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Infineon Technologies CY62147G18-55BVXI

Part No.:
CY62147G18-55BVXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62147G18-55BVXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,542

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Product details

Overview

CY62147G18-55BVXI from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 256K × 16, operating at 55 ns access time across 1.65–2.2 V supply. It features TTL-compatible I/Os, ERR pin for ECC event indication, and ultra-low standby current (3.5 µA typical). Used in industrial control modules requiring data integrity under voltage scaling and extended temperature operation.

For engineers reviewing the CY62147G18-55BVXI datasheet, CY62147G18-55BVXI pinout, CY62147G18-55BVXI application, or CY62147G18-55BVXI equivalent, key selection criteria include ECC-enabled memory reliability, dual-chip-enable support for bank isolation, 48-ball VFBGA packaging for high-density PCB layouts, and compatibility with 1.8 V logic systems.

Technical Context

This SRAM implements a synchronous, byte-selectable architecture with independent BHE/ BLE controls enabling upper- and lower-byte writes without full-word access. The integrated ECC engine performs real-time single-bit correction on read cycles and asserts the ERR pin upon detection-no automatic write-back is supported.

It supports three VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), with this variant specified for 1.65–2.2 V operation. Standby power is reduced via Byte Power Down mode: asserting both BHE and BLE LOW forces immediate transition to ISB2 (≤10 µA max), independent of CE state.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (256K words × 16-bit), providing 512 KB of addressable data space
Access Time 55 ns maximum at VCC = 1.8 V, enabling use in 18 MHz bus systems
VCC Range 1.65 V to 2.2 V - optimized for low-voltage industrial microcontroller interfaces
Standby Current 3.5 µA typical / 10 µA maximum - enables multi-year battery-backed retention in sleep modes
ECC Function Single-bit error correction with ERR output assertion - detects and corrects bit flips without software intervention
Package 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm footprint, 0.5 mm pitch
Operating Temp –40 °C to +85 °C (Industrial grade), validated for continuous operation in enclosed control cabinets

Pinout & Package

48-ball VFBGA package (ball pitch: 0.5 mm, body size: 6.0 mm × 8.0 mm, thickness: 0.75 mm). Pinout corresponds to CY62147G dual CE configuration without ERR pin (ordering suffix "X" indicates no ERR function).

Pin/Terminal Circuit Role Design Meaning
CE1, CE2 Dual chip enable inputs Device selected only when CE1 = LOW and CE2 = HIGH - enables interleaved bank addressing in multi-SRAM systems
WE Write enable input Active-LOW control for write cycles; latches data on rising edge of WE when OE is inactive
OE Output enable input Active-LOW control for read data output; places I/Os in HI-Z when deasserted
BHE, BLE Byte high/low enable inputs Independent control of I/O8–I/O15 (BHE) and I/O0–I/O7 (BLE); enables 8-bit sub-word access
A0–A17 Address inputs 18-bit address bus supporting 256K word locations; A17 is MSB for full 4-Mbit addressing
I/O0–I/O15 Bi-directional data bus 16-bit parallel interface with TTL-compatible voltage thresholds and 2.1 mA drive capability
VCC, VSS Power and ground terminals Dual VCC/VSS pairs per side reduce switching noise; supports simultaneous 1.8 V core and I/O operation

Key Features

Feature Design Value
Embedded ECC engine Corrects single-bit errors on every read cycle without CPU overhead or memory controller modification
Byte Power Down mode Reduces standby current to ≤10 µA by disabling internal array clocks when both BHE and BLE are LOW
Multi-voltage support Operates across 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V rails - simplifies migration across legacy and low-power platforms
TTL-compatible I/O Eliminates level-shifter requirements in mixed-voltage systems using 1.8 V or 3.3 V microcontrollers
Industrial temperature range Validated performance from –40 °C to +85 °C - suitable for DIN-rail mounted PLCs and motor drives

Applications

Industrial PLC Data Buffer Medical Diagnostic Imaging Cache

Use Scenario: Stores real-time sensor fusion outputs and motion control commands in programmable logic controllers with deterministic latency requirements.

IC Role / Device Role / Timing Role: Primary working memory buffer with ECC protection against cosmic-ray-induced bit flips in unshielded factory environments.

Use Value: Prevents silent data corruption during extended runtime; 55 ns access ensures <100 ns worst-case instruction fetch latency in ARM Cortex-M7-based control loops.

Use Scenario: Caches DICOM image tiles during ultrasound or MRI reconstruction pipelines where temporary storage must retain integrity across power cycles.

IC Role / Device Role / Timing Role: High-reliability frame buffer with error detection visible to host processor via ERR pin for diagnostic logging.

Use Value: Enables zero-error image stitching; 1.0 V data retention allows safe hold during brief brownouts without backup capacitors.

Railway Signaling Controller Memory Avionics Display Interface Buffer

Use Scenario: Holds critical interlocking logic states and track occupancy tables in EN 5012x-certified signaling hardware deployed in outdoor cabinets.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM with ECC, used alongside flash for fail-safe state recovery after reset.

Use Value: SER FIT rate <0.1 FIT/Mb meets SIL-2 functional safety targets; 8.7 µA max ISB2 reduces thermal load in sealed enclosures.

Use Scenario: Buffers rendered GUI frames between graphics processor and display driver IC in cockpit multifunction displays.

IC Role / Device Role / Timing Role: Low-latency pixel data staging memory with byte-access capability matching RGB565 pixel packing.

Use Value: BHE/ BLE enables efficient 16-bit pixel writes without masking; 48-ball VFBGA minimizes trace length for EMI-sensitive video paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV25616EDBLL-10MLI No embedded ECC; requires external error handling or controller-level correction Lacks hardware-level error reporting; unsuitable for safety-critical or unattended systems Select only if system-level ECC is already implemented and cost sensitivity outweighs reliability risk
Micron MT45W8MW16BGX-55IT:D DDR2 SDRAM with optional ECC; asynchronous interface replaced by clocked burst reads Higher bandwidth but introduces timing complexity and refresh overhead Prefer for throughput-bound applications where deterministic latency is secondary to aggregate bandwidth

Compared with IS61WV25616EDBLL-10MLI and MT45W8MW16BGX-55IT:D, CY62147G18-55BVXI delivers guaranteed single-bit correction with zero software dependency, deterministic 55 ns access, and true static operation-critical for real-time control and safety-certified designs where refresh cycles or external ECC logic introduce unacceptable risk.

Availability

CY62147G18-55BVXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, railway signaling controllers, and avionics display interfaces requiring stable component supply, long-term lifecycle assurance, and verified ECC functionality.

Supply support for CY62147G18-55BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.

CY62147G belongs to Infineon's MoBL® (Mobile Bitline) SRAM product line, engineered for ultra-low-power, ECC-enhanced data storage in space-constrained industrial and transportation systems.

FAQ

Does CY62147G18-55BVXI support automatic error correction write-back?

No. The device corrects single-bit errors during read operations and asserts the ERR pin, but does not perform automatic write-back to the memory array. Correction is transparent to the read data path only; the original corrupted bit remains unmodified in the array unless rewritten by the host system.

What is the function of the Byte Power Down mode?

When both BHE and BLE are held LOW while the device is deselected, CY62147G18-55BVXI enters a deep standby state with ISB2 ≤10 µA, regardless of CE1/CE2 states. This feature eliminates need for external power gating and reduces leakage in partial-sleep system architectures.

Is the ERR pin present on CY62147G18-55BVXI?

No. The "X" in the ordering code CY62147G18-55BVXI denotes the standard CY62147G variant without ERR pin. Only CY62147GE variants (e.g., CY62147GE18-55BVXI) include the ERR output. This part uses dual CE and relies on external monitoring of system-level parity or checksums.

Can CY62147G18-55BVXI operate at 1.0 V?

No. Minimum operating VCC is 1.65 V. However, it supports 1.0 V data retention - meaning stored data remains valid when VCC is reduced to 1.0 V during standby, provided ambient temperature stays within specification limits.

CY62147G18-55BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
1.65V ~ 2.2V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62147G18-55BVXI FAQ

1.How can I place an order for CY62147G18-55BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62147G18-55BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62147G18-55BVXI reliable?

The price and inventory of CY62147G18-55BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147G18-55BVXI is usually 5 days.

3.What payment methods are accepted for CY62147G18-55BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147G18-55BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62147G18-55BVXI?

CY62147G18-55BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62147G18-55BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62147G18-55BVXI?

For technical support, including CY62147G18-55BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147G18-55BVXI requirements.

6.How does Aetrix verify that CY62147G18-55BVXI is sourced from the original manufacturer or authorized distributors?

All CY62147G18-55BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147G18-55BVXI meets industry standards.

7.What is the process for return or replacement of CY62147G18-55BVXI?

All CY62147G18-55BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62147G18-55BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62147G18-55BVXI part is unused and in its original packaging.

Return procedure for CY62147G18-55BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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