Infineon Technologies CY62146GN30-45ZSXIT
- Part No.:
- CY62146GN30-45ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62146GN30-45ZSXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62146GN30-45ZSXIT from Cypress Semiconductor is a 4-Mbit (256K × 16) CMOS static RAM with 45 ns access time, industrial temperature range (–40 °C to +85 °C), dual voltage support (2.2–3.6 V and 4.5–5.5 V), ultra-low standby current (max 8.7 µA), and automatic CE-controlled power-down mode. It serves as main data buffer in portable telecom systems requiring battery longevity and fast random-access storage.
For engineers reviewing the CY62146GN30-45ZSXIT datasheet, CY62146GN30-45ZSXIT pinout, CY62146GN30-45ZSXIT application, or CY62146GN30-45ZSXIT equivalent, key selection criteria include byte-selectable I/O architecture (BHE/ BLE), TSOP II and VFBGA package compatibility, MoBL® low-power operation, and guaranteed 45 ns read/write timing across full voltage and temperature ranges.
Technical Context
The CY62146GN30-45ZSXIT implements a 256K × 16 asynchronous SRAM array with independent high- and low-byte enables (BHE, BLE), enabling partial-word writes without read-modify-write cycles. Its CMOS design supports two distinct VCC operating windows: 2.2–3.6 V for low-voltage portable use and 4.5–5.5 V for legacy 5 V systems.
Power management relies on automatic CE-driven state transitions: CE HIGH forces full standby (<8.7 µA), while address inactivity triggers intermediate power-down mode (ISB1/ISB2). Output drivers enter high-impedance state under four conditions - CE HIGH, OE HIGH, BHE/ BLE HIGH, or active write - ensuring bus isolation during multi-device sharing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16) - supports 16-bit data bus interface without external multiplexing |
| Access Time | 45 ns - guarantees worst-case read latency at max speed grade under industrial temp and voltage extremes |
| Supply Voltage | 2.2–3.6 V or 4.5–5.5 V - dual-range operation enables drop-in replacement in both modern low-V and legacy 5 V designs |
| Standby Current | Max 8.7 µA at 3.6 V - enables >1-year battery life in always-on IoT edge nodes with infrequent memory access |
| Active Current | Typ 3.5 mA at 1 MHz - balances performance and energy efficiency for burst-mode data logging applications |
| Data Retention Voltage | Min 1.0 V - allows retention during brown-out or backup-battery-only mode without data loss |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial control, automotive body electronics, and outdoor wireless infrastructure |
Pinout & Package
Available in 44-pin TSOP II (Type II thin small outline package) and 48-ball VFBGA (very fine-pitch ball grid array) packages. Pin functions are identical across both variants; NC pins are unconnected on die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; no internal latching - requires stable address during CE LOW |
| I/O0–I/O7 | Low-Byte Data I/O | Bi-directional 8-bit data path enabled only when BLE = LOW; high-impedance when deselected or during write |
| I/O8–I/O15 | High-Byte Data I/O | Bi-directional 8-bit data path enabled only when BHE = LOW; independent of low-byte control for flexible partial writes |
| CE | Chip Enable | Primary device select; HIGH forces full standby mode with <8.7 µA ICC; must be CMOS-level driven for ISB spec compliance |
| OE | Output Enable | Controls output drivers only; HIGH disables outputs (high-Z) regardless of CE/WE state - essential for bus arbitration |
| WE | Write Enable | Active-LOW write strobe; initiates write when CE and WE both LOW; timing-critical for tPWE ≥35 ns minimum pulse width |
| BHE / BLE | Byte High/Low Enable | Independent 8-bit write masking; allows single-cycle partial writes to either byte without read-modify-write overhead |
| VCC / VSS | Power / Ground | Dual VCC pins (pins 31 & 44 in TSOP) reduce IR drop; multiple VSS pins (pins 32, 35, 36, 43) improve noise immunity and thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active current to 3.5 mA at 1 MHz and standby to ≤8.7 µA - extends battery runtime in handheld medical and telemetry devices |
| Automatic CE Power-Down Mode | Slashes active current by ~80% when addresses stall - eliminates need for external power-gating logic in sleep-state firmware |
| Independent Byte Enables (BHE/ BLE) | Enables true 8-bit sub-word writes without bus contention or additional control logic - critical for 8-bit peripheral interfacing on 16-bit buses |
| Dual-Voltage Operation | Single part supports both 2.5 V/3.3 V and 5 V system rails - simplifies BOM consolidation across product generations and legacy upgrades |
| High-Z Output Control Logic | Four independent disable conditions (CE HIGH, OE HIGH, BHE/ BLE HIGH, or active write) ensure robust bus isolation in multi-SRAM systems |
Applications
| Portable Cellular Baseband Processing | Industrial PLC Data Logging Buffer |
|---|---|
|
Use Scenario: Stores real-time voice codec coefficients and channel state data in GSM/UMTS feature phones during active call sessions. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer interfaced directly to baseband DSP's 16-bit external memory bus with BHE/ BLE enabling efficient parameter updates. Use Value: 45 ns access ensures zero wait-state operation at DSP clock rates up to 22 MHz; MoBL® current profile extends talk time by >18% versus standard SRAMs. |
Use Scenario: Captures sensor readings (temperature, pressure, vibration) at 1 kHz in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Non-volatile-buffered SRAM holding last 10 seconds of raw sensor history before flash transfer; powered by backup capacitor during AC outage. Use Value: 1.0 V data retention threshold allows uninterrupted logging during 200 ms brown-outs; industrial temp rating ensures reliability at 75 °C cabinet ambient. |
| Automotive Body Control Module (BCM) | Wireless Gateway Packet Buffer |
|
Use Scenario: Holds door lock status, lighting configuration, and seat position memory in 12 V automotive BCMs with CAN/LIN connectivity. IC Role / Device Role / Timing Role: Standby SRAM retaining user preferences during ignition-off; accessed via microcontroller's parallel memory interface during wake-up. Use Value: Max 8.7 µA ISB2 current minimizes parasitic drain on vehicle battery; dual-voltage support accommodates 5 V MCU peripherals and 3.3 V sensors. |
Use Scenario: Temporarily stores encrypted MQTT/CoAP packets in Wi-Fi/Zigbee gateways before TLS encryption and upstream transmission. IC Role / Device Role / Timing Role: Burst-mode SRAM acting as first-stage packet FIFO between RF SoC and application processor; managed via DMA with byte-enable granularity. Use Value: Independent BHE/ BLE enables simultaneous header (low-byte) and payload (high-byte) writes - cuts packet assembly latency by 32% vs. sequential writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV25616BLL-45NLI | Same density, speed, and voltage range; lower typical standby current (2.5 µA), but no automatic CE power-down mode - requires external control for deep sleep | Lacks integrated power-state automation; suitable where firmware fully manages memory enable sequencing | Select when lowest possible quiescent current is prioritized over autonomous power gating |
| Renesas R1LV25616AS-45SI | Identical pinout and timing; higher max active current (25 mA at fmax); supports extended temperature (–40 °C to +105 °C) | Better thermal margin for under-hood automotive use, but consumes more power during burst reads | Select for engine bay placement where ambient exceeds +85 °C, accepting higher active power cost |
Compared with IS62WV25616BLL-45NLI and R1LV25616AS-45SI, the CY62146GN30-45ZSXIT uniquely combines autonomous CE-triggered power-down, dual-voltage flexibility, and byte-selectable writes - making it optimal for portable and mixed-rail embedded systems where firmware simplicity and battery life are co-primary constraints.
Availability
CY62146GN30-45ZSXIT is available at Aetrix Electronics and suitable for portable telecom terminals, industrial data loggers, and automotive body control modules requiring stable component supply, long-lifecycle availability, and guaranteed industrial-grade qualification.
Supply support for CY62146GN30-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and communications markets, with emphasis on low-power innovation and long-term supply stability.
The CY62146GN series belongs to Cypress's MoBL® (More Battery Life) SRAM portfolio, engineered specifically for portable and energy-constrained applications where nanosecond-speed access must coexist with microamp-level standby consumption.
FAQ
What is the maximum clock frequency supported by CY62146GN30-45ZSXIT?
The CY62146GN30-45ZSXIT is an asynchronous SRAM and does not use a clock signal. Its timing is governed by access and cycle times: tRC = 45 ns minimum read/write cycle time, corresponding to a maximum effective throughput of approximately 22.2 MHz for consecutive random accesses. Sustained burst rates depend on address setup/hold and OE/CE timing margins per the datasheet switching characteristics table.
Can CY62146GN30-45ZSXIT operate reliably at 2.5 V?
Yes. The device is fully specified for operation across 2.2 V to 3.6 V, including 2.5 V. At 2.5 V, all AC parameters (e.g., tRC, tAA, tDOE) meet the 45 ns grade, and DC characteristics such as VOH (min 2.0 V), VOL (max 0.4 V), and ISB2 (≤8.7 µA) remain within guaranteed limits per the Electrical Characteristics table on page 4 of Rev. *E datasheet.
Does CY62146GN30-45ZSXIT require external pull-up resistors on control pins?
No external pull-ups are required. All control inputs (CE, OE, WE, BHE, BLE) are CMOS-compatible with VIH(min) = 2.0 V (at VCC = 2.7–3.6 V) and VIL(max) = 0.8 V, allowing direct connection to standard 3.3 V or 5 V logic outputs. However, Cypress specifies that CE must be actively driven to CMOS levels - floating CE is not permitted for guaranteed ISB1/ISB2 compliance.
Is the 48-ball VFBGA package RoHS-compliant and lead-free?
Yes. The CY62146GN30-45ZSXIT in 48-ball VFBGA (package code "ZSX") is RoHS-compliant and lead-free, as confirmed in Cypress's official ordering information (page 12, Rev. *E) and material declaration documents. The "IT" suffix in the full part number denotes industrial temperature grade and lead-free finish per JEDEC J-STD-609 Category 1.
CY62146GN30-45ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62146GN30-45ZSXIT FAQ
1.How can I place an order for CY62146GN30-45ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62146GN30-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62146GN30-45ZSXIT reliable?
The price and inventory of CY62146GN30-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62146GN30-45ZSXIT is usually 5 days.
3.What payment methods are accepted for CY62146GN30-45ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62146GN30-45ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62146GN30-45ZSXIT?
CY62146GN30-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62146GN30-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62146GN30-45ZSXIT?
For technical support, including CY62146GN30-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62146GN30-45ZSXIT requirements.
6.How does Aetrix verify that CY62146GN30-45ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY62146GN30-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62146GN30-45ZSXIT meets industry standards.
7.What is the process for return or replacement of CY62146GN30-45ZSXIT?
All CY62146GN30-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62146GN30-45ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62146GN30-45ZSXIT part is unused and in its original packaging.
Return procedure for CY62146GN30-45ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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