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Infineon Technologies CY62147G30-45B2XIT

Part No.:
CY62147G30-45B2XIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62147G30-45B2XIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,794

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Product details

Overview

CY62147G30-45B2XIT from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 256K × 16, operating at 45 ns access time across 2.2 V–3.6 V supply range. It features TTL-compatible I/Os, ERR pin for real-time ECC event indication, and ultra-low standby current (8.7 µA max). Used in industrial control modules requiring data integrity under voltage fluctuation and extended temperature cycling.

For engineers reviewing the CY62147G30-45B2XIT datasheet, CY62147G30-45B2XIT pinout, CY62147G30-45B2XIT application, or CY62147G30-45B2XIT equivalent, this page delivers verified package mapping (48-ball VFBGA), ECC functional behavior, byte-select power-down logic, dual CE interface timing, and validated alternatives for memory subsystem hardening.

Technical Context

This SRAM implements a synchronous, CMOS-based memory array with integrated ECC encoder/decoder logic that detects and corrects single-bit errors on every read cycle without automatic write-back. The ERR output asserts HIGH only during correction events, enabling external fault logging.

It supports dual chip enable (CE1/CE2) addressing with CE1 LOW and CE2 HIGH for activation, and uses BHE/ BLE to gate upper/lower byte writes independently. Byte Power Down mode activates when both BHE and BLE are deasserted, forcing immediate transition to standby regardless of CE state.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (256K words × 16-bit) - provides 512 KB of word-accessible storage with ECC protection per 16-bit word
Access Time 45 ns - guarantees maximum read latency at 22.22 MHz operation under 2.2–3.6 V supply
VCC Range 2.2 V to 3.6 V - enables direct interfacing with 2.5 V and 3.3 V logic families without level shifters
Standby Current 8.7 µA max - ensures sub-10 µA quiescent draw for battery-backed industrial systems
ECC Function Single-bit error correction + detection - corrects one bit per 16-bit word; no automatic write-back required
ERR Pin Dedicated open-drain output - signals correction event via HIGH assertion during read cycle
Data Retention 1.0 V minimum - retains valid data down to 1.0 V VCC, supporting graceful shutdown in brown-out conditions

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word addressing; A12–A17 used for row/column decoding
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; high-impedance when deselected or OE/BLE/BHE inactive
CE1, CE2 Dual Chip Enable Inputs Active-LOW CE1 and active-HIGH CE2 jointly enable device; eliminates need for external gating logic
WE Write Enable Input Active-LOW control for write cycles; latches data on falling edge synchronized with address setup
OE Output Enable Input Active-LOW control for read data output; allows shared bus operation with other peripherals
BHE, BLE Byte Enable Inputs Control upper (I/O8–I/O15) and lower (I/O0–I/O7) byte writes independently; enables 8-bit microcontroller compatibility
ERR Error Indication Output Open-drain output asserted HIGH during single-bit correction; requires external pull-up for logic-level compatibility
VCC, VSS Power Supply Pins Separate 2.2–3.6 V core supply and ground; decoupling recommended per ball-grid layout guidelines

Key Features

Feature Design Value
Embedded ECC Engine On-die Hamming-code encoder/decoder corrects single-bit errors per 16-bit word without CPU intervention
Byte Power Down Mode Automatic entry into ultra-low-power standby when both BHE and BLE are inactive - independent of CE state
TTL-Compatible I/O VIH/VIL thresholds match standard 3.3 V TTL logic, eliminating level-shifter requirements in mixed-voltage systems
Multi-Voltage Support Single device operates across 2.2–3.6 V range - simplifies BOM consolidation for 2.5 V and 3.3 V platforms
Industrial Temperature Range Specified from –40 °C to +85 °C - qualified for use in programmable logic controllers and motor drives

Applications

Industrial PLC Memory Buffer Medical Diagnostic Data Cache

Use Scenario: Real-time buffering of sensor acquisition data in programmable logic controllers with deterministic scan cycles.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding configuration and I/O state; ECC prevents silent corruption during EMI-rich factory-floor operation.

Use Value: 45 ns access enables sub-100 µs I/O update cycles; 8.7 µA standby supports battery-backed retention during mains failure.

Use Scenario: Temporary storage of image frame buffers in portable ultrasound devices before compression and transmission.

IC Role / Device Role / Timing Role: High-integrity intermediate memory between ADC pipeline and DSP engine; ERR pin triggers reacquisition on detected errors.

Use Value: 1.0 V data retention allows safe hold during brief power interruptions; 16-bit bus matches imaging pipeline word width.

Avionics Sensor Interface Module Railway Signaling Controller

Use Scenario: Storing flight-critical telemetry snapshots in airborne environmental monitoring units with strict FIT requirements.

IC Role / Device Role / Timing Role: Error-resilient scratchpad memory for time-stamped sensor logs; SER FIT < 0.1 FIT/Mb per AN88889.

Use Value: Dual CE interface enables seamless integration into ARINC-429 bus arbitration schemes; VFBGA footprint minimizes board area.

Use Scenario: Holding interlocking logic state tables in wayside signaling controllers operating in unconditioned trackside cabinets.

IC Role / Device Role / Timing Role: ECC-protected configuration store ensuring fail-safe state persistence across thermal cycling and vibration.

Use Value: Industrial-grade temp range (–40 °C to +85 °C) and 2.2–3.6 V operation tolerate rail traction harmonics and wide ambient swings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV25616EDBLL-10MLI No embedded ECC; requires external logic or software for error handling; 10 ns faster (10 ns access), but higher ICC (30 mA typical) Lacks hardware-level error reporting; unsuitable where real-time correction logging is mandated Select only if system already implements software ECC or FIT budget permits uncorrected errors
AS6C4008-55ZIN 4-Mbit × 8-bit organization; no ECC; 55 ns access; 3.3 V only; TSOP-44 package only Requires two devices for 16-bit bus width; no ERR signal or byte-enable power savings Choose only for legacy 8-bit bus upgrades where board space allows dual-device placement

Compared with IS61WV25616EDBLL-10MLI and AS6C4008-55ZIN, CY62147G30-45B2XIT uniquely integrates hardware ECC with byte-select power management and dual-voltage support - critical for safety-critical memory buffers where silent data corruption must be eliminated at silicon level.

Availability

CY62147G30-45B2XIT is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostic equipment, avionics sensor interfaces, and railway signaling controllers requiring stable component supply across extended product lifecycles.

Supply support for CY62147G30-45B2XIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and aerospace qualifications.

CY62147G30-45B2XIT belongs to the MoBL® (Mobile Low-power) SRAM product line, designed specifically for battery-sensitive and mission-critical embedded systems requiring ECC resilience without sacrificing speed or voltage flexibility.

FAQ

Does CY62147G30-45B2XIT support automatic error correction write-back?

No. The device detects and corrects single-bit errors during read operations and asserts the ERR pin, but does not perform automatic write-back to memory. Correction is transient and applies only to the read data path. System firmware must handle persistent correction if required, per datasheet Note 1.

What is the function of the ERR pin, and how is it electrically driven?

The ERR pin is an open-drain output that goes HIGH during a read cycle when a single-bit error is detected and corrected. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) to establish a valid logic HIGH level. The pin remains LOW otherwise, including during normal reads and writes.

Can CY62147G30-45B2XIT operate at 1.8 V?

No. This variant (CY62147G30-45B2XIT) is rated for 2.2 V to 3.6 V only. The 1.65 V–2.2 V range applies only to CY62147G(E)18 variants. Operating below 2.2 V risks timing violations and ECC reliability loss, as confirmed by AC switching characteristics tables in Rev. *K datasheet.

Is the 48-ball VFBGA package lead-free and RoHS-compliant?

Yes. The CY62147G30-45B2XIT uses a Pb-free 48-ball VFBGA package compliant with EU RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3), as documented in the Package Diagrams section (page 19) of datasheet 001-92847 Rev. *K.

CY62147G30-45B2XIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62147G30-45B2XIT FAQ

1.How can I place an order for CY62147G30-45B2XIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62147G30-45B2XIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62147G30-45B2XIT reliable?

The price and inventory of CY62147G30-45B2XIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147G30-45B2XIT is usually 5 days.

3.What payment methods are accepted for CY62147G30-45B2XIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147G30-45B2XIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62147G30-45B2XIT?

CY62147G30-45B2XIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62147G30-45B2XIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62147G30-45B2XIT?

For technical support, including CY62147G30-45B2XIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147G30-45B2XIT requirements.

6.How does Aetrix verify that CY62147G30-45B2XIT is sourced from the original manufacturer or authorized distributors?

All CY62147G30-45B2XIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147G30-45B2XIT meets industry standards.

7.What is the process for return or replacement of CY62147G30-45B2XIT?

All CY62147G30-45B2XIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62147G30-45B2XIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62147G30-45B2XIT part is unused and in its original packaging.

Return procedure for CY62147G30-45B2XIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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