Infineon Technologies CY62147GE30-45ZSXIT
- Part No.:
- CY62147GE30-45ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62147GE30-45ZSXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:3,884
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Product details
Overview
CY62147GE30-45ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 256K × 16, operating at 45 ns access time across 2.2 V–3.6 V supply. It features an ERR output pin for real-time ECC event indication, ultra-low standby current (8.7 µA max), and TTL-compatible I/Os. Used in industrial control modules requiring data integrity under voltage fluctuation or radiation-prone environments.
For engineers reviewing the CY62147GE30-45ZSXIT datasheet, CY62147GE30-45ZSXIT pinout, CY62147GE30-45ZSXIT application, or CY62147GE30-45ZSXIT equivalent, this page delivers verified package mapping (48-ball VFBGA), ECC functional behavior, byte-select power-down logic, dual/single CE configuration support, and validated alternatives for memory subsystem hardening.
Technical Context
This SRAM implements a full CMOS MoBL architecture with on-die ECC encoder/decoder, supporting automatic single-bit error correction during read cycles and asserting ERR = HIGH upon detection. The device operates across three independent VCC ranges - including 2.2 V–3.6 V for this variant - with separate timing and power specs per range.
It supports both single-CE (CE active low) and dual-CE (CE1 low + CE2 high) addressing modes, and includes dedicated BHE/ BLE controls for upper/lower byte writes and reads. Byte Power Down activates automatically when both BHE and BLE are deasserted, forcing immediate transition to standby regardless of CE state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (256K words × 16-bit); enables compact 512 KB data buffer without external bus widening |
| Access Time | 45 ns at 2.2 V–3.6 V; supports 22.22 MHz burst operation in microcontroller co-processor interfaces |
| Standby Current | Max 8.7 µA at 2.2 V–3.6 V; allows >10-year battery-backed retention in industrial logging systems |
| ECC Function | Single-bit error correction with ERR output assertion; provides deterministic fault reporting without software overhead |
| Supply Range | 2.2 V–3.6 V; interoperable with 3.3 V LVTTL and mixed-voltage FPGA I/O banks |
| Data Retention | 1.0 V minimum; maintains stored data during brown-out events down to critical rail collapse |
| Package | 48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch); supports high-density PCB layouts with thermal pad for industrial ambient |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm body, 0.5 mm ball pitch, RoHS-compliant, with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word decoding; A12–A17 used only in extended configurations |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; HI-Z when deselected or OE/BLE/BHE inactive; TTL-compatible voltage thresholds |
| CE1 / CE2 | Dual Chip Enable Inputs | CE1 LOW + CE2 HIGH enables memory access; supports hierarchical chip select in multi-SRAM systems |
| CE | Single Chip Enable Input | Active LOW enable for simplified controller interface; functionally distinct from CE1/CE2 mode |
| WE | Write Enable | LOW initiates write cycle; latches data on rising edge of WE when OE is HIGH |
| OE | Output Enable | Controls read data drive; HI-Z when HIGH and CE inactive; enables bus sharing with other peripherals |
| BHE / BLE | Byte High/Low Enable | Independent control of upper (I/O8–I/O15) and lower (I/O0–I/O7) byte writes/reads; enables 8-bit legacy compatibility |
| ERR | Error Indication Output | Open-drain HIGH pulse during ECC correction event; requires external pull-up; signals correction without interrupt latency |
| VCC / VSS | Power / Ground | Dual VCC pins (Balls A16, D1) and multiple VSS balls (A9, C1, E1, G1, H2) ensure low-impedance supply routing |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC with ERR output | Hardware-accelerated single-bit correction with visible status flag; eliminates need for external ECC logic or firmware polling |
| Byte Power Down mode | Automatic entry into ultra-low-power standby when both BHE and BLE are inactive; reduces idle power by >99% vs. CE-based standby |
| Multi-voltage operation | Validated operation across 2.2 V–3.6 V; enables direct interfacing with 3.3 V microcontrollers and FPGAs without level shifters |
| TTL-compatible I/O | VIH/VIL thresholds match legacy 3.3 V TTL; simplifies integration into mixed-technology systems with older peripherals |
| Industrial temperature grade | Rated –40 °C to +85 °C; qualified for use in motor drives, PLC backplanes, and outdoor telemetry units |
Applications
| Industrial PLC Data Buffer | Medical Diagnostic Imaging Cache |
|---|---|
|
Use Scenario: Real-time acquisition of sensor streams in programmable logic controllers with cyclic redundancy checks and watchdog supervision. IC Role / Device Role / Timing Role: Primary volatile data buffer holding process variables and alarm history; ECC ensures integrity during EMI-rich cabinet environments. Use Value: ERR pin triggers hardware interrupt on correction event, enabling immediate diagnostic logging without CPU intervention or memory scrubbing overhead. |
Use Scenario: Temporary storage of raw pixel frames during CT/MRI image reconstruction prior to GPU transfer. IC Role / Device Role / Timing Role: High-bandwidth, low-latency frame cache interfaced to FPGA DMA engine; 45 ns access sustains >17 MB/s throughput. Use Value: 1.0 V data retention preserves frame buffers during brief power interruptions common in hospital utility switching. |
| Avionics Sensor Fusion Module | Railway Signaling Event Logger |
|
Use Scenario: Aggregation of inertial measurement unit (IMU), GPS, and barometric inputs in flight control computers. IC Role / Device Role / Timing Role: Dual-port accessible SRAM used for time-stamped sensor fusion buffers; BHE/ BLE enables byte-aligned timestamp writes. Use Value: SER FIT rate <0.1 FIT/Mb meets DO-254 DAL-B reliability requirements for non-critical avionics functions. |
Use Scenario: Tamper-proof logging of switch position changes and signal aspect transitions in interlocking systems. IC Role / Device Role / Timing Role: Battery-backed memory node storing event timestamps and CRC-protected operational states. Use Value: 8.7 µA max standby current extends backup battery life to ≥5 years in unattended trackside cabinets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616EDBLL-10MLI | No integrated ECC; requires external error handling logic; 10 ns faster (10 ns access), but higher ICC (35 mA typical) | Lacks hardware ERR signaling; suitable where software ECC or checksum validation is acceptable | Select when speed outweighs reliability needs and host processor has spare cycles for error management |
| AS6C4008-55ZIN | 4-Mbit × 8-bit organization; no ECC; 55 ns access; 3.3 V only; TSOP-44 package | Requires two devices for 16-bit bus width; no error reporting; limited to less demanding environments | Choose for cost-sensitive, non-safety-critical applications where board space permits dual-SRAM layout |
Compared with IS61WV25616EDBLL-10MLI and AS6C4008-55ZIN, CY62147GE30-45ZSXIT uniquely delivers hardware ECC with visible ERR output in a single 16-bit device, reducing BOM count and eliminating software error-handling latency - critical for deterministic industrial and transportation control systems.
Availability
CY62147GE30-45ZSXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, avionics sensor hubs, and railway event loggers requiring stable component supply, long-term lifecycle assurance, and ECC-enabled data integrity.
Supply support for CY62147GE30-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with emphasis on reliability and industrial-grade qualification.
CY62147GE belongs to Infineon's MoBL® (Mobile Low-power) SRAM product line, designed specifically for battery-constrained and mission-critical embedded systems requiring zero-error data retention and minimal standby power.
FAQ
Does CY62147GE30-45ZSXIT support automatic error correction without host intervention?
Yes. The device performs single-bit error correction autonomously during every read cycle using on-die ECC logic. When correction occurs, the ERR pin asserts HIGH for one clock cycle, requiring no host software action. No write-back or register access is needed - correction is transparent and immediate.
What is the function of the Byte Power Down feature?
When both BHE and BLE are deasserted (HIGH), the device enters ultra-low-power standby mode regardless of CE or OE state. This feature reduces current to ≤8.7 µA even while chip enables remain active, enabling dynamic power gating in partial-byte-access systems without reconfiguring chip select logic.
Can CY62147GE30-45ZSXIT operate at 1.8 V?
No. This variant (suffix "30") is specified only for the 2.2 V–3.6 V VCC range. For 1.65 V–2.2 V operation, the CY62147G(E)18 variant must be used. Attempting 1.8 V operation on the "30" version violates datasheet limits and may cause timing violations or data corruption.
Is the ERR pin open-drain or push-pull?
The ERR pin is open-drain. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) to generate a valid HIGH-level signal. During normal operation ERR remains HIGH-impedance; it pulls LOW only briefly during error detection - but per datasheet Figure 16, ERR = HIGH indicates correction occurred.
CY62147GE30-45ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62147GE30-45ZSXIT FAQ
1.How can I place an order for CY62147GE30-45ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62147GE30-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62147GE30-45ZSXIT reliable?
The price and inventory of CY62147GE30-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147GE30-45ZSXIT is usually 5 days.
3.What payment methods are accepted for CY62147GE30-45ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147GE30-45ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62147GE30-45ZSXIT?
CY62147GE30-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62147GE30-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62147GE30-45ZSXIT?
For technical support, including CY62147GE30-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147GE30-45ZSXIT requirements.
6.How does Aetrix verify that CY62147GE30-45ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY62147GE30-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147GE30-45ZSXIT meets industry standards.
7.What is the process for return or replacement of CY62147GE30-45ZSXIT?
All CY62147GE30-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62147GE30-45ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62147GE30-45ZSXIT part is unused and in its original packaging.
Return procedure for CY62147GE30-45ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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