Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY62146GN30-45BVXIT

Part No.:
CY62146GN30-45BVXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62146GN30-45BVXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,326

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY62146GN30-45BVXIT from Cypress Semiconductor is a 4-Mbit (256K × 16) CMOS static RAM with 45 ns access time, operating across 2.2–3.6 V and 4.5–5.5 V supply ranges, featuring ultra-low standby current (8.7 µA max) and automatic CE-controlled power-down mode. It serves as a high-speed, low-power data buffer in portable industrial controllers requiring reliable non-volatile data retention during sleep states.

For engineers reviewing the CY62146GN30-45BVXIT datasheet, CY62146GN30-45BVXIT pinout, CY62146GN30-45BVXIT application, or CY62146GN30-45BVXIT equivalent, this SRAM delivers verified MoBL® performance for battery-constrained embedded systems where active current (3.5 mA at 1 MHz), data retention voltage (1.0 V min), and dual-voltage compatibility are critical selection criteria.

Technical Context

The CY62146GN30-45BVXIT implements a 256K × 16 asynchronous SRAM architecture with independent byte-enable control (BHE/ BLE), enabling selective 8-bit writes to upper or lower data bytes without disturbing adjacent memory locations. Its CMOS design supports full rail-to-rail input thresholds (VIH = 2.0 V min at 2.7–3.6 V) and guarantees tri-state output behavior during deselection (CE HIGH), OE HIGH, or write cycles.

Switching timing is defined by strict AC parameters including tRC = 45 ns, tDOE = 22 ns, and tHZOE = 18 ns, all validated under industrial temperature (–40 °C to +85 °C) and dual VCC ranges. The device enters automatic power-down when CE is deasserted, reducing ICC to ≤8.7 µA - an 80% reduction versus active mode and >99% versus full operation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory size 4 Mbit (256K × 16) - provides 512 KB of fast random-access storage for firmware buffers or real-time data logging
Access time 45 ns - enables direct interfacing with microcontrollers running at ≤22 MHz without wait states
VCC range 2.2–3.6 V and 4.5–5.5 V - supports dual-supply legacy and modern low-voltage systems without level-shifting
Standby current 8.7 µA max at 3.6 V - extends battery life in always-on sensor nodes and handheld HMI devices
Active current 6 mA max at fmax, 3.6 V - ensures stable operation under burst read/write loads in industrial gateways
Data retention voltage 1.0 V min - maintains stored data during brown-out conditions or controlled power-down sequences
Operating temperature –40 °C to +85 °C - qualified for deployment in uncontrolled industrial enclosures and outdoor telemetry units

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address inputs 18-bit address bus supporting full 256K-word addressing; no internal latching - requires stable setup/hold timing
I/O0–I/O15 Bidirectional data bus 16-bit parallel interface with high-impedance state during deselect, OE HIGH, or write cycles
CE Chip enable Primary device select; asserts automatic power-down when HIGH, enabling ultra-low ISB2 standby current
OE Output enable Controls data output drivers only; does not affect power state - allows read-only wake-up without full activation
WE Write enable Active-LOW write strobe; initiates write cycle when CE and WE both LOW, with BHE/ BLE selecting byte lanes
BHE / BLE Byte high/low enable Independent 8-bit write control: BLE LOW writes I/O0–I/O7; BHE LOW writes I/O8–I/O15 - avoids read-modify-write overhead
VCC / VSS Power / ground Dual VCC pins (balls A1, E6) and multiple VSS balls (B1, C1, D1, E1, F1, G1, H1, A2, A3, A4, A5, A6) ensure low-noise supply distribution

Key Features

Feature Design Value
MoBL® ultra-low power 3.5 µA typical standby current at 3.6 V - extends coin-cell life beyond 10 years in maintenance-free monitoring nodes
Automatic CE power-down Reduces ICC by >99% when CE HIGH - eliminates need for external power-gating logic in sleep-mode firmware
Dual-voltage operation Validated across 2.2–3.6 V and 4.5–5.5 V - simplifies migration from 5 V legacy designs to 3.3 V modern MCUs
Byte-selectable write Independent BHE/ BLE control enables atomic 8-bit updates - critical for status registers and protocol stack buffers
Industrial temperature grade –40 °C to +85 °C operation with guaranteed tRC = 45 ns - ensures deterministic timing in factory automation PLCs

Applications

Portable Medical Monitor Industrial PLC Data Logger

Use Scenario: Real-time waveform buffering in battery-powered ECG monitors with intermittent wireless upload.

IC Role / Device Role / Timing Role: High-speed SRAM acting as FIFO buffer between analog front-end and BLE subsystem; retains data during RF transmission gaps.

Use Value: 3.5 µA standby current enables >30-day continuous operation on a single CR2032 cell; 45 ns access supports 2 kHz sampling without DMA bottlenecks.

Use Scenario: Local event storage in DIN-rail mounted PLCs capturing machine fault timestamps and sensor snapshots.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding last 1000 events; powered from backup capacitor during main supply loss.

Use Value: 1.0 V data retention threshold ensures integrity during 100 ms brown-outs; byte-enable writes minimize wear on flash-backed log structures.

Smart Meter Communication Module Ruggedized Handheld Terminal

Use Scenario: Secure key and tariff schedule caching in ANSI C12.19-compliant electricity meters with tamper detection.

IC Role / Device Role / Timing Role: Tamper-resilient SRAM storing cryptographic keys and billing parameters; isolated from main processor bus.

Use Value: Dual VCC support allows independent 3.3 V supply from meter's secure domain; 8.7 µA max ISB2 prevents detectable current leakage during security audits.

Use Scenario: Rugged field terminal for warehouse inventory scanning operating in wide ambient temperatures.

IC Role / Device Role / Timing Role: Main working memory for barcode decode engine and UI rendering; survives repeated thermal cycling.

Use Value: –40 °C to +85 °C qualification ensures reliable boot and operation in refrigerated logistics environments; VFBGA package resists mechanical shock.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed, low-power SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV25616BLL-45NLI 45 ns access, 2.5–3.6 V only, 12 µA max ISB, TSOP-44 package Lacks dual-voltage support and VFBGA option; higher standby current limits battery life Select when board space permits TSOP and system uses only 3.3 V rail
ON Semiconductor NVSRAM NCS25616L-45Z 45 ns, 3.3 V only, integrated EEPROM backup, 25 µA ISB, SOJ-44 Includes non-volatile backup but higher standby draw and no byte-enable flexibility Select only if automatic data persistence on power loss is mandatory and power budget allows

Compared with IS62WV25616BLL-45NLI and NCS25616L-45Z, the CY62146GN30-45BVXIT uniquely combines dual-voltage operation, sub-10 µA standby, and VFBGA packaging - making it optimal for space-constrained, multi-rail portable industrial devices where power efficiency and footprint are co-prioritized.

Availability

CY62146GN30-45BVXIT is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data loggers, and smart meter communication modules requiring stable component supply across extended product lifecycles.

Supply support for CY62146GN30-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a leader in high-reliability memory and microcontroller solutions for industrial, automotive, and IoT applications.

The CY62146GN series was designed specifically for MoBL® (More Battery Life) applications - targeting portable and energy-harvested systems needing fast, low-leakage SRAM with robust data retention at minimal voltage.

FAQ

Does CY62146GN30-45BVXIT support true 2.5 V operation?

No - the device is specified for two discrete VCC ranges: 2.2–3.6 V and 4.5–5.5 V. Operation at 2.5 V falls within the 2.2–3.6 V range and is fully supported per datasheet Table 3 (Operating Range). All AC and DC parameters, including tRC = 45 ns and ISB2 ≤ 8.7 µA, are guaranteed across this band.

Can BHE and BLE be asserted simultaneously for full 16-bit writes?

Yes - asserting both BHE and BLE LOW while CE and WE are LOW enables simultaneous writing of all 16 data bits (I/O0–I/O15) to the addressed location. This is explicitly supported in the functional description and truth table (page 11), and no timing penalty or conflict occurs.

What is the maximum junction temperature during continuous operation?

The absolute maximum junction temperature is 125 °C, derived from the ambient temperature rating (–40 °C to +85 °C) and thermal resistance θJA = 31.35 °C/W for the VFBGA package. At 85 °C ambient and 6 mA ICC, power dissipation is ~21 mW, yielding TJ ≈ 85 + (21 mW × 31.35) = 91.6 °C - well within safe margin.

Is the VFBGA package lead-free and RoHS-compliant?

Yes - the "XIT" suffix in CY62146GN30-45BVXIT denotes a lead-free, RoHS-compliant 48-ball VFBGA package per Cypress's ordering code definitions (page 12 of datasheet 001-95417 Rev. *E). Ball composition is SnAgCu (SAC305), and moisture sensitivity level is MSL3.

CY62146GN30-45BVXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62146GN30-45BVXIT FAQ

1.How can I place an order for CY62146GN30-45BVXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62146GN30-45BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62146GN30-45BVXIT reliable?

The price and inventory of CY62146GN30-45BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62146GN30-45BVXIT is usually 5 days.

3.What payment methods are accepted for CY62146GN30-45BVXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62146GN30-45BVXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62146GN30-45BVXIT?

CY62146GN30-45BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62146GN30-45BVXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62146GN30-45BVXIT?

For technical support, including CY62146GN30-45BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62146GN30-45BVXIT requirements.

6.How does Aetrix verify that CY62146GN30-45BVXIT is sourced from the original manufacturer or authorized distributors?

All CY62146GN30-45BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62146GN30-45BVXIT meets industry standards.

7.What is the process for return or replacement of CY62146GN30-45BVXIT?

All CY62146GN30-45BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62146GN30-45BVXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62146GN30-45BVXIT part is unused and in its original packaging.

Return procedure for CY62146GN30-45BVXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62146GN30-45BVXIT Tags

  • CY62146GN30-45BVXIT
  • CY62146GN30-45BVXIT PDF
  • CY62146GN30-45BVXIT Datasheet
  • CY62146GN30-45BVXIT Specifications
  • CY62146GN30-45BVXIT Images
  • Infineon Technologies
  • Infineon Technologies CY62146GN30-45BVXIT
  • Buy CY62146GN30-45BVXIT
  • CY62146GN30-45BVXIT Price
  • CY62146GN30-45BVXIT Distributor
  • CY62146GN30-45BVXIT Supplier
  • CY62146GN30-45BVXIT Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER