Infineon Technologies CY62146GN30-45ZSXI
- Part No.:
- CY62146GN30-45ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62146GN30-45ZSXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62146GN30-45ZSXI from Cypress Semiconductor is a 4-Mbit (256K × 16) CMOS static RAM with 45 ns access time, industrial temperature range (–40 °C to +85 °C), dual voltage support (2.2–3.6 V and 4.5–5.5 V), ultra-low standby current (max 8.7 µA), and automatic CE power-down mode. It serves as main data buffer in portable telecom systems requiring battery life extension.
For engineers reviewing the CY62146GN30-45ZSXI datasheet, CY62146GN30-45ZSXI pinout, CY62146GN30-45ZSXI application, or CY62146GN30-45ZSXI equivalent, key selection criteria include TSOP II/VFBGA package compatibility, byte-enable-controlled 16-bit I/O partitioning, MoBL® low-power timing behavior, and industrial-grade voltage/temperature margining for embedded memory subsystems.
Technical Context
This SRAM implements a fully decoded 256K × 16 array with independent Byte High Enable (BHE) and Byte Low Enable (BLE) inputs enabling selective 8-bit writes to upper or lower data bytes without read-modify-write cycles. Address decoding covers A0–A17 (18-bit), supporting 262,144 unique locations.
Its automatic power-down logic reduces ICC by >99% when CE is HIGH and all address lines are stable, with guaranteed tPD ≤ 45 ns and tPU = 0 ns. Tri-state output control ensures clean bus sharing via OE, BHE, BLE, and CE-driven high-impedance transitions (tHZOE ≤ 18 ns, tLZCE ≤ 10 ns).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (256K × 16) - supports 32 KB of word-aligned data storage with no internal refresh overhead |
| Access Time | 45 ns - enables direct interface with 22 MHz synchronous controllers without wait states |
| VCC Range | 2.2–3.6 V or 4.5–5.5 V - allows interoperability with both 3.3 V and 5 V legacy systems |
| Standby Current | Max 8.7 µA at 3.6 V - extends battery runtime in always-on sleep modes for handheld devices |
| Active Current | Typ 3.5 mA at 1 MHz - minimizes thermal load during burst reads in portable instrumentation |
| Data Retention Voltage | Min 1.0 V - permits retention during brown-out conditions without external backup power |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial control and automotive infotainment head units |
Pinout & Package
Available in 44-pin TSOP II (ZSXI suffix) and 48-ball VFBGA packages. This variant (ZSXI) uses the 44-pin TSOP II footprint with standard JEDEC MO-143AC dimensions (12.0 mm × 20.0 mm × 1.2 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus selecting one of 256K locations; no internal latching - requires stable setup/hold relative to CE/OE |
| I/O0–I/O7 | Lower Byte Data I/O | Bi-directional 8-bit data path enabled only when BLE = LOW; high-impedance when deselected or during write |
| I/O8–I/O15 | Upper Byte Data I/O | Bi-directional 8-bit data path enabled only when BHE = LOW; independent control avoids full-word write penalties |
| CE | Chip Enable | Primary device select; HIGH forces automatic power-down and tri-states all outputs regardless of OE/BHE/BLE state |
| OE | Output Enable | Read-gating signal; must be LOW with CE LOW to place data on I/O pins; does not affect write operations |
| WE | Write Enable | Active-LOW write strobe; initiates write when CE and WE both LOW; timing-critical for tSD (25 ns min data setup) |
| BLE / BHE | Byte Enable Controls | Independent 8-bit write masking: BLE enables I/O0–I/O7, BHE enables I/O8–I/O15; both HIGH disables all I/O |
| VCC / VSS | Power / Ground | Dual VCC pins (pins 31, 32) and dual VSS pins (pins 35, 36) reduce IR drop and improve noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active current to 3.5 mA at 1 MHz and standby to 3.5 µA typical - extends battery life in cellular handsets |
| Automatic CE Power-Down Mode | Slashes ICC by >99% when CE HIGH and addresses stable - eliminates need for external power gating logic |
| Independent Byte Write Control | Enables true 8-bit writes via BLE/BHE without read-modify-write - cuts write latency and bus contention in microcontroller systems |
| Wide Dual-Voltage Operation | Supports 2.2–3.6 V and 4.5–5.5 V rails - simplifies migration from 5 V to 3.3 V designs while maintaining backward compatibility |
| Industrial Temperature Qualification | Guaranteed operation from –40 °C to +85 °C - suitable for deployment in factory automation PLCs and outdoor telemetry nodes |
Applications
| Portable Cellular Handsets | Industrial PLC Data Buffers |
|---|---|
|
Use Scenario: Storing call log, SMS, and firmware patch data in GSM/UMTS handsets with tight battery budget. IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding critical user data during sleep; accessed via 16-bit parallel bus at burst rates up to 22 MHz. Use Value: 8.7 µA max ISB2 enables multi-week standby without recharge; 45 ns tRC supports real-time voice buffer management. |
Use Scenario: Caching sensor acquisition buffers and HMI display frame data in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability scratchpad memory interfaced to ARM Cortex-M4 MCU with GPIO-controlled CE/OE timing. Use Value: –40 °C to +85 °C rating ensures uninterrupted operation in unconditioned cabinet environments; dual VCC range accommodates mixed-voltage backplanes. |
| Medical Patient Monitors | Automotive Infotainment Head Units |
|
Use Scenario: Buffering ECG waveform samples and alarm history in Class II medical devices requiring low-power continuous logging. IC Role / Device Role / Timing Role: Battery-backed SRAM holding real-time physiological data during AC power loss; retains data down to 1.0 V VDR. Use Value: 1.0 V data retention threshold allows graceful shutdown during brown-outs; 10 pF CIN/COUT minimizes signal integrity impact on 10 cm PCB traces. |
Use Scenario: Storing navigation map tiles and audio decode buffers in automotive head units with CAN/FlexRay coexistence. IC Role / Device Role / Timing Role: Parallel memory mapped to SoC AXI bus; isolated by BHE/BLE to avoid corruption during partial updates. Use Value: TSOP II package (ZSXI) meets AEC-Q200 vibration requirements; tHZOE ≤ 18 ns prevents bus contention with audio DSP peripherals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV25616BLL-45NLI | Same density, speed, and 44-pin TSOP II; 2.7–3.6 V only; higher ISB (15 µA max); no 4.5–5.5 V option | Lacks dual-voltage support - unsuitable for 5 V legacy automotive modules | Select if system operates exclusively at 3.3 V and requires second-source qualification |
| ON Semiconductor NVSRAM N25S80-45G1T3E | Non-volatile SRAM with integrated EEPROM backup; 45 ns access; 2.7–3.6 V only; larger 48-pin TSOPII package | Provides automatic data retention on power loss - adds cost and complexity where battery backup suffices | Choose only when persistent storage without external capacitor/battery is mandatory |
Compared with IS62WV25616BLL-45NLI and N25S80-45G1T3E, CY62146GN30-45ZSXI uniquely delivers dual-voltage operation and sub-10 µA standby across industrial temperature, making it optimal for cost-sensitive, battery-constrained portable and industrial systems requiring flexible rail compatibility.
Availability
CY62146GN30-45ZSXI is available at Aetrix Electronics and suitable for portable telecom devices, industrial PLCs, and automotive infotainment head units requiring stable component supply with long lifecycle visibility.
Supply support for CY62146GN30-45ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing low-power innovation and automotive-grade reliability.
CY62146GN belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for portable electronics where extended battery runtime and industrial temperature resilience are primary design constraints.
FAQ
What is the maximum clock frequency supported by CY62146GN30-45ZSXI?
CY62146GN30-45ZSXI has a 45 ns access time, supporting maximum bus frequencies up to approximately 22 MHz for read cycles without wait states. Its timing is asynchronous - no internal clock input exists. System timing must satisfy tRC ≥ 45 ns, tAA ≤ 45 ns, and tDOE ≤ 22 ns per the datasheet's switching characteristics table.
Can CY62146GN30-45ZSXI operate at 3.3 V and still meet its 45 ns specification?
Yes. The device is fully specified for 2.2–3.6 V operation, and all 45 ns timing parameters (including tRC, tAA, tACE) are guaranteed across this entire voltage range at industrial temperatures. Electrical characteristics tables confirm VOH, VOL, and ICC remain compliant at VCC = 3.3 V.
Does CY62146GN30-45ZSXI require external pull-up resistors on its control pins?
No. All control inputs (CE, OE, WE, BHE, BLE) are CMOS-compatible with TTL-level thresholds and do not require external pull-ups. The datasheet specifies VIH(min) = 1.8 V (at 2.2–2.7 V VCC) and VIL(max) = 0.6 V, ensuring robust noise margins without added components.
How does the automatic power-down feature behave when address lines float?
Automatic power-down activates only when CE is HIGH *and* all address inputs are stable (not toggling). Floating address lines may cause unintended address changes, preventing entry into deep standby. For guaranteed ISB2 ≤ 8.7 µA, tie unused address lines to fixed logic levels or use series resistors to damp noise.
CY62146GN30-45ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62146GN30-45ZSXI FAQ
1.How can I place an order for CY62146GN30-45ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62146GN30-45ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62146GN30-45ZSXI reliable?
The price and inventory of CY62146GN30-45ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62146GN30-45ZSXI is usually 5 days.
3.What payment methods are accepted for CY62146GN30-45ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62146GN30-45ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62146GN30-45ZSXI?
CY62146GN30-45ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62146GN30-45ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62146GN30-45ZSXI?
For technical support, including CY62146GN30-45ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62146GN30-45ZSXI requirements.
6.How does Aetrix verify that CY62146GN30-45ZSXI is sourced from the original manufacturer or authorized distributors?
All CY62146GN30-45ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62146GN30-45ZSXI meets industry standards.
7.What is the process for return or replacement of CY62146GN30-45ZSXI?
All CY62146GN30-45ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62146GN30-45ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62146GN30-45ZSXI part is unused and in its original packaging.
Return procedure for CY62146GN30-45ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62146GN30-45ZSXI Tags

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