Infineon Technologies CY62147DV30LL-70BVXA
- Part No.:
- CY62147DV30LL-70BVXA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62147DV30LL-70BVXA.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,364
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Product details
Overview
CY62147DV30LL-70BVXA from Cypress Semiconductor is a 4-Mbit (256K × 16) low-voltage CMOS static RAM with 70 ns access time, 2.2–3.6 V supply range, and industrial temperature rating (–40°C to +85°C). It features byte power-down control (BHE/BLE), automatic CE-based power-down, and ultra-low standby current (8 µA). Used in portable embedded systems requiring battery-efficient memory retention, such as handheld instrumentation and industrial data loggers.
For engineers reviewing the CY62147DV30LL-70BVXA datasheet, CY62147DV30LL-70BVXA pinout, CY62147DV30LL-70BVXA application, or CY62147DV30LL-70BVXA equivalent, key selection criteria include 70 ns read cycle time, dual-byte enable architecture, VFBGA-48 package compatibility, and MoBL®-optimized active/standby current specs (1.5 mA @ 1 MHz / 8 µA ISB2).
Technical Context
The CY62147DV30LL-70BVXA implements a synchronous, non-volatile-retentive SRAM array with full address decoding (A0–A17), independent high- and low-byte write enables (BHE/BLE), and tri-state I/O drivers (I/O0–I/O15). Its power-down circuitry activates automatically when CE is HIGH or both BHE and BLE are HIGH, reducing ICC to ≤8 µA.
It supports multiple read/write modes: OE-controlled reads, WE-controlled writes, and byte-selectable writes. Timing is defined by tRC = 70 ns, tAA = 70 ns, and tDOE = 35 ns, with input thresholds compliant to CMOS levels across 2.2–3.6 V VCC and guaranteed operation at –40°C to +85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K words × 16 bits = 4 Mbit; supports 16-bit parallel data bus without external multiplexing |
| Access Time (tRC) | 70 ns max; defines minimum clock-to-data interval for reliable read cycles at full speed |
| Supply Voltage Range | 2.20 V to 3.60 V; enables direct interface with 2.5 V and 3.3 V logic domains |
| Active Current (ICC) | 1.5 mA typical @ 1 MHz; enables >100-hour battery life in 3.0 V coin-cell-powered devices |
| Standby Current (ISB2) | 8 µA typical; reduces quiescent power to <2.5 µW at 3.3 V during sleep mode |
| Data Retention Voltage | VDR = 1.5 V min; allows memory state hold during brown-out or backup-battery operation |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade reliability without derating |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant (Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; no address multiplexing required |
| I/O0–I/O7 | Low-Byte Data I/O | Bi-directional 8-bit data path enabled only when BLE = LOW; high-impedance when disabled |
| I/O8–I/O15 | High-Byte Data I/O | Bi-directional 8-bit data path enabled only when BHE = LOW; independent of low-byte control |
| CE | Chip Enable | Primary device select; HIGH forces automatic power-down and places all I/Os in high-Z |
| OE | Output Enable | Controls output drivers only; does not affect internal power state or write capability |
| WE | Write Enable | Active-LOW signal initiating write; must be coordinated with CE and BHE/BLE for valid byte writes |
| BLE / BHE | Byte Low/High Enable | Independent controls for 8-bit write granularity; both HIGH deselects chip regardless of CE state |
| VCC / VSS | Power / Ground | Single-supply operation; VCC pins support decoupling via 0.1 µF ceramic capacitors per ball group |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active ICC to 1.5 mA @ 1 MHz and standby ISB2 to 8 µA - critical for battery longevity in portable designs |
| Dual-Byte Write Control (BHE/BLE) | Enables independent 8-bit writes without masking logic or external glue; eliminates need for byte-lane gating circuitry |
| Automatic CE Power-Down | Guarantees <99% power reduction when CE is HIGH - no software or timing-critical sequence required |
| 70 ns Read Cycle with Tri-State Outputs | tHZOE = 25 ns ensures clean bus release before next cycle; supports 14.3 MB/s sustained throughput on 16-bit bus |
| VFBGA-48 Footprint Compatibility | Matches industry-standard 6×8 mm layout; enables drop-in replacement for CY62147CV30/CY62147CV33 in space-constrained PCBs |
Applications
| Portable Medical Sensors | Industrial Data Loggers |
|---|---|
Use Scenario: Continuous acquisition of ECG/SpO₂ waveforms in battery-powered handheld monitors with 24+ hour runtime. IC Role / Device Role: Primary working memory buffer storing real-time sensor samples prior to compression and wireless upload. Use Value: 8 µA ISB2 and 1.5 mA ICC @ 1 MHz extend coin-cell life beyond 100 hours while maintaining 70 ns responsiveness for burst sampling. |
Use Scenario: Standalone environmental monitoring node logging temperature/humidity/pressure every 5 seconds in remote factory settings. IC Role / Device Role: Non-volatile-retentive scratchpad memory holding timestamped records during mains power loss. Use Value: VDR = 1.5 V allows retention down to backup battery voltage; -40°C to +85°C rating ensures operation in unconditioned enclosures. |
| Smart Meter Communication Modules | Automated Test Equipment (ATE) Controllers |
Use Scenario: PLC or RF mesh communication sub-system in ANSI C12.19-compliant smart meters handling firmware updates and event logs. IC Role / Device Role: Dual-port accessible RAM interfacing between host MCU and communication co-processor via shared 16-bit bus. Use Value: Independent BHE/BLE enables concurrent high/low byte writes from separate masters - eliminating arbitration overhead. |
Use Scenario: Real-time pattern generator in benchtop ATE requiring deterministic 70 ns memory access for waveform synthesis. IC Role / Device Role: High-speed instruction/data cache feeding FPGA-based sequencer controlling DUT stimulus and response capture. Use Value: tAA = 70 ns and tDOE = 35 ns guarantee sub-100 ns latency from address assertion to valid output - meeting tight timing closure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV25616BLL-70NLI | Same 256K×16 organization, 70 ns speed, but 2.7–3.6 V only; no 2.2 V support | Lacks MoBL® low-power optimization below 2.5 V; higher ICC (2.5 mA @ 1 MHz) | Select when system uses fixed 3.3 V rail and requires second-source availability |
| Cypress CY62147EV30LL-70BVXI | Pin-compatible upgrade with extended automotive-A temp range (–40°C to +85°C) and same 70 ns spec | Identical functionality but qualified to AEC-Q100 Grade 3; suitable for automotive infotainment head units | Select when automotive qualification and long-term supply assurance are mandatory |
Compared with IS62WV25616BLL-70NLI, CY62147DV30LL-70BVXA delivers 40% lower active current at 2.5 V and broader voltage flexibility; versus CY62147EV30LL-70BVXI, it trades automotive qualification for lower cost in industrial-only deployments.
Availability
CY62147DV30LL-70BVXA is available at Aetrix Electronics and suitable for portable medical sensors, industrial data loggers, and smart meter communication modules requiring stable component supply, long-lifecycle support, and Pb-free compliance.
Supply support for CY62147DV30LL-70BVXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and consumer applications.
The CY62147D series targets battery-sensitive embedded systems needing low-voltage, low-power SRAM with byte-level control - optimized for MoBL® (More Battery Life™) portable and edge-sensing applications.
FAQ
What is the maximum clock frequency supported for continuous read operations?
The CY62147DV30LL-70BVXA does not use a clock; it is an asynchronous SRAM. Its 70 ns read cycle time (tRC) implies a maximum sustained read rate of ~14.3 MHz on a 16-bit bus. Timing is governed by address setup/hold and CE/OE assertion, not a system clock. No external clock signal is required or supported.
Can BHE and BLE be used simultaneously for full 16-bit writes?
Yes - asserting both BHE and BLE LOW while CE and WE are LOW enables simultaneous write to I/O0–I/O7 and I/O8–I/O15, effectively performing a full 16-bit write. The device treats this as two concurrent byte writes to the same address, matching standard 16-bit SRAM behavior without requiring external byte masking.
Is the VFBGA-48 package compatible with reflow soldering per IPC-J-STD-020?
Yes - the CY62147DV30LL-70BVXA in VFBGA-48 is qualified for standard lead-free reflow profiles (peak 260°C, 60–90 sec above 217°C). Thermal resistance ΘJA = 72°C/W (still air) confirms suitability for convection-reflow processes on four-layer boards with appropriate thermal relief and stencil design.
Does the device retain data when VCC drops below 2.2 V but remains above VDR = 1.5 V?
Yes - data retention is guaranteed down to VDR = 1.5 V, provided CE is held HIGH or both BHE and BLE are HIGH to enter power-down mode. At VCC = 1.5 V, ICCDR is 6 µA (LL grade), enabling multi-day retention on small backup capacitors or primary batteries nearing end-of-life.
CY62147DV30LL-70BVXA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62147DV30LL-70BVXA FAQ
1.How can I place an order for CY62147DV30LL-70BVXA through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62147DV30LL-70BVXA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62147DV30LL-70BVXA reliable?
The price and inventory of CY62147DV30LL-70BVXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147DV30LL-70BVXA is usually 5 days.
3.What payment methods are accepted for CY62147DV30LL-70BVXA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147DV30LL-70BVXA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62147DV30LL-70BVXA?
CY62147DV30LL-70BVXA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62147DV30LL-70BVXA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62147DV30LL-70BVXA?
For technical support, including CY62147DV30LL-70BVXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147DV30LL-70BVXA requirements.
6.How does Aetrix verify that CY62147DV30LL-70BVXA is sourced from the original manufacturer or authorized distributors?
All CY62147DV30LL-70BVXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147DV30LL-70BVXA meets industry standards.
7.What is the process for return or replacement of CY62147DV30LL-70BVXA?
All CY62147DV30LL-70BVXA units undergo pre-shipment inspection (PSI). If there is an issue with CY62147DV30LL-70BVXA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62147DV30LL-70BVXA part is unused and in its original packaging.
Return procedure for CY62147DV30LL-70BVXA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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