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Infineon Technologies CY62147G30-55ZSXET
- Part No.:
- CY62147G30-55ZSXET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62147G30-55ZSXET.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:2,155
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Product details
Overview
CY62147G30-55ZSXET from Cypress Semiconductor is an automotive-grade 4-Mbit (256K × 16-bit) MoBL® SRAM with embedded single-bit error-correcting code (ECC), rated for -40 °C to +125 °C (Automotive-E grade), 55 ns access time, 2.2–3.6 V supply, and ultra-low 3.5 µA typical standby current. It supports byte-level write control via BHE/ BLE and operates in TSOP II package for engine control units and ADAS domain controllers.
For engineers reviewing the CY62147G30-55ZSXET datasheet, CY62147G30-55ZSXET pinout, CY62147G30-55ZSXET application, or CY62147G30-55ZSXET equivalent, key selection criteria include ECC-enabled data integrity in safety-critical memory buffers, dual-chip-enable compatibility for multi-SRAM systems, and 55 ns timing compliance under 125 °C ambient conditions.
Technical Context
This SRAM implements a dedicated on-die ECC encoder/decoder pair that detects and corrects single-bit errors per 16-bit word without external logic or software intervention. The architecture uses separate row/column decoders feeding a 256K × 16 memory array with sense amplifiers and TTL-compatible I/O drivers.
It supports two chip enable configurations: CY62147G uses single CE, while CY621472G (this part's variant) requires CE1 LOW and CE2 HIGH for access. Byte power-down is triggered when both BHE and BLE are deasserted, forcing automatic transition to ISB2 standby mode regardless of CE state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K words × 16-bit) - provides sufficient buffer space for real-time sensor fusion data in automotive ECUs |
| Access Time | 55 ns - guarantees deterministic read/write latency for ASIL-B timing-critical applications |
| Supply Voltage | 2.2 V to 3.6 V - compatible with modern 3.3 V automotive power domains and brown-out tolerant |
| Standby Current | Typical 3.5 µA at VCC = 3.0 V - enables low-power sleep modes in always-on vehicle networks |
| ECC Capability | Single-bit error correction per 16-bit word - meets ISO 26262 FIT rate requirement (<0.1 FIT/Mb) |
| Operating Temperature | -40 °C to +125 °C (Automotive-E grade) - qualified for under-hood and radar module environments |
| Data Retention | 1.0 V minimum retention voltage - allows graceful shutdown during battery droop events |
Pinout & Package
Package: 44-pin TSOP II (Type II, 400-mil width), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; A12–A17 used for row decode |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE |
| CE1, CE2 | Dual Chip Enable | CE1 must be LOW and CE2 HIGH to enable device; enables hierarchical memory mapping |
| WE | Write Enable | Active-LOW signal initiating write cycle; synchronized with address and data setup/hold |
| OE | Output Enable | Active-LOW control for read data output; independent of CE state for flexible timing |
| BHE, BLE | Byte Enable Controls | Enable upper/lower byte writes or reads; assertion disables corresponding I/O group |
| VCC, VSS | Power & Ground | Single 2.2–3.6 V supply; dual VSS pins reduce ground bounce in high-speed operation |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Hardware-based single-bit error correction per 16-bit word with no CPU overhead or latency penalty |
| Byte Power-Down Mode | Automatic entry into ISB2 standby when BHE and BLE are both inactive - eliminates need for external power sequencing |
| Automotive-E Qualification | Full temperature range (-40 °C to +125 °C) and AEC-Q100 Grade 1 stress testing compliance |
| TTL-Compatible I/O | Direct interfacing with legacy microcontrollers and FPGAs without level-shifting circuitry |
| Low-Voltage Data Retention | Retains valid data down to 1.0 V - supports fail-safe shutdown during battery voltage collapse |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
Use Scenario: Real-time storage of sensor-calibrated lookup tables and transient engine parameter logs during combustion cycles. IC Role / Device Role / Timing Role: High-reliability scratchpad memory with ECC protection for ASIL-B functional safety requirements. Use Value: Prevents silent data corruption in fuel injection timing maps, avoiding misfire or emissions noncompliance. | Use Scenario: Buffering raw camera and radar frame data before preprocessing in domain controller SoCs. IC Role / Device Role / Timing Role: Low-latency, byte-accessible SRAM serving as first-stage FIFO between sensor interface and AI accelerator. Use Value: 55 ns access time ensures uninterrupted 60 fps video stream buffering under thermal stress up to 125 °C. |
| Electric Powertrain Inverter | Vehicle-to-Everything (V2X) Communication Module |
Use Scenario: Storing fault history logs and PWM modulation parameters in traction inverter gate driver boards. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM with ECC, retaining critical diagnostics during power cycling. Use Value: 1.0 V data retention enables reliable logging even during 12 V battery sag below 2.0 V. | Use Scenario: Temporary packet assembly and encryption context storage in DSRC/ C-V2X radio subsystems. IC Role / Device Role / Timing Role: Secure, tamper-resilient buffer for cryptographic keys and message headers prior to RF transmission. Use Value: Dual CE inputs allow isolated memory partitioning between secure boot loader and runtime communication stack. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV25616BLL-55MLI | No embedded ECC; 256K × 16-bit, 55 ns, -40 °C to +85 °C only | Lacks hardware error correction; requires external ECC logic or software mitigation | Select only if functional safety certification is not required and ambient temperature stays ≤85 °C |
| MT48LC16M16A2P-6A:G | Synchronous SDRAM (not SRAM); 256Mbit, 16-bit bus, 166 MHz clocked interface | Requires clock management, refresh cycles, and controller initialization - incompatible pinout and protocol | Choose only when system already uses SDRAM controller and higher bandwidth justifies added complexity |
Compared with IS62WV25616BLL-55MLI and MT48LC16M16A2P-6A:G, CY62147G30-55ZSXET uniquely delivers integrated ECC, automotive-E temperature rating, and asynchronous SRAM simplicity - making it the sole option meeting ASIL-B memory integrity requirements without external support circuitry.
Availability
CY62147G30-55ZSXET is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, and electric powertrain inverters requiring stable component supply across extended automotive lifecycles.
Supply support for CY62147G30-55ZSXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications.
CY62147G/CY621472G belongs to the MoBL® Automotive SRAM product line, engineered specifically for safety-critical, high-temperature memory buffering in ECU, ADAS, and power electronics where ECC and AEC-Q100 Grade 1 compliance are mandatory.
FAQ
Does CY62147G30-55ZSXET support automatic error correction without host intervention?
Yes. The device contains fully integrated ECC encoding and decoding logic that automatically detects and corrects single-bit errors per 16-bit word during every read operation. No firmware, external logic, or host processor involvement is required - correction occurs transparently within the memory access cycle.
What is the difference between CY62147G and CY621472G in terms of chip enable configuration?
CY62147G uses a single chip enable (CE) input, while CY621472G - the variant represented by CY62147G30-55ZSXET - requires dual chip enables: CE1 must be driven LOW and CE2 HIGH to activate the device. This enables hierarchical memory decoding in multi-SRAM systems without external gating logic.
Can CY62147G30-55ZSXET operate reliably at 125 °C junction temperature?
Yes. The part is qualified to Automotive-E grade with guaranteed operation from -40 °C to +125 °C ambient. Its thermal resistance (θJA = 66.82 °C/W for TSOP II) and 55 ns timing spec are validated under full temperature and voltage extremes, including worst-case derating for sustained 125 °C ambient in engine bay installations.
Is the 1.0 V data retention specification tested or theoretical?
The 1.0 V data retention is a guaranteed specification verified per JEDEC JESD22-A107 and AEC-Q100 stress tests. Devices retain valid data at 1.0 V VCC and -40 °C to +125 °C for ≥100 hours, enabling safe logging during deep brown-out conditions without backup capacitors.
CY62147G30-55ZSXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62147G30-55ZSXET FAQ
1.How can I place an order for CY62147G30-55ZSXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62147G30-55ZSXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62147G30-55ZSXET reliable?
The price and inventory of CY62147G30-55ZSXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147G30-55ZSXET is usually 5 days.
3.What payment methods are accepted for CY62147G30-55ZSXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147G30-55ZSXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62147G30-55ZSXET?
CY62147G30-55ZSXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62147G30-55ZSXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62147G30-55ZSXET?
For technical support, including CY62147G30-55ZSXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147G30-55ZSXET requirements.
6.How does Aetrix verify that CY62147G30-55ZSXET is sourced from the original manufacturer or authorized distributors?
All CY62147G30-55ZSXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147G30-55ZSXET meets industry standards.
7.What is the process for return or replacement of CY62147G30-55ZSXET?
All CY62147G30-55ZSXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62147G30-55ZSXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62147G30-55ZSXET part is unused and in its original packaging.
Return procedure for CY62147G30-55ZSXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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