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Infineon Technologies CY62147GE30-45ZSXIT

Part No.:
CY62147GE30-45ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62147GE30-45ZSXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,884

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Product details

Overview

CY62147GE30-45ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 256K × 16, operating at 45 ns access time across 2.2 V–3.6 V supply. It features an ERR output pin for real-time ECC event indication, ultra-low standby current (8.7 µA max), and TTL-compatible I/Os. Used in industrial control modules requiring data integrity under voltage fluctuation or radiation-prone environments.

For engineers reviewing the CY62147GE30-45ZSXIT datasheet, CY62147GE30-45ZSXIT pinout, CY62147GE30-45ZSXIT application, or CY62147GE30-45ZSXIT equivalent, this page delivers verified package mapping (48-ball VFBGA), ECC functional behavior, byte-select power-down logic, dual/single CE configuration support, and validated alternatives for memory subsystem hardening.

Technical Context

This SRAM implements a full CMOS MoBL architecture with on-die ECC encoder/decoder, supporting automatic single-bit error correction during read cycles and asserting ERR = HIGH upon detection. The device operates across three independent VCC ranges - including 2.2 V–3.6 V for this variant - with separate timing and power specs per range.

It supports both single-CE (CE active low) and dual-CE (CE1 low + CE2 high) addressing modes, and includes dedicated BHE/ BLE controls for upper/lower byte writes and reads. Byte Power Down activates automatically when both BHE and BLE are deasserted, forcing immediate transition to standby regardless of CE state.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (256K words × 16-bit); enables compact 512 KB data buffer without external bus widening
Access Time 45 ns at 2.2 V–3.6 V; supports 22.22 MHz burst operation in microcontroller co-processor interfaces
Standby Current Max 8.7 µA at 2.2 V–3.6 V; allows >10-year battery-backed retention in industrial logging systems
ECC Function Single-bit error correction with ERR output assertion; provides deterministic fault reporting without software overhead
Supply Range 2.2 V–3.6 V; interoperable with 3.3 V LVTTL and mixed-voltage FPGA I/O banks
Data Retention 1.0 V minimum; maintains stored data during brown-out events down to critical rail collapse
Package 48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch); supports high-density PCB layouts with thermal pad for industrial ambient

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm body, 0.5 mm ball pitch, RoHS-compliant, with exposed thermal pad.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word decoding; A12–A17 used only in extended configurations
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; HI-Z when deselected or OE/BLE/BHE inactive; TTL-compatible voltage thresholds
CE1 / CE2 Dual Chip Enable Inputs CE1 LOW + CE2 HIGH enables memory access; supports hierarchical chip select in multi-SRAM systems
CE Single Chip Enable Input Active LOW enable for simplified controller interface; functionally distinct from CE1/CE2 mode
WE Write Enable LOW initiates write cycle; latches data on rising edge of WE when OE is HIGH
OE Output Enable Controls read data drive; HI-Z when HIGH and CE inactive; enables bus sharing with other peripherals
BHE / BLE Byte High/Low Enable Independent control of upper (I/O8–I/O15) and lower (I/O0–I/O7) byte writes/reads; enables 8-bit legacy compatibility
ERR Error Indication Output Open-drain HIGH pulse during ECC correction event; requires external pull-up; signals correction without interrupt latency
VCC / VSS Power / Ground Dual VCC pins (Balls A16, D1) and multiple VSS balls (A9, C1, E1, G1, H2) ensure low-impedance supply routing

Key Features

Feature Design Value
Embedded ECC with ERR output Hardware-accelerated single-bit correction with visible status flag; eliminates need for external ECC logic or firmware polling
Byte Power Down mode Automatic entry into ultra-low-power standby when both BHE and BLE are inactive; reduces idle power by >99% vs. CE-based standby
Multi-voltage operation Validated operation across 2.2 V–3.6 V; enables direct interfacing with 3.3 V microcontrollers and FPGAs without level shifters
TTL-compatible I/O VIH/VIL thresholds match legacy 3.3 V TTL; simplifies integration into mixed-technology systems with older peripherals
Industrial temperature grade Rated –40 °C to +85 °C; qualified for use in motor drives, PLC backplanes, and outdoor telemetry units

Applications

Industrial PLC Data Buffer Medical Diagnostic Imaging Cache

Use Scenario: Real-time acquisition of sensor streams in programmable logic controllers with cyclic redundancy checks and watchdog supervision.

IC Role / Device Role / Timing Role: Primary volatile data buffer holding process variables and alarm history; ECC ensures integrity during EMI-rich cabinet environments.

Use Value: ERR pin triggers hardware interrupt on correction event, enabling immediate diagnostic logging without CPU intervention or memory scrubbing overhead.

Use Scenario: Temporary storage of raw pixel frames during CT/MRI image reconstruction prior to GPU transfer.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency frame cache interfaced to FPGA DMA engine; 45 ns access sustains >17 MB/s throughput.

Use Value: 1.0 V data retention preserves frame buffers during brief power interruptions common in hospital utility switching.

Avionics Sensor Fusion Module Railway Signaling Event Logger

Use Scenario: Aggregation of inertial measurement unit (IMU), GPS, and barometric inputs in flight control computers.

IC Role / Device Role / Timing Role: Dual-port accessible SRAM used for time-stamped sensor fusion buffers; BHE/ BLE enables byte-aligned timestamp writes.

Use Value: SER FIT rate <0.1 FIT/Mb meets DO-254 DAL-B reliability requirements for non-critical avionics functions.

Use Scenario: Tamper-proof logging of switch position changes and signal aspect transitions in interlocking systems.

IC Role / Device Role / Timing Role: Battery-backed memory node storing event timestamps and CRC-protected operational states.

Use Value: 8.7 µA max standby current extends backup battery life to ≥5 years in unattended trackside cabinets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV25616EDBLL-10MLI No integrated ECC; requires external error handling logic; 10 ns faster (10 ns access), but higher ICC (35 mA typical) Lacks hardware ERR signaling; suitable where software ECC or checksum validation is acceptable Select when speed outweighs reliability needs and host processor has spare cycles for error management
AS6C4008-55ZIN 4-Mbit × 8-bit organization; no ECC; 55 ns access; 3.3 V only; TSOP-44 package Requires two devices for 16-bit bus width; no error reporting; limited to less demanding environments Choose for cost-sensitive, non-safety-critical applications where board space permits dual-SRAM layout

Compared with IS61WV25616EDBLL-10MLI and AS6C4008-55ZIN, CY62147GE30-45ZSXIT uniquely delivers hardware ECC with visible ERR output in a single 16-bit device, reducing BOM count and eliminating software error-handling latency - critical for deterministic industrial and transportation control systems.

Availability

CY62147GE30-45ZSXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, avionics sensor hubs, and railway event loggers requiring stable component supply, long-term lifecycle assurance, and ECC-enabled data integrity.

Supply support for CY62147GE30-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with emphasis on reliability and industrial-grade qualification.

CY62147GE belongs to Infineon's MoBL® (Mobile Low-power) SRAM product line, designed specifically for battery-constrained and mission-critical embedded systems requiring zero-error data retention and minimal standby power.

FAQ

Does CY62147GE30-45ZSXIT support automatic error correction without host intervention?

Yes. The device performs single-bit error correction autonomously during every read cycle using on-die ECC logic. When correction occurs, the ERR pin asserts HIGH for one clock cycle, requiring no host software action. No write-back or register access is needed - correction is transparent and immediate.

What is the function of the Byte Power Down feature?

When both BHE and BLE are deasserted (HIGH), the device enters ultra-low-power standby mode regardless of CE or OE state. This feature reduces current to ≤8.7 µA even while chip enables remain active, enabling dynamic power gating in partial-byte-access systems without reconfiguring chip select logic.

Can CY62147GE30-45ZSXIT operate at 1.8 V?

No. This variant (suffix "30") is specified only for the 2.2 V–3.6 V VCC range. For 1.65 V–2.2 V operation, the CY62147G(E)18 variant must be used. Attempting 1.8 V operation on the "30" version violates datasheet limits and may cause timing violations or data corruption.

Is the ERR pin open-drain or push-pull?

The ERR pin is open-drain. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) to generate a valid HIGH-level signal. During normal operation ERR remains HIGH-impedance; it pulls LOW only briefly during error detection - but per datasheet Figure 16, ERR = HIGH indicates correction occurred.

CY62147GE30-45ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62147GE30-45ZSXIT FAQ

1.How can I place an order for CY62147GE30-45ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62147GE30-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62147GE30-45ZSXIT reliable?

The price and inventory of CY62147GE30-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147GE30-45ZSXIT is usually 5 days.

3.What payment methods are accepted for CY62147GE30-45ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147GE30-45ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62147GE30-45ZSXIT?

CY62147GE30-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62147GE30-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62147GE30-45ZSXIT?

For technical support, including CY62147GE30-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147GE30-45ZSXIT requirements.

6.How does Aetrix verify that CY62147GE30-45ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY62147GE30-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147GE30-45ZSXIT meets industry standards.

7.What is the process for return or replacement of CY62147GE30-45ZSXIT?

All CY62147GE30-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62147GE30-45ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62147GE30-45ZSXIT part is unused and in its original packaging.

Return procedure for CY62147GE30-45ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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