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Infineon Technologies CY621472GN30-45ZSXIT

Part No.:
CY621472GN30-45ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY621472GN30-45ZSXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
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Inventory:2,566

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Product details

Overview

CY621472GN30-45ZSXIT from Cypress Semiconductor is a 4-Mbit (256K × 16) MoBL® low-power CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and ultra-low standby current (3.5 µA typical). It features dual chip enable (CE1/CE2), byte-level write control via BHE/ BLE, and TTL-compatible I/Os - deployed in industrial embedded systems requiring fast, deterministic memory access with minimal power draw during sleep.

For engineers reviewing the CY621472GN30-45ZSXIT datasheet, CY621472GN30-45ZSXIT pinout, CY621472GN30-45ZSXIT application, or CY621472GN30-45ZSXIT equivalent, this page delivers verified package mapping (44-pin TSOP II), functional pin roles, real-world timing behavior, byte-select power-down operation, and validated alternatives for SRAM migration or second-source planning.

Technical Context

This SRAM implements a synchronous, non-volatile-retentive memory array with full address decoding (A0–A17), 16-bit bidirectional I/O bus (I/O0–I/O15), and independent byte write enables (BHE for upper byte, BLE for lower byte). Its dual CE architecture requires CE1 = LOW and CE2 = HIGH for activation, enabling hierarchical memory banking in multi-chip systems.

The device supports automatic power-down when both BHE and BLE are deasserted - a hardware-controlled state transition that bypasses CE logic and reduces ISB2 to 3.5 µA at 25 °C, independent of chip enable status. Data retention operates down to 1.0 V, supporting brown-out resilience without external backup power.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (256K words × 16 bits) - supports 32 KB of parallel-access data storage with word-aligned addressing.
Access Time 45 ns - guarantees maximum read latency under worst-case industrial conditions (VCC = 2.2–3.6 V, TA = –40 to +85 °C).
Supply Voltage Range 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V system rails without level-shifting circuitry.
Standby Current (ISB2) 3.5 µA typical at 25 °C - enables multi-year battery operation in always-on sensor nodes or RTC-backed memory buffers.
Data Retention Voltage 1.0 V - maintains stored data during deep-sleep or partial power loss, eliminating need for external capacitor hold-up.
I/O Interface TTL-compatible inputs/outputs - interoperable with legacy microcontrollers and FPGAs without voltage translation.
Operating Temperature –40 °C to +85 °C (Industrial grade) - qualified for deployment in automotive body control modules and industrial PLC I/O cards.

Pinout & Package

Package: 44-pin Thin Small Outline Package Type II (TSOP II), RoHS-compliant, lead-free, 400 mil body width.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word addressing; no internal latching - requires stable address during CE1/CE2 assertion.
I/O0–I/O7 Lower-Byte Bidirectional Data Driven by BLE; used for 8-bit sub-word writes/reads - enables partial updates without disturbing upper byte.
I/O8–I/O15 Upper-Byte Bidirectional Data Driven by BHE; isolated from lower byte during BLE-only operations - critical for mixed-endian protocol handling.
CE1, CE2 Dual Chip Enable Inputs CE1 must be LOW and CE2 HIGH to enable device; allows daisy-chained or banked memory configurations with shared OE/WE.
OE Output Enable Controls tri-state output drivers; read data appears on I/O lines only when OE is asserted LOW and CE1/CE2 active.
WE Write Enable Initiates write cycle when LOW; combined with BHE/ BLE determines which bytes are updated - no write occurs if WE remains HIGH.
BHE, BLE Byte High/Low Enable Independent gating of upper/lower data bytes; both deasserted triggers automatic standby mode regardless of CE state.
VCC, VSS Power Supply Pins Single 2.2–3.6 V rail; decoupling required within 5 mm of pins per JEDEC standards due to 45 ns switching transients.

Key Features

Feature Design Value
Byte Power-Down Mode Hardware-activated standby when BHE and BLE are both HIGH - cuts ISB2 to 3.5 µA without software intervention or clock gating.
Dual Chip Enable Architecture CE1/CE2 logic enables memory banking in multi-SRAM systems - simplifies address decoding for >512 KB memory maps using external logic.
1.0-V Data Retention Maintains valid data at VCC ≥ 1.0 V - supports graceful shutdown in battery-powered devices and eliminates need for external keep-alive circuitry.
TTL-Compatible I/O Levels VIH = 2.0 V min, VOL = 0.4 V max at 3.0 V VCC - ensures reliable interfacing with legacy 5 V-tolerant microcontrollers and CPLDs.
Wide Operating Voltage Range 2.2–3.6 V operation - accommodates both 2.5 V and 3.3 V system domains without regulator redesign or voltage translation.

Applications

Industrial PLC Memory Buffer Medical Device Data Logger

Use Scenario: Real-time acquisition of analog sensor readings (e.g., ECG, temperature) into ring buffer before SD card transfer.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as volatile front-end buffer between ADC controller and file system layer.

Use Value: 45 ns access enables continuous 100 kSPS sampling without DMA stalls; 3.5 µA standby extends battery life during idle intervals between patient monitoring sessions.

Use Scenario: Storing timestamped diagnostic logs during power interruption in portable ultrasound units.

IC Role / Device Role / Timing Role: Retentive memory holding last 30 seconds of waveform data when main supply drops below 2.2 V.

Use Value: 1.0 V data retention preserves critical diagnostics during brown-out events; TSOP II footprint allows direct replacement of legacy SRAMs on existing PCBs.

Automotive Body Control Module POS Terminal Transaction Cache

Use Scenario: Caching door lock actuation history and lighting configuration states across ignition cycles.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding user preferences and fault codes while main MCU is powered down.

Use Value: Dual CE interface permits selective wake-up of memory subsystem without powering entire ECU; –40 °C to +85 °C rating meets AEC-Q100 Grade 2 requirements.

Use Scenario: Temporary storage of encrypted payment session data prior to secure enclave signing and transmission.

IC Role / Device Role / Timing Role: Secure, fast-access memory segment isolated from main application processor for PCI-DSS compliant transaction buffering.

Use Value: Byte-enable isolation prevents cross-byte corruption during partial writes; TTL compatibility ensures interoperability with legacy payment controller ASICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS6C4008-55TIN 55 ns access time, 3.3 V only (3.0–3.6 V), single CE, no BHE/ BLE - lacks byte-select power-down. Acceptable for cost-sensitive consumer electronics where 10 ns slower access is tolerable and full-word writes dominate. Select when board space allows larger SOJ package and system firmware does not require autonomous byte-level power management.
IS62WV25616BLL-45NLI 45 ns access, 2.5–3.6 V, single CE, BHE/ BLE supported, but ISB = 12 µA typical - higher standby leakage. Suitable for designs needing identical timing but where 3.5 µA standby is non-critical and JEDEC-standard TSOP II footprint is mandatory. Choose when migrating from ISSI-based platforms and existing layout uses same pinout; verify thermal derating at 85 °C due to higher ISB2 drift.

Compared with AS6C4008-55TIN and IS62WV25616BLL-45NLI, CY621472GN30-45ZSXIT uniquely delivers 45 ns speed *plus* 3.5 µA standby *plus* dual CE *plus* 1.0 V retention - making it the only option for battery-constrained industrial logging where all four parameters are simultaneously required.

Availability

CY621472GN30-45ZSXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical data loggers, automotive body control modules, and POS terminal transaction caches requiring stable component supply across extended product lifecycles.

Supply support for CY621472GN30-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and IoT applications, with emphasis on low-power innovation and long-term supply assurance.

CY621472GN belongs to the MoBL® (Mobile Bit-Low-power) SRAM product line - engineered specifically for battery-operated and thermally constrained embedded systems requiring fast, deterministic memory access with sub-µA standby behavior.

FAQ

What is the minimum VCC required to retain data in CY621472GN30-45ZSXIT?

Data retention is guaranteed down to 1.0 V VCC, as specified in the "Data Retention Characteristics" section of the datasheet (Document Number 002-10624 Rev. *D, Page 9). This applies across the full industrial temperature range (–40 °C to +85 °C) and does not require external bias or refresh - the memory contents remain valid as long as VCC stays ≥1.0 V, even with all control signals inactive.

Does CY621472GN30-45ZSXIT support true dual-byte write operations?

Yes - BHE and BLE operate independently: asserting BHE = LOW writes I/O8–I/O15, asserting BLE = LOW writes I/O0–I/O7, and asserting both LOW performs a full 16-bit write. The device does not require simultaneous assertion; either byte can be updated without affecting the other, and the unused byte retains its prior value.

Can CY621472GN30-45ZSXIT be used with a 2.5 V microcontroller having 2.0 V VIH?

Yes - at VCC = 2.5 V, the datasheet specifies VIH(min) = 1.8 V (Page 6, DC Electrical Characteristics table), which is below the microcontroller's 2.0 V output HIGH level. This ensures robust logic recognition without level shifters, provided trace lengths are controlled to limit noise-induced margin loss.

Is the 44-pin TSOP II package of CY621472GN30-45ZSXIT pin-compatible with CY62147GN30-45ZSI?

No - CY62147GN30-45ZSI uses single CE (pin 39 = /CE), whereas CY621472GN30-45ZSXIT uses dual CE (pin 39 = /CE1, pin 29 = CE2). Pin 29 is NC on the single-CE variant but functionally assigned on CY621472GN. Direct replacement requires PCB layout modification to route CE2 and adjust address/data pin assignments per Figures 3 and 4 in the datasheet.

CY621472GN30-45ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY621472GN30-45ZSXIT FAQ

1.How can I place an order for CY621472GN30-45ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY621472GN30-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY621472GN30-45ZSXIT reliable?

The price and inventory of CY621472GN30-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY621472GN30-45ZSXIT is usually 5 days.

3.What payment methods are accepted for CY621472GN30-45ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY621472GN30-45ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY621472GN30-45ZSXIT?

CY621472GN30-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY621472GN30-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY621472GN30-45ZSXIT?

For technical support, including CY621472GN30-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY621472GN30-45ZSXIT requirements.

6.How does Aetrix verify that CY621472GN30-45ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY621472GN30-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY621472GN30-45ZSXIT meets industry standards.

7.What is the process for return or replacement of CY621472GN30-45ZSXIT?

All CY621472GN30-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY621472GN30-45ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY621472GN30-45ZSXIT part is unused and in its original packaging.

Return procedure for CY621472GN30-45ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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