Infineon Technologies CY62147G30-45ZSXA
- Part No.:
- CY62147G30-45ZSXA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62147G30-45ZSXA.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:4,554
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Product details
Overview
CY62147G30-45ZSXA from Cypress Semiconductor is an automotive-grade 4-Mbit (256K × 16) MoBL® SRAM with embedded single-bit error-correcting code (ECC), 45 ns access time, 2.2–3.6 V supply range, and -40 °C to +85 °C operation. It supports byte-level write control via BHE/ BLE, TTL-compatible I/Os, and ultra-low 3.5 µA typical standby current-deployed in engine control units and ADAS domain controllers requiring ECC-protected memory.
For engineers reviewing the CY62147G30-45ZSXA datasheet, CY62147G30-45ZSXA pinout, CY62147G30-45ZSXA application, or CY62147G30-45ZSXA equivalent, key selection criteria include ECC implementation method, dual vs. single chip enable configuration, VFBGA vs. TSOP II package compatibility, and automotive-A temperature compliance for safety-critical ECUs.
Technical Context
This SRAM integrates dedicated ECC encoder/decoder logic within the memory array path to detect and correct single-bit errors on read operations without external logic. The device implements a 16-bit bidirectional data bus (I/O0–I/O15), 18-bit address bus (A0–A17), and separate byte-enable controls (BHE/BLE) enabling independent upper/lower byte writes.
It features automatic power-down when both BHE and BLE are deasserted-regardless of CE state-reducing standby current to 3.5 µA. The logic block diagram confirms ECC operates inline with sense amplifiers and column decoders, not as a post-read software layer.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K words × 16-bit); supports 16-bit microcontroller interfaces without data bus multiplexing. |
| Access Time | 45 ns max at VCC = 2.2–3.6 V, TA = –40 °C to +85 °C; enables real-time execution in 40 MHz+ MCU systems. |
| ECC Function | Embedded single-bit error correction (no automatic write-back); reduces uncorrectable error rate to <0.1 FIT/Mb. |
| Supply Voltage | 2.2 V to 3.6 V; compatible with automotive 3.3 V rails and brown-out tolerant during cold-crank conditions. |
| Standby Current | 3.5 µA typical (ISB2); enables low-power sleep modes in always-on ADAS modules. |
| Data Retention | 1.0 V minimum retention voltage; maintains memory contents during battery disconnect or deep sleep. |
| Package | 48-ball VFBGA (6 mm × 8 mm, 0.8 mm pitch); supports high-density PCB layouts in space-constrained ECU modules. |
Pinout & Package
48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package with 0.8 mm ball pitch, JEDEC MO-220 compliant, thermal resistance θJA = 31.17 °C/W (4-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address inputs | 18-bit address bus supporting full 256K-word addressing; A12–A17 used for row decoding, A0–A11 for column selection. |
| I/O0–I/O15 | Bidirectional data bus | 16-bit parallel interface; supports simultaneous 16-bit reads/writes or byte-selectable operations via BHE/BLE. |
| CE | Chip enable (active LOW) | Single CE input per CY62147G variant; device enters HI-Z state when HIGH, disabling all outputs and reducing ICC. |
| WE | Write enable (active LOW) | Controls write cycle timing; data latched on falling edge; must be synchronized with address and CE. |
| OE | Output enable (active LOW) | Enables output drivers only; allows read access while CE remains asserted and WE is HIGH. |
| BHE, BLE | Byte high/low enable | BHE gates I/O8–I/O15; BLE gates I/O0–I/O7; both LOW disables I/Os and triggers automatic standby mode. |
| VCC, VSS | Power and ground | Single 2.2–3.6 V supply; multiple VSS balls provide low-inductance return paths for noise-sensitive SRAM operation. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC | Hardware-based single-bit error correction implemented in silicon; eliminates need for external ECC logic or software overhead. |
| Byte Power Down | Automatic transition to 3.5 µA standby when BHE and BLE are both deasserted-even if CE is active-enabling fine-grained power gating. |
| TTL-Compatible I/Os | VIH/VIL thresholds meet TTL levels across full VCC range; ensures interoperability with legacy 5 V-tolerant MCUs without level shifters. |
| Automotive Temperature Range | Qualified for Automotive-A grade (–40 °C to +85 °C); meets AEC-Q100 stress test requirements for engine bay and cabin ECU deployment. |
| Low-Voltage Data Retention | Maintains stored data down to 1.0 V VCC; supports graceful shutdown during battery voltage sag in start-stop systems. |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
Use Scenario: Real-time storage of sensor fusion buffers and calibration tables in gasoline/diesel engine management systems. IC Role / Device Role / Timing Role: Primary working RAM for 32-bit RISC MCU executing closed-loop fuel injection and ignition timing algorithms. Use Value: ECC prevents silent data corruption in critical lookup tables, avoiding misfire events or emissions noncompliance under EMI-rich under-hood conditions. | Use Scenario: Frame buffering for surround-view camera processing in parking assist and automated emergency braking modules. IC Role / Device Role / Timing Role: High-speed scratchpad memory for SoC vision processors handling 30 fps video streams with minimal latency. Use Value: 45 ns access time enables sub-33 µs read cycles for 16-bit pixel blocks, meeting real-time frame buffer deadlines without pipeline stalls. |
| Body Control Module (BCM) | Infotainment Head Unit |
Use Scenario: Storing dynamic configuration data (door lock states, lighting profiles, seat positions) across vehicle power cycles. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM backed by backup capacitor; retains settings during ignition-off periods. Use Value: 1.0 V data retention allows reliable state hold-down during 12 V battery dips below 2.0 V during cranking or load dump events. | Use Scenario: Audio DSP parameter storage and UI widget rendering cache in digital cockpit displays. IC Role / Device Role / Timing Role: Low-power SRAM for audio codec co-processors managing multi-channel equalization and voice recognition buffers. Use Value: 3.5 µA standby current minimizes quiescent draw in always-listening voice wake-up subsystems, extending battery reserve life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM with ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616EDBLL-10MLI | No embedded ECC; requires external error detection logic or software correction. | Lacks hardware-level fault containment; unsuitable for ASIL-B/C functional safety targets. | Select only for cost-sensitive non-safety applications where ECC is handled at system level. |
| MT48LC4M16A2P-6A:G | SDRAM architecture; requires refresh controller and command sequencing; no ECC built-in. | Higher bandwidth but adds complexity; incompatible with simple SRAM interface MCUs. | Choose only when system already uses SDRAM controller and needs higher density than 4 Mbit. |
Compared with IS61WV25616EDBLL-10MLI and MT48LC4M16A2P-6A:G, CY62147G30-45ZSXA delivers deterministic ECC correction in a drop-in SRAM interface, eliminating refresh overhead and external logic-critical for ISO 26262-compliant automotive control units.
Availability
CY62147G30-45ZSXA is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, body control modules, and infotainment head units requiring stable component supply across automotive production lifecycles.
Supply support for CY62147G30-45ZSXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with global manufacturing and AEC-Q100 qualification infrastructure.
CY62147G belongs to the MoBL® Automotive SRAM product line, engineered specifically for functional safety-critical automotive electronics requiring ECC, extended temperature operation, and long-term supply stability.
FAQ
Does CY62147G30-45ZSXA support automatic error correction during read operations?
Yes. The device performs single-bit error correction inline during every read cycle using dedicated hardware ECC logic. Detected errors are corrected before data reaches the I/O pins. However, it does not perform automatic write-back to memory after correction-corrupted bits remain uncorrected in the array until rewritten.
What is the function of the Byte Power Down feature?
When both BHE and BLE are deasserted (HIGH), the device automatically enters ultra-low-power standby mode (3.5 µA typical), regardless of CE state. This enables precise power gating of unused memory sections in multi-threaded automotive firmware without requiring external power switches or complex sequencing.
Is CY62147G30-45ZSXA pin-compatible with CY621472G30 variants?
No. CY62147G30 uses single CE (pin 39 = CE), while CY621472G30 uses dual CE (pins 39 = CE1, 29 = CE2). The pinouts differ in TSOP II packages; VFBGA pinouts are identical except for CE/CE1/CE2 assignment. Board redesign is required for substitution.
Can this SRAM operate reliably during automotive cold-crank conditions?
Yes. With 2.2 V minimum operating voltage and 1.0 V data retention capability, it sustains memory contents and resumes operation as VCC recovers from cold-crank dips (down to ~6 V battery). Its -40 °C to +85 °C rating and AEC-Q100 qualification confirm robustness under these transient conditions.
CY62147G30-45ZSXA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62147G30-45ZSXA FAQ
1.How can I place an order for CY62147G30-45ZSXA through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62147G30-45ZSXA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62147G30-45ZSXA reliable?
The price and inventory of CY62147G30-45ZSXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147G30-45ZSXA is usually 5 days.
3.What payment methods are accepted for CY62147G30-45ZSXA?
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4.How is shipping managed for CY62147G30-45ZSXA?
CY62147G30-45ZSXA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62147G30-45ZSXA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62147G30-45ZSXA?
For technical support, including CY62147G30-45ZSXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147G30-45ZSXA requirements.
6.How does Aetrix verify that CY62147G30-45ZSXA is sourced from the original manufacturer or authorized distributors?
All CY62147G30-45ZSXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147G30-45ZSXA meets industry standards.
7.What is the process for return or replacement of CY62147G30-45ZSXA?
All CY62147G30-45ZSXA units undergo pre-shipment inspection (PSI). If there is an issue with CY62147G30-45ZSXA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62147G30-45ZSXA part is unused and in its original packaging.
Return procedure for CY62147G30-45ZSXA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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