Infineon Technologies CY62147GE-45ZSXIT
- Part No.:
- CY62147GE-45ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62147GE-45ZSXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:4,751
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Product details
Overview
CY62147GE-45ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 256K × 16, operating at 45 ns access time across 2.2 V–3.6 V supply range. It features an ERR output pin for real-time ECC event indication, ultra-low standby current (8.7 µA max), and TTL-compatible I/Os. Used in industrial control modules requiring data integrity under radiation-prone or long-term reliability conditions.
For engineers reviewing the CY62147GE-45ZSXIT datasheet, CY62147GE-45ZSXIT pinout, CY62147GE-45ZSXIT application, or CY62147GE-45ZSXIT equivalent, key selection criteria include ECC-enabled memory integrity, dual-voltage operation (2.2–3.6 V), 45 ns timing, 48-ball VFBGA package compatibility, and ERR signal behavior during read-cycle correction events.
Technical Context
This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors in real time during read operations, with no automatic write-back - correction occurs only in the sense amplifier path. The ERR pin asserts HIGH upon successful 1-bit correction, enabling system-level fault logging without interrupting memory access flow.
It supports both single and dual chip enable configurations, byte-level write control via BHE/ BLE, and seamless Byte Power Down mode when both byte enables are deasserted - reducing standby power independent of CE state. Address decoding covers A0–A17 (18-bit), supporting full 256K-word addressing with no external address multiplexing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (256K words × 16-bit), enabling direct interface to 16-bit microcontrollers without data splitting. |
| Access Time | 45 ns at 2.2–3.6 V, ensuring deterministic timing for real-time industrial firmware execution. |
| Supply Voltage Range | 2.2 V to 3.6 V, compatible with modern low-voltage SoC I/O domains and battery-backed systems. |
| Standby Current | Max 8.7 µA at TA = 85 °C, supporting >10-year data retention in always-on edge nodes. |
| ECC Function | Single-bit error detection and correction per read cycle, with ERR pin assertion confirming correction event. |
| Data Retention | 1.0 V minimum VCC for data retention, allowing graceful degradation during brown-out conditions. |
| Package | 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm footprint, suitable for space-constrained PCB layouts. |
Pinout & Package
48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3. Pin layout optimized for signal integrity: power/ground balls distributed across corners and edges; address/data lines grouped with controlled impedance routing paths.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; no multiplexing required. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; supports byte-wide reads/writes via BHE/ BLE control. |
| CE1 / CE2 | Dual Chip Enable Inputs | Active-LOW CE1 and active-HIGH CE2 enable memory access only when both asserted - reduces spurious writes. |
| WE | Write Enable | Active-LOW control for synchronous write cycles; latches data on falling edge. |
| OE | Output Enable | Active-LOW control for read data output; places I/Os in HI-Z when deasserted. |
| BHE / BLE | Byte High/Low Enable | Independent control of upper/lower byte writes or reads; enables partial-word access without masking logic. |
| ERR | Error Indication Output | Open-drain output asserting HIGH during single-bit correction; requires external pull-up for system monitoring. |
| VCC / VSS | Power / Ground | Dual VCC pins (Balls A1, H1) and multiple VSS balls (Balls D1, E1, G1, etc.) ensure low-impedance supply distribution. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC engine | On-die Hamming-code encoder/decoder corrects 1-bit errors per 16-bit word without CPU intervention or latency penalty. |
| Byte Power Down mode | Automatic entry into ultra-low-power state when BHE and BLE are both HIGH - eliminates need for external power-gating logic. |
| TTL-compatible I/Os | Direct interface to legacy 3.3 V microcontrollers and FPGAs without level-shifting circuitry. |
| Multi-voltage support | Single device operates across 2.2–3.6 V, simplifying BOM management for mixed-voltage board designs. |
| ERR pin signaling | Dedicated open-drain output confirms ECC correction event per read cycle - enables deterministic fault logging in safety-critical firmware. |
Applications
| Industrial PLC Memory Buffer | Medical Diagnostic Imaging Cache |
|---|---|
Use Scenario: Stores real-time I/O scan data and ladder logic state variables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile SRAM buffer with ECC protection ensures data integrity during voltage sags, EMI exposure, or extended thermal cycling. Use Value: Prevents corrupted control outputs due to bit flips, avoiding unsafe machine motion or process shutdowns in SIL-2 compliant systems. | Use Scenario: Caches raw sensor frames from ultrasound transducer arrays before FPGA-based beamforming processing. IC Role / Device Role / Timing Role: Low-latency 16-bit memory interface synchronized to 45 ns timing budget, with ECC validation of frame headers and metadata. Use Value: Eliminates retransmission overhead and frame loss caused by cosmic-ray-induced soft errors in portable imaging devices. |
| Railway Signaling Controller RAM | Avionics Data Logger Buffer |
Use Scenario: Holds interlocking logic tables and route status flags in EN 5012x-certified signaling cabinets operating continuously for 20+ years. IC Role / Device Role / Timing Role: ECC-protected SRAM providing 1.0 V data retention during 100 ms power interruptions, meeting IEC 62425 requirements. Use Value: Guarantees zero uncorrectable errors over lifetime, satisfying failure-in-time (FIT) target <0.1 FIT/Mb per AN88889. | Use Scenario: Buffers flight parameter telemetry (altitude, attitude, engine RPM) sampled at 1 kHz before compression and storage to flash. IC Role / Device Role / Timing Role: High-reliability SRAM with ERR pin tied to flight recorder watchdog circuit for immediate fault flagging. Use Value: Enables post-event root-cause analysis by correlating ECC correction timestamps with sensor anomalies during turbulence or lightning strikes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616EDBLL-10MLI | No integrated ECC; requires external error-checking logic or software overhead. 10 ns faster (10 ns access), but higher standby current (25 µA max). | Suitable where ECC is implemented at system level (e.g., ARM Cortex-R with SDRAM controller ECC), not silicon-level. | Select when speed outweighs ECC requirement and system firmware can manage error detection. |
| AS6C4008-55ZIN | 4-Mbit × 8-bit organization (not ×16); no ERR pin; 55 ns access only; no multi-voltage support (3.3 V only). | Fits 8-bit bus architectures; lacks real-time error signaling - requires polling or external comparator for error detection. | Choose for cost-sensitive 8-bit MCU designs where ECC is non-critical and timing margin allows 55 ns. |
Compared with IS61WV25616EDBLL-10MLI and AS6C4008-55ZIN, CY62147GE-45ZSXIT uniquely delivers hardware-accelerated ECC with dedicated ERR signaling in a 16-bit × 256K configuration and 45 ns timing - essential for deterministic, safety-aware memory subsystems in industrial and transportation electronics.
Availability
CY62147GE-45ZSXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, railway signaling controllers, and avionics data loggers requiring stable component supply across extended product lifecycles.
Supply support for CY62147GE-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.
CY62147GE belongs to the MoBL® (Mobile Bit-Library) SRAM product line, designed specifically for battery-powered and mission-critical embedded systems demanding ultra-low power, ECC resilience, and industrial temperature operation.
FAQ
Does CY62147GE-45ZSXIT support automatic error correction write-back?
No. The device performs single-bit error correction in the sense amplifier path during read cycles only, and does not perform automatic write-back to memory cells. Corrected data appears on I/O lines, but the original erroneous bit remains unmodified in the array unless explicitly rewritten by the host system.
What is the function of the ERR pin during normal (error-free) operation?
During error-free reads, the ERR pin remains in a high-impedance (HI-Z) state when not actively driven. It only asserts HIGH (requires external pull-up) for the duration of a read cycle where a single-bit error is detected and corrected. No pulse filtering or debouncing is built-in - system firmware must sample ERR synchronously with OE timing.
Can CY62147GE-45ZSXIT operate at 1.8 V?
No. This specific variant (CY62147GE-45ZSXIT) is rated for 2.2 V to 3.6 V operation only. The 1.65 V–2.2 V speed grade (55 ns) is offered under part numbers like CY62147GE-55SXI, not the -45ZSXIT suffix. Operating below 2.2 V violates datasheet specifications and may cause timing violations or ECC failure.
Is the 48-ball VFBGA package lead-free and RoHS-compliant?
Yes. The ZSXIT suffix denotes a lead-free, RoHS-compliant 48-ball VFBGA package with NiPdAu surface finish, qualified per J-STD-020 moisture sensitivity level 3 (MSL3), and compatible with standard Pb-free reflow profiles (peak 260 °C).
CY62147GE-45ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62147GE-45ZSXIT FAQ
1.How can I place an order for CY62147GE-45ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62147GE-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62147GE-45ZSXIT reliable?
The price and inventory of CY62147GE-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147GE-45ZSXIT is usually 5 days.
3.What payment methods are accepted for CY62147GE-45ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147GE-45ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62147GE-45ZSXIT?
CY62147GE-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62147GE-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62147GE-45ZSXIT?
For technical support, including CY62147GE-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147GE-45ZSXIT requirements.
6.How does Aetrix verify that CY62147GE-45ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY62147GE-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147GE-45ZSXIT meets industry standards.
7.What is the process for return or replacement of CY62147GE-45ZSXIT?
All CY62147GE-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62147GE-45ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62147GE-45ZSXIT part is unused and in its original packaging.
Return procedure for CY62147GE-45ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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