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Infineon Technologies CY62146G30-45ZSXIT

Part No.:
CY62146G30-45ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62146G30-45ZSXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,761

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Product details

Overview

CY62146G30-45ZSXIT from Cypress Semiconductor is a 4-Mbit (256K × 16) MoBL® Static RAM with embedded single-bit error-correcting code (ECC), operating at 45 ns access time across 2.2–3.6 V supply, featuring ERR output pin, ultra-low 3.5 µA typical standby current, and TTL-compatible I/Os - deployed in industrial-grade memory subsystems requiring data integrity in avionics control units.

For engineers reviewing the CY62146G30-45ZSXIT datasheet, CY62146G30-45ZSXIT pinout, CY62146G30-45ZSXIT application, or CY62146G30-45ZSXIT equivalent, key selection criteria include ECC-enabled reliability, dual-chip-enable support, 48-ball VFBGA package compatibility, and voltage-flexible operation across 2.2–3.6 V rails for legacy and mixed-voltage embedded systems.

Technical Context

This SRAM integrates on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles, signaled via the dedicated ERR output pin asserted HIGH. Its architecture supports byte-level writes using BHE/ BLE controls and full 16-bit parallel I/O access with address decoding up to A0–A17.

The device operates in industrial temperature range (–40°C to +85°C) with three selectable VCC ranges; this variant is specified for 2.2–3.6 V, delivering 45 ns access time at fmax = 22.22 MHz while maintaining ≤20 mA active current and ≤8.7 µA max standby current.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (256K words × 16 bits) - supports 512 KB of word-accessible storage with ECC protection per 16-bit word
Access Time 45 ns - enables synchronous interface timing with microcontrollers running up to 22.22 MHz bus clocks
VCC Range 2.2 V to 3.6 V - compatible with 3.3 V logic domains and mixed-supply SoC interfaces without level-shifting
Standby Current Typ. 3.5 µA / Max. 8.7 µA - allows battery-backed retention in low-power modes for >1 year on coin-cell sources
ECC Function Single-bit error correction with ERR output assertion - provides hardware-level fault detection without software overhead
Package 48-ball VFBGA (6 mm × 8 mm, 0.8 mm pitch) - surface-mount footprint optimized for high-density PCB layouts
Operating Temp –40°C to +85°C - qualified for industrial control, transportation, and medical equipment environments

Pinout & Package

48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package, 6 mm × 8 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free finish.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting 256K-word addressing; A17 enables full 4-Mbit space
I/O0–I/O15 Bi-directional Data Bus 16-bit parallel interface; HI-Z when CE/OE/BLE/BHE inactive - prevents bus contention
CE1, CE2 Dual Chip Enable Inputs Active-LOW CE1 and active-HIGH CE2 required for device selection - enables multi-SRAM bank decoding
WE Write Enable Active-LOW control for write cycles; latches data on rising edge of WE when CE and OE are valid
OE Output Enable Active-LOW control enabling read data onto I/O lines; independent of CE state for flexible timing
BHE, BLE Byte Enable Controls BHE enables upper byte (I/O8–I/O15); BLE enables lower byte (I/O0–I/O7) - supports 8-bit sub-word access
ERR Error Indication Output Open-drain output asserted HIGH during single-bit error detection/correction - directly interfaces to interrupt controllers
VCC, VSS Power Supply Pins Dual VCC balls (pins A16, D1) and multiple VSS balls (pins C1, E1, F1, G1, H1) reduce IR drop and improve noise immunity

Key Features

Feature Design Value
Embedded ECC engine Hardware-accelerated single-bit error correction per 16-bit word - eliminates need for external ECC logic or software routines
Ultra-low ISB2 standby current Max 8.7 µA at 3.6 V/85°C - extends battery life in always-on monitoring nodes without compromising retention
Dual chip enable architecture CE1 (active-LOW) + CE2 (active-HIGH) - simplifies hierarchical memory mapping in multi-bank controller designs
TTL-compatible signaling VIH/VIL thresholds aligned to 3.3 V logic families - interoperable with ARM Cortex-M, PowerPC, and FPGA I/O banks
Wide VCC flexibility Valid operation from 2.2 V to 3.6 V - accommodates brown-out conditions and aging power supplies in field-deployed systems

Applications

Avionics Flight Control Memory Railway Signaling Data Buffer

Use Scenario: Real-time storage of sensor fusion outputs and actuator command history in fly-by-wire ECUs.

IC Role / Device Role / Timing Role: Primary working memory with ECC-protected word access, synchronized to 20 MHz control loop clock.

Use Value: Prevents latent bit flips from cosmic radiation; ERR signal triggers diagnostic logging before corrupted data propagates to servo drivers.

Use Scenario: Temporary buffering of interlocking logic states and track occupancy reports in EBI (European Balise Interface) modules.

IC Role / Device Role / Timing Role: Dual-port accessible SRAM interfaced to safety-certified microcontroller via 16-bit parallel bus.

Use Value: Ensures SIL-3 compliance by detecting/correcting memory errors without system reset or watchdog intervention.

Medical Imaging Frame Store Industrial PLC Configuration Cache

Use Scenario: Storing intermediate pixel buffers during real-time ultrasound beamforming processing.

IC Role / Device Role / Timing Role: Low-latency, burst-capable memory mapped into DMA address space of imaging SoC.

Use Value: 45 ns access time meets sub-microsecond timing budgets; ECC prevents misrendering due to transient alpha-particle strikes.

Use Scenario: Holding runtime configuration parameters and ladder logic state variables in modular PLC backplanes.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM backed by supercapacitor; retains data for ≥72 hours during AC loss.

Use Value: 1.0 V data retention mode enables reliable hold-up at reduced voltage, minimizing backup power circuit complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV25616BLL-45NLI No integrated ECC; requires external error-handling logic; 45 ns access, 2.5–3.6 V only Lacks hardware ERR signal; suitable where software-based ECC or redundancy is acceptable Select if cost sensitivity outweighs ECC assurance and system-level error handling is already implemented
Micron MT45W8MW16BGX-45IT DDR2 SDRAM with optional ECC; 45 ns tAA but requires refresh management and command protocol Higher density (8 Mbit) but adds controller complexity; not pin-compatible or functionally drop-in Choose only when migrating to DDR architecture and redesigning memory controller firmware/hardware

Compared with IS62WV25616BLL-45NLI and MT45W8MW16BGX-45IT, CY62146G30-45ZSXIT delivers verified on-die ECC correction with zero software overhead, deterministic 45 ns timing, and direct replacement capability in existing 16-bit parallel SRAM footprints - critical for safety-critical updates without architectural change.

Availability

CY62146G30-45ZSXIT is available at Aetrix Electronics and suitable for avionics flight control memory, railway signaling data buffer, and medical imaging frame store applications requiring stable component supply across extended product lifecycles.

Supply support for CY62146G30-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-reliability memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

This device belongs to the MoBL® (Mobile Bit-Like) SRAM product line, engineered for ultra-low-power, ECC-enhanced memory in mission-critical industrial and transportation systems where data integrity cannot be compromised.

FAQ

Does CY62146G30-45ZSXIT support automatic write-back after ECC correction?

No. The device performs single-bit error correction transparently during read cycles and asserts the ERR pin, but does not automatically rewrite corrected data to the memory array. Write-back must be handled externally by the system controller if persistent correction is required.

What is the function of the NC pins in the 48-ball VFBGA package?

NC (No Connect) pins - including balls at positions A16, C2, D2, E2, F2, G2, H2, and others - are unconnected to the silicon die and serve no electrical function. They may be used for mechanical stability or future address expansion in higher-density derivatives, but must remain unconnected in this design.

Can CY62146G30-45ZSXIT operate at 1.8 V?

No. This variant is rated only for 2.2 V to 3.6 V operation. While earlier CY62146G(E)18 variants support 1.65–2.2 V, the "30" suffix explicitly denotes the 2.2–3.6 V speed grade; operation below 2.2 V violates datasheet specifications and risks timing failure or data corruption.

How is the ERR pin electrically configured and what load can it drive?

The ERR pin is an open-drain output requiring an external pull-up resistor. Per datasheet Figure 17, it sinks up to 1.6 mA at VOL ≤ 0.4 V (VCC = 3.0 V), supporting direct connection to standard CMOS inputs or interrupt lines with ≤10 kΩ pull-up to VCC or 3.3 V rail.

CY62146G30-45ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62146G30-45ZSXIT FAQ

1.How can I place an order for CY62146G30-45ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62146G30-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62146G30-45ZSXIT reliable?

The price and inventory of CY62146G30-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62146G30-45ZSXIT is usually 5 days.

3.What payment methods are accepted for CY62146G30-45ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62146G30-45ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62146G30-45ZSXIT?

CY62146G30-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62146G30-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62146G30-45ZSXIT?

For technical support, including CY62146G30-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62146G30-45ZSXIT requirements.

6.How does Aetrix verify that CY62146G30-45ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY62146G30-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62146G30-45ZSXIT meets industry standards.

7.What is the process for return or replacement of CY62146G30-45ZSXIT?

All CY62146G30-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62146G30-45ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62146G30-45ZSXIT part is unused and in its original packaging.

Return procedure for CY62146G30-45ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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