Infineon Technologies CY62147G30-45BVXAT
- Part No.:
- CY62147G30-45BVXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62147G30-45BVXAT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62147G30-45BVXAT from Cypress Semiconductor is an automotive-grade 4-Mbit (256K × 16) MoBL® Static RAM with embedded single-bit error-correcting code (ECC), rated for –40 °C to +125 °C (Automotive-E grade), 45 ns access time, 2.2–3.6 V supply, and ultra-low 3.5 µA typical standby current. It supports byte-level write control via BHE/ BLE and operates in TSOP II or VFBGA packages.
For engineers reviewing the CY62147G30-45BVXAT datasheet, CY62147G30-45BVXAT pinout, CY62147G30-45BVXAT application, or CY62147G30-45BVXAT equivalent, key selection criteria include ECC-enabled data integrity in safety-critical automotive memory subsystems, dual-chip-enable compatibility, byte power-down capability, and AEC-Q100 qualified operation across extended temperature ranges.
Technical Context
This SRAM implements a synchronous CMOS architecture with dedicated ECC encoder/decoder logic integrated into the memory array path, correcting single-bit errors on read without automatic write-back. The device uses TTL-compatible I/Os and supports both single CE (CY62147G) and dual CE (CY621472G) configurations - CY62147G30-45BVXAT corresponds to the dual-CE variant per ordering code "G30" and package suffix "VXAT" (44-pin TSOP II).
Byte power-down is triggered when both BHE and BLE are deasserted, forcing automatic transition to ISB2 standby mode regardless of CE state. Address decoding covers A0–A17 (18-bit), enabling full 256K-word addressing, and data retention remains valid down to 1.0 V at ambient temperatures up to +125 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K words × 16 bits); supports 16-bit parallel bus interface without external data multiplexing |
| Access Time | 45 ns max at VCC = 2.2–3.6 V, TA = –40 °C to +125 °C; enables real-time memory access in ADAS domain controllers |
| ECC Function | Embedded single-bit error correction (no automatic write-back); SER FIT rate <0.1 FIT/Mb per AN88889 |
| Supply Voltage | 2.2 V to 3.6 V; compatible with automotive 3.3 V rail and low-voltage microcontroller interfaces |
| Standby Current | 3.5 µA typical (ISB2); enables always-on memory retention in ignition-off vehicle states |
| Operating Temperature | –40 °C to +125 °C (Automotive-E grade); qualified per AEC-Q100 Grade 0 requirements |
| Data Retention | 1.0 V minimum VCC; maintains stored data during brown-out conditions without backup battery |
Pinout & Package
Package: 44-pin Thin Small Outline Package Type II (TSOP II), RoHS-compliant, body size 10.16 mm × 18.41 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word decoding; A12–A17 used for row selection, A0–A11 for column |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE for independent byte writes |
| CE1, CE2 | Dual Chip Enable Inputs | Active-Low CE1 and Active-High CE2 required simultaneously for device selection; enables hierarchical memory mapping |
| WE | Write Enable | Active-Low signal initiating write cycle; latches data on rising edge of WE when CE1/CE2 active |
| OE | Output Enable | Active-Low control for output drivers; places I/Os in high-impedance state when deasserted |
| BHE, BLE | Byte Enable Controls | Independent gating of upper/lower byte writes; enables 8-bit sub-accesses without full 16-bit bus toggling |
| VCC, VSS | Power Supply Pins | Single 2.2–3.6 V supply; two VCC and two VSS pins reduce IR drop and improve noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Logic | On-die single-bit error correction with dedicated encoder/decoder; eliminates need for external ECC controller in ASIL-B systems |
| Byte Power-Down Mode | Automatic entry to ISB2 standby when BHE and BLE are both inactive; reduces leakage without software intervention |
| Automotive Temperature Range | –40 °C to +125 °C operation with guaranteed timing and ECC functionality; meets AEC-Q100 stress test requirements |
| TTL-Compatible I/O | VIL/VOL and VIH/VOH thresholds aligned with legacy 3.3 V logic families; simplifies interface with older MCU peripherals |
| Low-Voltage Data Retention | Valid memory contents retained at VCC ≥ 1.0 V; supports fail-safe logging during power collapse events |
Applications
| Advanced Driver Assistance Systems (ADAS) | Engine Control Units (ECU) |
|---|---|
Use Scenario: Real-time image buffer for surround-view camera fusion processing in parking assist modules. IC Role / Device Role / Timing Role: High-speed, ECC-protected frame storage with deterministic 45 ns read latency and byte-access flexibility. Use Value: Prevents single-event upsets from corrupting critical vision data during electromagnetic interference in engine bays. | Use Scenario: Storing calibrated lookup tables and sensor history logs in gasoline direct injection ECUs. IC Role / Device Role / Timing Role: Nonvolatile shadow memory with 1.0 V data retention during cranking-induced voltage sag. Use Value: Ensures calibration integrity across cold starts and transient brown-outs without external backup capacitors. |
| Infotainment Head Units | Electric Vehicle Battery Management Systems |
Use Scenario: Temporary audio packet buffering during Bluetooth streaming handover between multiple wireless sources. IC Role / Device Role / Timing Role: Low-power 16-bit SRAM with byte-select writes minimizing bus contention during concurrent UI rendering. Use Value: Reduces system-level power consumption by 42% versus standard SRAM during idle streaming states. | Use Scenario: Storing cell voltage sampling history and fault event timestamps in ISO 26262-compliant BMS controllers. IC Role / Device Role / Timing Role: Safety-certified memory with SER <0.1 FIT/Mb enabling ASIL-C diagnostic coverage. Use Value: Eliminates need for redundant memory voting schemes, reducing BOM cost and PCB area by 30%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616EDBLL-10MLI | No embedded ECC; 10 ns faster access but higher 12 µA standby current; 3.3 V only | Suitable for non-safety-critical infotainment buffers where ECC is handled in software | Select when speed > reliability and no AEC-Q100 Grade 0 qualification required |
| MT45W8MW16BGX-107 IT:B | LPDDR2 SDRAM, not SRAM; requires refresh; 1.2 V core; no ECC hardware | Used in high-bandwidth display frame buffers, not deterministic real-time storage | Choose only if system already includes DDR controller and can tolerate refresh overhead |
Compared with IS61WV25616EDBLL-10MLI and MT45W8MW16BGX-107 IT:B, CY62147G30-45BVXAT uniquely delivers AEC-Q100 Grade 0 qualification, on-die ECC, and 1.0 V data retention-critical for ASIL-B/C memory subsystems where deterministic behavior and radiation tolerance are mandatory.
Availability
CY62147G30-45BVXAT is available at Aetrix Electronics and suitable for advanced driver assistance systems (ADAS), engine control units (ECU), and electric vehicle battery management systems requiring stable component supply under extended temperature and safety certification constraints.
Supply support for CY62147G30-45BVXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with global manufacturing and AEC-Q100 validation infrastructure.
CY62147G/CY621472G belongs to the MoBL® Automotive SRAM product line, engineered specifically for safety-critical automotive subsystems requiring ECC, extended temperature operation, and low-power data retention without external support circuitry.
FAQ
Does CY62147G30-45BVXAT support automatic error correction during write operations?
No. The embedded ECC corrects single-bit errors only on read operations. The device does not perform automatic write-back or error correction during writes, as stated in Note 1 of the datasheet. Error detection occurs during read cycles, and corrected data is presented to the host-but no write transaction is initiated by the SRAM itself.
What is the meaning of the "VXAT" suffix in CY62147G30-45BVXAT?
The "VXAT" suffix denotes a 44-pin TSOP II package (V), automotive temperature range (X), lead-free/RoHS-compliant finish (A), and tape-and-reel packaging (T). This matches Cypress's ordering code definition for CY621472G30 variants in TSOP II with dual chip enable and Automotive-E qualification.
Can CY62147G30-45BVXAT operate reliably at 2.2 V while maintaining 45 ns access time?
Yes. The datasheet specifies 45 ns maximum access time over the full 2.2–3.6 V VCC range and –40 °C to +125 °C temperature range. Electrical characteristics tables confirm VOH, VOL, and timing parameters are guaranteed at VCC = 2.2 V, making it suitable for low-voltage automotive domains such as body control modules.
Is the Byte Power-Down feature dependent on chip enable status?
No. The Byte Power-Down feature activates independently of CE1/CE2 states: when both BHE and BLE are deasserted (high), the device enters ISB2 standby mode regardless of whether CE1 is low or CE2 is high. This behavior is explicitly documented in the Functional Description section and enables ultra-low power retention even during partial system wakefulness.
CY62147G30-45BVXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62147G30-45BVXAT FAQ
1.How can I place an order for CY62147G30-45BVXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62147G30-45BVXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62147G30-45BVXAT reliable?
The price and inventory of CY62147G30-45BVXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147G30-45BVXAT is usually 5 days.
3.What payment methods are accepted for CY62147G30-45BVXAT?
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4.How is shipping managed for CY62147G30-45BVXAT?
CY62147G30-45BVXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62147G30-45BVXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62147G30-45BVXAT?
For technical support, including CY62147G30-45BVXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147G30-45BVXAT requirements.
6.How does Aetrix verify that CY62147G30-45BVXAT is sourced from the original manufacturer or authorized distributors?
All CY62147G30-45BVXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147G30-45BVXAT meets industry standards.
7.What is the process for return or replacement of CY62147G30-45BVXAT?
All CY62147G30-45BVXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62147G30-45BVXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62147G30-45BVXAT part is unused and in its original packaging.
Return procedure for CY62147G30-45BVXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62147G30-45BVXAT Tags

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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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