Infineon Technologies CY62146GN30-45BVXI
- Part No.:
- CY62146GN30-45BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62146GN30-45BVXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,146
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Product details
Overview
CY62146GN30-45BVXI from Cypress Semiconductor is a 4-Mbit (256K × 16) CMOS static RAM with 45 ns access time, operating across dual voltage ranges (2.2–3.6 V and 4.5–5.5 V), featuring ultra-low standby current (8.7 µA max) and automatic CE-controlled power-down mode. It serves as a low-power data buffer in portable embedded systems requiring fast random-access storage with battery life optimization.
For engineers reviewing the CY62146GN30-45BVXI datasheet, CY62146GN30-45BVXI pinout, CY62146GN30-45BVXI application, or CY62146GN30-45BVXI equivalent, key selection criteria include industrial temperature support (–40 °C to +85 °C), byte-wide I/O control via BHE/ BLE, TSOP II and VFBGA package options, and guaranteed 45 ns read/write timing at full voltage range.
Technical Context
The CY62146GN30-45BVXI implements a fully static 256K × 16 memory array with independent byte enable (BHE/BLE) for selective 8-bit writes, supporting both address- and OE-controlled read cycles. Its CMOS architecture enables deterministic timing with tRC = 45 ns, tAA = 45 ns, and tDOE = 22 ns under industrial conditions.
Power management is handled through three distinct states: active (ICC ≤ 20 mA at fmax), automatic CE power-down (ISB2 ≤ 8.7 µA), and data retention (ICCDR ≤ 13 µA at VDR ≥ 1.0 V). Input thresholds comply with CMOS levels across both voltage ranges, and all outputs enter high-impedance state when CE, OE, BHE, or BLE are deasserted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 16-bit - provides 512 KB of random-access storage with byte-selectable write capability |
| Access Time | 45 ns - guarantees worst-case read latency for real-time buffering in microcontroller peripherals |
| Supply Voltage Range | 2.2–3.6 V and 4.5–5.5 V - supports dual-rail legacy and low-voltage portable designs without level-shifting |
| Standby Current | 8.7 µA max at 3.6 V - enables >1-year battery life in always-on sensor nodes with infrequent memory access |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade deployment in automotive body control and factory automation |
| Package Options | 44-pin TSOP II and 48-ball VFBGA - enables layout flexibility for space-constrained handhelds or high-density PCBs |
| Data Retention Voltage | 1.0 V min - allows memory contents to persist during brown-out or controlled sleep modes |
Pinout & Package
Available in 48-ball VFBGA (CY62146GN30-45BVXI) and 44-pin TSOP II packages. The VFBGA variant uses a 6×8 ball grid with NC, power, ground, address, data, and control terminals arranged per Figure 2 of datasheet 001-95417 Rev. *E.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus selecting one of 256K locations; A17 enables full 512 KB addressing |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface with high-impedance tri-state control per byte via BHE/BLE |
| CE | Chip Enable | Active-low master select; drives device into 8.7 µA standby when HIGH |
| OE | Output Enable | Active-low read strobe; disables outputs and enters Hi-Z when HIGH |
| WE | Write Enable | Active-low write strobe; initiates write cycle when CE and WE both LOW |
| BHE / BLE | Byte High/Low Enable | Independent 8-bit write gating: BLE controls I/O0–I/O7; BHE controls I/O8–I/O15 |
| VCC / VSS | Power / Ground | Dual VCC pins support decoupling; two VSS balls reduce ground bounce in high-speed operation |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active ICC to 3.5 mA typical at 1 MHz, extending battery runtime in portable instrumentation |
| Automatic CE Power-Down Mode | Slashes current by >80% when addresses stall, eliminating need for external power-gating logic |
| Byte-Wide Write Control | Enables partial-word updates without read-modify-write cycles, reducing bus traffic and latency |
| Wide Dual-Voltage Operation | Eliminates level shifters in mixed-supply systems-supports both 3.3 V microcontrollers and 5 V legacy peripherals |
| Industrial Temperature Qualification | Guarantees full 45 ns timing and 8.7 µA ISB2 across –40 °C to +85 °C without derating |
Applications
| Portable Medical Monitor | Industrial PLC I/O Module |
|---|---|
|
Use Scenario: Real-time waveform capture and local display buffering in battery-powered ECG units. IC Role / Device Role / Timing Role: High-speed SRAM acting as FIFO buffer between ADC and ARM Cortex-M4 processor. Use Value: 45 ns access ensures zero-cycle wait states during 1 MS/s sampling; 8.7 µA standby extends battery life beyond 72 hours. |
Use Scenario: Local data logging and configuration storage in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding I/O state snapshots during firmware updates. Use Value: Dual-voltage support allows direct interfacing with both 3.3 V MCU and 5 V fieldbus transceivers; -40 °C to +85 °C rating ensures reliability in unconditioned cabinets. |
| Automotive Body Control Unit | Wireless Sensor Node Hub |
|
Use Scenario: Storing transient fault codes and CAN message buffers in door module ECUs. IC Role / Device Role / Timing Role: Fast-access scratchpad memory for interrupt-driven CAN frame assembly and diagnostics. Use Value: Byte-enable capability permits efficient 1-byte error code writes without disturbing adjacent status flags; TSOP II package simplifies rework in high-volume SMT lines. |
Use Scenario: Aggregating sensor readings from multiple Zigbee/Thread endpoints before transmission. IC Role / Device Role / Timing Role: Low-power data staging buffer enabling burst-mode RF transmission to conserve energy. Use Value: 1.0 V data retention threshold allows memory to retain logs during deep-sleep periods powered only by supercapacitors; VFBGA footprint minimizes board area in compact gateways. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV25616BLL-45NLI | Same 256K × 16 organization and 45 ns speed, but single 2.7–3.6 V supply only; no 4.5–5.5 V support | Lacks dual-voltage flexibility; requires external regulator in 5 V systems | Select when design operates exclusively at 3.3 V and cost sensitivity outweighs voltage versatility |
| ON Semiconductor NVSRAM NCS25616-45G | Includes integrated EEPROM backup; higher standby current (25 µA); same 45 ns timing and industrial temp grade | Provides nonvolatile data retention on power loss, but consumes more quiescent power | Select when data persistence across power cycles is mandatory and 25 µA ISB is acceptable |
Compared with IS62WV25616BLL-45NLI and NCS25616-45G, the CY62146GN30-45BVXI uniquely delivers dual-voltage operation with lowest standby current (8.7 µA), making it optimal for battery-critical portable designs where voltage rail diversity and ultra-low leakage are jointly required.
Availability
CY62146GN30-45BVXI is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC I/O modules, and automotive body control units requiring stable component supply, long-term lifecycle assurance, and industrial temperature compliance.
Supply support for CY62146GN30-45BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.
The MoBL® (More Battery Life) SRAM product line was engineered specifically for ultra-low-power portable electronics, emphasizing sub-10 µA standby current, fast wake-up, and flexible voltage operation without performance trade-offs.
FAQ
What is the minimum VCC required to retain data in CY62146GN30-45BVXI?
The device guarantees data retention down to VCC = 1.0 V, as specified in the ICCDR parameter. At this voltage, maximum retention current is 13 µA, and the chip must be deselected (CE HIGH) to enter retention mode. This enables use in brown-out scenarios where system power rails sag but memory contents must persist.
Does CY62146GN30-45BVXI support true 5 V operation?
Yes - the device is fully rated for 4.5 V to 5.5 V operation, with guaranteed timing (45 ns), input thresholds (VIH ≥ 2.2 V), and output drive (VOL ≤ 0.4 V at 2.1 mA) across that range. No level shifting is needed when interfacing with legacy 5 V microcontrollers or peripheral ICs.
How does automatic power-down work when CE is HIGH?
When CE is driven HIGH while other inputs remain at valid CMOS levels, the device automatically enters ISB2 mode with ≤8.7 µA current draw. Address and data bus activity ceases, outputs go high-impedance, and internal circuitry powers down - no additional control signals or sequencing are required.
Can I use only the lower byte (I/O0–I/O7) without connecting BHE?
Yes - if BHE remains unconnected or held HIGH, only the lower byte (I/O0–I/O7) is active during reads/writes. BLE must be asserted LOW to enable lower-byte access; leaving BHE floating is not recommended, but tying it HIGH disables upper-byte functionality entirely and is electrically safe.
CY62146GN30-45BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62146GN30-45BVXI FAQ
1.How can I place an order for CY62146GN30-45BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62146GN30-45BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62146GN30-45BVXI reliable?
The price and inventory of CY62146GN30-45BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62146GN30-45BVXI is usually 5 days.
3.What payment methods are accepted for CY62146GN30-45BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62146GN30-45BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62146GN30-45BVXI?
CY62146GN30-45BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62146GN30-45BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62146GN30-45BVXI?
For technical support, including CY62146GN30-45BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62146GN30-45BVXI requirements.
6.How does Aetrix verify that CY62146GN30-45BVXI is sourced from the original manufacturer or authorized distributors?
All CY62146GN30-45BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62146GN30-45BVXI meets industry standards.
7.What is the process for return or replacement of CY62146GN30-45BVXI?
All CY62146GN30-45BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62146GN30-45BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62146GN30-45BVXI part is unused and in its original packaging.
Return procedure for CY62146GN30-45BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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