Infineon Technologies CY62147G18-55BVXIT

Overview

CY62147G18-55BVXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 256K × 16-bit, operating at 55 ns access time across 1.65–2.2 V supply. It features TTL-compatible I/Os, ERR output for ECC event indication, and ultra-low standby current (3.5 µA typical). Used in industrial control modules requiring data integrity under radiation-prone or long-term operation conditions.

For engineers reviewing the CY62147G18-55BVXIT datasheet, CY62147G18-55BVXIT pinout, CY62147G18-55BVXIT application, or CY62147G18-55BVXIT equivalent, key selection factors include ECC-enabled reliability, dual/single chip enable flexibility, 48-ball VFBGA package compatibility, and multi-voltage support (1.65–2.2 V) for low-power embedded systems.

Technical Context

This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles, with dedicated ERR pin assertion (HIGH) signaling correction events. The memory array uses standard CMOS architecture with row/column decoding and sense amplifiers optimized for low-voltage operation.

It supports byte-level write control via BHE/ BLE inputs, HI-Z tri-state outputs during deselection, and seamless Byte Power Down mode when both byte enables are inactive - enabling dynamic power gating independent of CE state. Address range spans A0–A17 (18 bits), supporting full 256K-word addressing.

Key Specifications

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Compared with IS61WV25616BLL-10MLI and MT45W8MW16BGX-55 IT:B, CY62147G18-55BVXIT delivers integrated, zero-latency ECC correction in an asynchronous SRAM footprint - eliminating design complexity and validation effort for safety-critical embedded memory.

Availability

CY62147G18-55BVXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical data loggers, railway signaling systems, and avionics health monitors requiring stable component supply and long-term lifecycle assurance.

Supply support for CY62147G18-55BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and reliable memory solutions for industrial and safety-critical applications.

CY62147G18-55BVXIT belongs to the MoBL® (Mobile Bit-Low-power) SRAM product line, designed specifically for battery-constrained and radiation-sensitive embedded systems demanding error-resilient, non-volatile-equivalent data storage without refresh overhead.

FAQ

Does CY62147G18-55BVXIT support automatic error write-back after correction?

No. The device performs single-bit error detection and correction during read cycles but does not automatically write the corrected data back to the memory array. Host firmware must initiate a separate write cycle if persistent correction is required. This behavior is explicitly documented in Note 1 of the datasheet and confirmed in the functional description section.

What is the function of the ERR pin, and how is it electrically configured?

The ERR pin is an open-drain output that asserts HIGH during a read cycle when a single-bit error is detected and corrected. It requires an external pull-up resistor (typically 4.7 kΩ to V_CC) and remains inactive (HIGH-Z) otherwise. Its timing aligns with read data validity, allowing synchronous sampling by the host controller without additional strobes.

Can CY62147G18-55BVXIT operate across multiple V_CC ranges simultaneously?

No. The device must be powered from a single V_CC rail within one of three specified ranges: 1.65–2.2 V, 2.2–3.6 V, or 4.5–5.5 V. Internal voltage regulation is not provided, and mixing rails violates absolute maximum ratings. The selected range determines AC timing parameters and DC current consumption values.

Is the 48-ball VFBGA package of CY62147G18-55BVXIT compatible with standard reflow profiles?

Yes. The package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤ 260 °C). Board layout must follow Infineon's recommended pad stack and stencil design guidelines in Package Diagrams (page 19 of datasheet) to ensure solder joint reliability.