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Infineon Technologies CY62147GE18-55ZSXIT

Part No.:
CY62147GE18-55ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62147GE18-55ZSXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,497

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Product details

Overview

CY62147GE18-55ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), 256K × 16-bit organization, 55 ns access time, 1.65–2.2 V supply range, and ERR output pin for real-time error indication. It operates in industrial temperature range (–40 °C to +85 °C) and targets fault-tolerant microcontroller subsystems requiring data integrity.

For engineers reviewing the CY62147GE18-55ZSXIT datasheet, CY62147GE18-55ZSXIT pinout, CY62147GE18-55ZSXIT application, or CY62147GE18-55ZSXIT equivalent, key selection criteria include ECC-enabled reliability, ultra-low 3.5 µA typical standby current, dual/optional chip enable architecture, byte-level write control via BHE/ BLE, and VFBGA-48 packaging for space-constrained embedded designs.

Technical Context

This SRAM implements a dedicated ECC encoder/decoder block integrated into the memory array path, correcting single-bit errors on read without CPU intervention and asserting ERR high during correction. Its dual-chip-enable logic (CE1 low + CE2 high) enables selective bank isolation in multi-device systems.

The device supports three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), but CY62147GE18-55ZSXIT is specifically rated for 1.65–2.2 V operation at 55 ns speed. Byte Power Down mode activates automatically when both BHE and BLE are deasserted, forcing immediate transition to standby regardless of CE state.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size4 Mbit (256K words × 16-bit); supports full-word or byte-aligned data transfers
Access time55 ns max at VCC = 1.8 V; defines minimum cycle time for reliable read/write in timing-critical control loops
Supply voltage1.65 V to 2.2 V; compatible with modern low-voltage microcontrollers and FPGAs
Standby currentTypical 3.5 µA; enables >1-year battery life in always-on sensor nodes with periodic wake-up
ECC capabilitySingle-bit error correction with ERR output assertion; eliminates need for external error-handling firmware overhead
Data retention1.0 V minimum; maintains stored data during brown-out or deep-sleep modes without refresh
Operating temperature–40 °C to +85 °C; qualified for industrial automation and automotive body electronics

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address inputs18-bit address bus supporting full 256K-word addressing; A12–A17 used for row decoding
I/O0–I/O15Bidirectional data bus16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE
CE1 / CE2Dual chip enable inputsCE1 low + CE2 high enables device; allows hierarchical memory mapping in multi-SRAM systems
WEWrite enableActive-low signal initiating write cycle; synchronized with address and data setup/hold timing
OEOutput enableActive-low control for read data output; decouples memory access from system bus timing
BLE / BHEByte low/high enableIndependent control of lower/upper byte writes; enables efficient 8-bit peripheral interfacing
ERRError indication outputOpen-drain active-high signal pulsed during single-bit correction; requires external pull-up for system-level fault logging
VCC / VSSPower / groundDual VCC pins improve power delivery integrity; multiple VSS balls reduce ground bounce in high-speed operation

Key Features

FeatureDesign Value
Embedded ECC engineHardware-accelerated single-bit error correction with no CPU cycle penalty or software overhead
Byte Power Down modeAutomatic entry into ultra-low-power state when both BHE and BLE are inactive-no control register programming required
TTL-compatible I/ODirect interface with legacy 1.8 V/2.5 V/3.3 V logic families without level-shifting circuitry
Multi-voltage supportSingle part supports 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V rails-reduces BOM count across product variants
Industrial temperature ratingGuaranteed operation from –40 °C to +85 °C with full electrical specs-suitable for uncontrolled environments

Applications

Medical Infusion Pump ControllerIndustrial PLC I/O Module

Use Scenario: Stores calibrated dosage parameters and runtime logs in safety-critical drug delivery systems where bit corruption could cause overdose.

IC Role / Device Role / Timing Role: Nonvolatile parameter storage with real-time ECC correction; ERR pin triggers system alert and safe shutdown on detected error.

Use Value: Eliminates need for redundant checksum polling or external error-detection ICs-reducing PCB area and firmware complexity.

Use Scenario: Holds configuration data and process state variables in programmable logic controllers deployed in factory-floor cabinets.

IC Role / Device Role / Timing Role: High-reliability scratchpad memory accessed by ARM Cortex-M7 core during cyclic scan execution.

Use Value: 3.5 µA standby current extends uptime during mains failure; 55 ns access meets deterministic I/O update deadlines.

Railway Signaling Interface UnitAvionics Data Recorder Buffer

Use Scenario: Buffers train position reports and interlocking commands in EN 5012x-certified signaling hardware exposed to wide thermal swings.

IC Role / Device Role / Timing Role: Fault-tolerant working memory with automatic single-bit correction; ERR output feeds watchdog supervisor circuit.

Use Value: Meets SIL-3 functional safety requirements for memory integrity without external ECC controller or FPGA logic resources.

Use Scenario: Captures flight sensor telemetry at 10 kHz in black box recorders where radiation-induced soft errors must be mitigated.

IC Role / Device Role / Timing Role: High-speed buffer between ADC interface and flash storage; ECC ensures log integrity over 10+ year archival life.

Use Value: 1.0 V data retention allows continued memory hold during extended power loss-critical for post-crash forensic recovery.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM-with-ECC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV25616EDBLL-10MLINo embedded ECC; requires external error-checking logic or software CRC; 10 ns faster (10 ns access), higher ICC (30 mA typical)Suitable only where ECC is implemented at system level; not drop-in for safety-critical use casesSelect if speed > reliability, and system already handles error detection in firmware or FPGA
AS6C4008-55ZIN4-Mbit SRAM without ECC; 55 ns access; 2.7–3.6 V only; no ERR pin; 12 µA ISB typicalLacks hardware error correction-requires redesign of fault-handling architectureChoose only for cost-sensitive non-safety applications where voltage range matches and ECC is unnecessary

Compared with IS61WV25616EDBLL-10MLI and AS6C4008-55ZIN, CY62147GE18-55ZSXIT uniquely delivers integrated ECC with ERR signaling, ultra-low 3.5 µA standby, and triple-voltage support-making it the sole option for compact, battery-backed, safety-aware embedded systems needing zero-software-error-correction overhead.

Availability

CY62147GE18-55ZSXIT is available at Aetrix Electronics and suitable for medical infusion pump controllers, industrial PLC I/O modules, railway signaling interface units, and avionics data recorder buffers requiring stable component supply across long production lifecycles.

Supply support for CY62147GE18-55ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CY62147GE belongs to the MoBL® (Mobile Low-power) SRAM product line, designed specifically for battery-powered and thermally constrained embedded systems demanding high reliability, low static power, and hardware-assisted data integrity.

FAQ

Does CY62147GE18-55ZSXIT support automatic error write-back after correction?

No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite corrected data back to the memory cell. Write-back must be handled externally by the host processor if persistent correction is required. This behavior is explicitly documented in Note 1 of the datasheet and confirmed in the functional description section.

What is the function of the ERR pin, and how should it be interfaced?

The ERR pin is an open-drain output that goes HIGH during detection and correction of a single-bit error in the accessed word. It must be externally pulled up to VCC with a 4.7 kΩ resistor. The pulse width matches the read cycle duration, allowing direct connection to interrupt inputs or status registers in microcontrollers without additional conditioning circuitry.

Can CY62147GE18-55ZSXIT operate at 2.5 V?

No. CY62147GE18-55ZSXIT is specified only for the 1.65–2.2 V VCC range. Operation at 2.5 V falls outside its qualified voltage window and violates the Absolute Maximum Ratings table, risking parametric failure or accelerated wear-out. For 2.2–3.6 V operation, the CY62147GE30 variant must be selected instead.

Is the 48-ball VFBGA package lead-free and RoHS-compliant?

Yes. The "Z" suffix in CY62147GE18-55ZSXIT indicates a lead-free, RoHS-compliant package per Infineon's ordering nomenclature. The VFBGA package uses matte tin surface finish and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3), requiring bake prior to reflow if exposed beyond floor life.

CY62147GE18-55ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
1.65V ~ 2.2V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62147GE18-55ZSXIT FAQ

1.How can I place an order for CY62147GE18-55ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62147GE18-55ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62147GE18-55ZSXIT reliable?

The price and inventory of CY62147GE18-55ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147GE18-55ZSXIT is usually 5 days.

3.What payment methods are accepted for CY62147GE18-55ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147GE18-55ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62147GE18-55ZSXIT?

CY62147GE18-55ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62147GE18-55ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62147GE18-55ZSXIT?

For technical support, including CY62147GE18-55ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147GE18-55ZSXIT requirements.

6.How does Aetrix verify that CY62147GE18-55ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY62147GE18-55ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147GE18-55ZSXIT meets industry standards.

7.What is the process for return or replacement of CY62147GE18-55ZSXIT?

All CY62147GE18-55ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62147GE18-55ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62147GE18-55ZSXIT part is unused and in its original packaging.

Return procedure for CY62147GE18-55ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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