note 2 on page 1.

What is the function of the NC pins in the 48-ball VFBGA package?

The NC (No Connect) pins - located at balls C3, D3, and E3 - are not bonded to the die and serve no electrical function. They are reserved for potential future use in higher-density derivatives and may be left unconnected or tied to ground per board layout best practices; they must not be used for signal routing or voltage reference.

Can CY62146G30-45ZSXI operate reliably at 3.3 V?

Yes. The device is fully specified and tested for operation across 2.2 V to 3.6 V, including 3.3 V nominal supply. All AC and DC parameters - including 45 ns access time and 3.5 µA standby current - are guaranteed at 3.3 V and –40°C to +85°C per the Industrial grade operating range.

Is the ERR pin actively driven or open-drain?

The ERR pin is open-drain with internal pull-down. It asserts HIGH (open-drain pulled up externally) during ECC correction events and remains LOW otherwise. An external pull-up resistor (typically 4.7 kΩ to VCC) is required for proper logic-level signaling to interrupt controllers or status registers.

CY62146G30-45ZSXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62146G30-45ZSXI FAQ

1.How can I place an order for CY62146G30-45ZSXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62146G30-45ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62146G30-45ZSXI reliable?

The price and inventory of CY62146G30-45ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62146G30-45ZSXI is usually 5 days.

3.What payment methods are accepted for CY62146G30-45ZSXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62146G30-45ZSXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62146G30-45ZSXI?

CY62146G30-45ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62146G30-45ZSXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62146G30-45ZSXI?

For technical support, including CY62146G30-45ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62146G30-45ZSXI requirements.

6.How does Aetrix verify that CY62146G30-45ZSXI is sourced from the original manufacturer or authorized distributors?

All CY62146G30-45ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62146G30-45ZSXI meets industry standards.

7.What is the process for return or replacement of CY62146G30-45ZSXI?

All CY62146G30-45ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62146G30-45ZSXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62146G30-45ZSXI part is unused and in its original packaging.

Return procedure for CY62146G30-45ZSXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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