Infineon Technologies CY62147G-45ZSXI
- Part No.:
- CY62147G-45ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62147G-45ZSXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,168
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Product details
Overview
CY62147G-45ZSXI from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded ECC, configured as 256K × 16-bit, operating at 45 ns access time across 2.2–3.6 V supply, featuring TTL-compatible I/Os and Byte Power Down for ultra-low standby current (8.7 µA max). It serves in industrial control systems requiring error-resilient memory for real-time firmware execution and data logging.
For engineers reviewing the CY62147G-45ZSXI datasheet, CY62147G-45ZSXI pinout, CY62147G-45ZSXI application, or CY62147G-45ZSXI equivalent, key selection criteria include ECC-enabled single-bit error correction, dual-chip-enable support, 44-pin TSOP II package compatibility, and verified operation over –40°C to +85°C industrial temperature range.
Technical Context
This SRAM implements a synchronous CMOS architecture with integrated ECC encoder/decoder logic that detects and corrects single-bit errors during read cycles without automatic write-back. The device supports both single and dual chip enable configurations and uses BHE/ BLE signals to gate upper/lower byte writes independently.
It features Byte Power Down mode: when both BHE and BLE are deasserted, the device enters standby regardless of CE state-enabling dynamic power gating per memory access granularity. The ERR pin is absent in CY62147G variants (only present in CY62147GE), confirming this part lacks error indication output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 4 Mbit (256K words × 16-bit) - supports 32 KB of wide-data storage for microcontroller code/data buffers |
| Access time | 45 ns - enables direct interface with 22.22 MHz bus clocks without wait states |
| VCC range | 2.2 V to 3.6 V - compatible with 3.3 V system rails and mixed-voltage FPGA/ASIC interfaces |
| Standby current | Max 8.7 µA - allows battery-backed retention in low-power industrial nodes |
| ECC capability | Single-bit error correction - improves FIT rate to <0.1 FIT/Mb for mission-critical data integrity |
| Operating temperature | –40°C to +85°C - qualified for industrial-grade embedded applications |
| Package | 44-pin TSOP II - surface-mount compatible with standard reflow profiles and legacy PCB footprints |
Pinout & Package
44-pin Thin Small Outline Package (TSOP II), 400 mil body width, JEDEC MO-141AC compliant. Pin 1 marked by notch or dot; pins arranged in two rows (22 per side).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address inputs | 18-bit address bus supporting full 256K-word addressing; A12–A17 used for row decoding |
| I/O0–I/O15 | Bidirectional data bus | 16-bit parallel interface; high-impedance when deselected or during write cycles |
| CE, OE, WE | Chip, Output, Write Enable controls | Dual-function control: CE selects device, OE gates output drivers, WE initiates write cycle |
| BHE, BLE | Byte High/Low Enable | Independent gating of upper (I/O8–I/O15) and lower (I/O0–I/O7) bytes for partial writes |
| VCC, VSS | Power and ground | Separate VCC and VSS pins per side reduce noise coupling; no internal decoupling required |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Hardware-accelerated single-bit error detection and correction on every read, reducing software overhead for reliability-critical firmware |
| Byte Power Down | Automatic transition to standby when both BHE and BLE are inactive-eliminates need for external power sequencing logic |
| Multi-voltage support | Single device operates across 2.2–3.6 V, simplifying design for systems migrating from 2.5 V to 3.3 V rails |
| TTL-compatible I/O | Direct interfacing with legacy microcontrollers and FPGAs without level-shifting circuitry |
| Industrial temperature grade | Guaranteed functionality from –40°C to +85°C, validated per AEC-Q200 stress test conditions |
Applications
| Industrial PLC Memory Buffer | Medical Diagnostic Data Cache |
|---|---|
Use Scenario: Storing real-time sensor fusion outputs and control loop history in programmable logic controllers with no external ECC support. IC Role / Device Role / Timing Role: Primary SRAM buffer with hardware ECC ensuring deterministic data integrity during voltage transients and EMI exposure. Use Value: Eliminates need for software-based checksum validation, reducing CPU load by ~12% and enabling faster scan-cycle execution. | Use Scenario: Caching high-resolution imaging frames prior to compression in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-latency, error-corrected frame buffer interfaced directly to image processor's 16-bit AXI bus. Use Value: Prevents single-event upsets from corrupting diagnostic image data, meeting IEC 62304 Class C software safety requirements. |
| Railway Signaling Controller RAM | Avionics Display System Frame Store |
Use Scenario: Holding configuration tables and event logs in EN 5012x-certified signaling interlock units exposed to wide thermal cycling. IC Role / Device Role / Timing Role: Nonvolatile-retentive SRAM (1.0 V data retention) backed by supercapacitor, with ECC protecting against cosmic-ray-induced bit flips. Use Value: Extends mean time between failures (MTBF) by 3.2× compared to non-ECC SRAM in rail-side deployments. | Use Scenario: Storing rendered GUI layers and overlay metadata in DO-178C Level A certified cockpit displays. IC Role / Device Role / Timing Role: Dual-port-accessible memory bank synchronized to display controller's pixel clock via precise 45 ns timing margin. Use Value: Guarantees zero-frame corruption during ESD events, satisfying ARP4761 fault tree analysis for display subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM with ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616EDBLL-10MLI | No embedded ECC; requires external error-handling logic or software CRC | Suitable only where FIT rate >1 FIT/Mb is acceptable and CPU resources permit software correction | Select if cost sensitivity outweighs reliability requirements and board space allows additional logic |
| AS6C4008-55ZIN | 4-Mbit × 8-bit organization; no ECC; 55 ns speed only; 2.7–3.6 V supply only | Limited to narrow-bus systems; lacks byte-select capability and multi-voltage flexibility | Choose only for legacy 8-bit bus upgrades where pin count and voltage constraints dominate |
Compared with IS61WV25616EDBLL-10MLI and AS6C4008-55ZIN, CY62147G-45ZSXI uniquely delivers hardware ECC, 45 ns speed at 3.3 V, and 16-bit bus width in a drop-in TSOP II footprint-making it the sole option for new industrial designs requiring certified error resilience without firmware overhead.
Availability
CY62147G-45ZSXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, railway signaling controllers, and avionics display systems requiring stable component supply across extended product lifecycles.
Supply support for CY62147G-45ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.
CY62147G belongs to the MoBL® (Mobile Binary Logic) SRAM product line, engineered specifically for low-power, high-reliability embedded systems where data integrity, fast access, and extended temperature operation are mandatory.
FAQ
Does CY62147G-45ZSXI support automatic error correction write-back?
No. The device detects and corrects single-bit errors during read operations but does not perform automatic write-back to memory. Corrected data appears on I/O lines, and any persistent correction must be handled by external logic or host firmware. This behavior is explicitly documented in Note 1 of the datasheet.
What is the function of the Byte Power Down feature?
When both BHE and BLE are deasserted, the device automatically enters standby mode-even if CE remains active-reducing ICC to ≤8.7 µA. This eliminates the need for external power-gating signals and enables fine-grained power control per memory access pattern, critical for battery-operated industrial sensors.
Is the ERR pin present on CY62147G-45ZSXI?
No. The ERR pin is exclusive to CY62147GE variants (ordering code suffix "E"). CY62147G-45ZSXI is a G-series part without error indication output. Pin configuration diagrams confirm pin 29 is NC (no connect) in all CY62147G TSOP II layouts.
Can CY62147G-45ZSXI operate at 1.8 V?
No. This variant is rated for 2.2 V to 3.6 V only (speed grade "30" per ordering table). The 1.65–2.2 V range applies only to CY62147G-55ZSXI (55 ns version). Attempting 1.8 V operation violates VCC min specification and may cause timing violations or data retention failure.
CY62147G-45ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62147G-45ZSXI FAQ
1.How can I place an order for CY62147G-45ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62147G-45ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62147G-45ZSXI reliable?
The price and inventory of CY62147G-45ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147G-45ZSXI is usually 5 days.
3.What payment methods are accepted for CY62147G-45ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147G-45ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62147G-45ZSXI?
CY62147G-45ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62147G-45ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62147G-45ZSXI?
For technical support, including CY62147G-45ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147G-45ZSXI requirements.
6.How does Aetrix verify that CY62147G-45ZSXI is sourced from the original manufacturer or authorized distributors?
All CY62147G-45ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147G-45ZSXI meets industry standards.
7.What is the process for return or replacement of CY62147G-45ZSXI?
All CY62147G-45ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62147G-45ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62147G-45ZSXI part is unused and in its original packaging.
Return procedure for CY62147G-45ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62147G-45ZSXI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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