Infineon Technologies CY62147GE30-45BVXIT
- Part No.:
- CY62147GE30-45BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62147GE30-45BVXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,523
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Product details
Overview
CY62147GE30-45BVXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 256K × 16-bit, operating at 45 ns access time across 2.2–3.6 V supply. It features an ERR output pin for real-time ECC event indication, ultra-low standby current (8.7 µA max), and TTL-compatible I/Os. Used in industrial control modules where data integrity and low-power retention are critical.
For engineers reviewing the CY62147GE30-45BVXIT datasheet, CY62147GE30-45BVXIT pinout, CY62147GE30-45BVXIT application, or CY62147GE30-45BVXIT equivalent, key selection criteria include ECC-enabled reliability, dual-voltage support (2.2–3.6 V), 45 ns timing, 48-ball VFBGA package compatibility, and ERR signal behavior during read-cycle correction events.
Technical Context
This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors in real time during read operations, with ERR pin assertion confirming correction without automatic write-back. The memory array uses standard CMOS architecture with row/column decoding and sense amplifiers optimized for low-voltage operation.
It supports both single and dual chip enable configurations, byte-level write control via BHE/BLE, and seamless standby entry when both byte enables are deasserted-enabling dynamic power gating independent of CE state. Address range spans A0–A17 (18 bits), supporting full 256K-word access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (256K × 16-bit); provides 512 KB of word-accessible storage for embedded firmware or buffer applications. |
| Access Time | 45 ns at 2.2–3.6 V; ensures deterministic timing for real-time microcontroller interfaces running up to 22.22 MHz. |
| Supply Voltage Range | 2.2 V to 3.6 V; compatible with modern low-voltage SoCs and battery-backed industrial systems. |
| Standby Current | Max 8.7 µA; enables multi-year operation in energy-constrained edge nodes with periodic wake-up cycles. |
| ECC Function | Single-bit error detection and correction per read cycle; ERR pin asserts HIGH to flag corrected errors without interrupting data flow. |
| Data Retention | 1.0 V minimum; allows reliable hold mode during brown-out conditions or backup power transitions. |
| Package | 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA); 6 mm × 8 mm footprint with 0.5 mm pitch for high-density PCB layouts. |
Pinout & Package
Package: 48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch), RoHS-compliant, moisture-sensitive level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; no internal latching-requires stable setup/hold timing. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; HI-Z when deselected or OE/BLE/BHE inactive; TTL-compatible voltage thresholds. |
| CE1 / CE2 | Dual Chip Enable Inputs | Active-LOW CE1 and active-HIGH CE2 required simultaneously for device selection; enables hierarchical memory mapping. |
| WE | Write Enable | Active-LOW control for write cycles; synchronous with address and data setup; initiates ECC encoding on write. |
| OE | Output Enable | Active-LOW control for read data output; ERR pin status reflects ECC result only during asserted OE read cycles. |
| BHE / BLE | Byte High/Low Enable | Independent 8-bit write masking; BHE controls I/O8–I/O15, BLE controls I/O0–I/O7; enables partial-word updates. |
| ERR | Error Indication Output | Open-drain output asserting HIGH during single-bit error detection/correction; requires external pull-up for logic-level compatibility. |
| VCC / VSS | Power / Ground | Separate VCC and VSS pins per ball grid layout; decoupling recommended within 10 mm of each VCC ball. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC with ERR output | Real-time single-bit error correction per read cycle, signaled externally without CPU intervention or bus stall. |
| Ultra-low standby power | 8.7 µA maximum ISB2 enables >10-year battery-backed retention in industrial logging systems. |
| Multi-voltage operation | Single device supports 2.2–3.6 V range-eliminates need for level shifters in mixed-voltage subsystems. |
| Byte Power Down | Automatic transition to standby when BHE and BLE are both deasserted-even if CE remains active-reducing dynamic leakage. |
| TTL-compatible I/O | Direct interface with legacy microcontrollers and FPGAs without translation logic or external buffers. |
Applications
| Industrial PLC Memory Buffer | Medical Device Data Logger |
|---|---|
Use Scenario: Storing sensor calibration tables and runtime configuration in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding mission-critical parameters; accessed synchronously with 45 ns timing during scan cycles. Use Value: ECC prevents silent data corruption in long-term field deployments where firmware updates are infrequent and failure modes must be detectable. |
Use Scenario: Capturing ECG waveform snapshots in portable diagnostic equipment with intermittent power and battery backup. IC Role / Device Role / Timing Role: High-integrity buffer between ADC and flash storage; retains valid data at 1.0 V during brown-out events. Use Value: 8.7 µA standby current extends battery life beyond 3 years while ERR signaling enables automatic data revalidation before storage. |
| Railway Signaling Controller | Avionics Health Monitor |
Use Scenario: Holding safety-critical state machine variables in EN 5012x-certified trackside controllers exposed to thermal cycling. IC Role / Device Role / Timing Role: Dual CE-configured SRAM providing fault-isolated memory partitions; ERR pin feeds watchdog logic for error escalation. Use Value: SER FIT rate <0.1 FIT/Mb meets SIL-3 requirements for hardware fault tolerance without external ECC logic. |
Use Scenario: Recording flight parameter telemetry in DO-160G-compliant avionics units with wide input voltage tolerance. IC Role / Device Role / Timing Role: Interface-transparent SRAM bridging ARINC 429 receiver and host processor; operates across 2.2–3.6 V input range. Use Value: Eliminates need for discrete voltage translators in power-supply-flexible designs, reducing BOM count and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV25616EDBLL-10MLI | No integrated ECC; requires external error handling logic; 10 ns faster (10 ns access), but higher standby current (25 µA max). | Suitable for cost-sensitive designs where software ECC or external Hamming logic is acceptable. | Select when speed outweighs ECC integration and system-level error management is already implemented. |
| Micron MT45W8MW16BGX-107 IT:B | DDR2 SDRAM with optional on-die ECC; asynchronous interface differs; requires refresh controller and higher power (12 mA active). | Applicable in bandwidth-intensive buffering where burst reads justify complexity and power overhead. | Choose only if system already uses DDR2 infrastructure and can accommodate refresh timing constraints. |
Compared with IS61WV25616EDBLL-10MLI and MT45W8MW16BGX-107 IT:B, CY62147GE30-45BVXIT uniquely delivers integrated ECC with zero software overhead, sub-10 µA standby, and pin-compatible simplicity-making it optimal for safety-aware, low-power embedded systems without DDR infrastructure.
Availability
CY62147GE30-45BVXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical data loggers, and railway signaling controllers requiring stable component supply, long-lifecycle support, and guaranteed ECC functionality.
Supply support for CY62147GE30-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with emphasis on reliability and industrial-grade performance.
CY62147GE belongs to Infineon's MoBL® (Mobile Binary Logic) SRAM product line, designed specifically for low-power, high-reliability embedded systems requiring error-resilient memory in space- and energy-constrained environments.
FAQ
Does CY62147GE30-45BVXIT support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles and signals the event via the ERR pin, but does not automatically rewrite the corrected data back to the memory array. Write-back must be implemented externally if persistent correction is required. This design minimizes latency and avoids unintended writes during transient errors.
What is the function of the ERR pin during normal (error-free) operation?
During error-free reads, the ERR pin remains in a high-impedance (HI-Z) state and must be pulled up externally to VCC via a resistor (typically 4.7 kΩ). It only drives HIGH actively when a single-bit error is detected and corrected during a read cycle with OE asserted-providing unambiguous, hardware-level error notification.
Can CY62147GE30-45BVXIT operate across multiple voltage ranges simultaneously?
No. The device operates in one selected VCC range at a time: either 1.65–2.2 V, 2.2–3.6 V, or 4.5–5.5 V. The 2.2–3.6 V range is used by CY62147GE30-45BVXIT per its ordering code suffix "30". Mixing voltages across pins violates absolute maximum ratings and may cause latch-up or parametric failure.
Is the 48-ball VFBGA package lead-free and RoHS-compliant?
Yes. The "VXIT" suffix in CY62147GE30-45BVXIT denotes a lead-free, RoHS-compliant 48-ball VFBGA package with NiPdAu surface finish, qualified per JEDEC J-STD-020 moisture sensitivity level 3 and rated for reflow peak temperatures up to 260 °C.
CY62147GE30-45BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62147GE30-45BVXIT FAQ
1.How can I place an order for CY62147GE30-45BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62147GE30-45BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62147GE30-45BVXIT reliable?
The price and inventory of CY62147GE30-45BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147GE30-45BVXIT is usually 5 days.
3.What payment methods are accepted for CY62147GE30-45BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147GE30-45BVXIT transactions.
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4.How is shipping managed for CY62147GE30-45BVXIT?
CY62147GE30-45BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62147GE30-45BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62147GE30-45BVXIT?
For technical support, including CY62147GE30-45BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147GE30-45BVXIT requirements.
6.How does Aetrix verify that CY62147GE30-45BVXIT is sourced from the original manufacturer or authorized distributors?
All CY62147GE30-45BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147GE30-45BVXIT meets industry standards.
7.What is the process for return or replacement of CY62147GE30-45BVXIT?
All CY62147GE30-45BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62147GE30-45BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62147GE30-45BVXIT part is unused and in its original packaging.
Return procedure for CY62147GE30-45BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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