Infineon Technologies CY62148ESL-55ZAXA

Overview

CY62148ESL-55ZAXA from Infineon Technologies (formerly Cypress) is a 4-Mbit (512K × 8) CMOS static RAM with 55 ns access time, operating across dual voltage ranges (2.2–3.6 V and 4.5–5.5 V), ultra-low standby current (2.5 µA typ), and automatic CE-controlled power-down. It serves as main memory or buffer in battery-powered industrial controllers and automotive infotainment head units.

For engineers reviewing the CY62148ESL-55ZAXA datasheet, CY62148ESL-55ZAXA pinout, CY62148ESL-55ZAXA application, or CY62148ESL-55ZAXA equivalent, key selection criteria include TTL-compatible I/O levels, STSOP-32 package footprint, 55 ns read/write timing, dual-voltage support, and MoBL™ low-power architecture for extended runtime in portable systems.

Technical Context

The device implements a full CMOS 512K × 8 SRAM array with independent address decoding, sense amplifiers, and input/output buffers. Its automatic power-down activates when CE is HIGH, reducing ICC to ≤7 µA while placing I/Os in high-Z state-enabling seamless integration into bus-shared architectures without external isolation.

It supports three primary access modes: read (CE & OE LOW, WE HIGH), write (CE & WE LOW), and standby (CE HIGH). Timing is specified at f_max = 1/t_RC = 18.2 MHz (55 ns cycle), with t_DOE = 25 ns and t_LZOE = 5 ns ensuring fast output enable response for burst-mode processors.

Key Specifications

Pinout & Package

Package: 32-pin Shrunk Thin Small Outline Package (STSOP), JEDEC MO-227 compliant, 0.5 mm lead pitch, 10.2 mm × 5.3 mm body size, thermal resistance θ_JA = 49.02 °C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with IS62WV5128BLL-55NLI and R1LV5128ASB-55PB, CY62148ESL-55ZAXA uniquely supports both 2.2–3.6 V and 4.5–5.5 V operation with TTL I/O - eliminating redesign effort when migrating legacy 5 V platforms to mixed-voltage architectures.

Availability

CY62148ESL-55ZAXA is available at Aetrix Electronics and suitable for industrial data loggers, automotive infotainment head units, and medical handheld diagnostic tools requiring stable component supply across extended temperature ranges (–40 °C to +85 °C) and long product lifecycles.

Supply support for CY62148ESL-55ZAXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with strong focus on reliability and industrial longevity.

CY62148ESL belongs to Infineon's MoBL™ (More Battery Life) SRAM product line, engineered specifically for ultra-low-power portable and automotive applications where extended battery runtime and robust data retention under voltage stress are mandatory.

FAQ

Is CY62148ESL-55ZAXA compatible with 5 V microcontrollers?

Yes - it features TTL-compatible input thresholds (VIH = 2.2 V min at VCC ≥ 2.7 V) and operates up to 5.5 V, allowing direct connection to legacy 5 V MCUs like the 8051 or PIC18F without level shifters. However, VCC must be set to 4.5–5.5 V range for full 5 V system compliance.

What happens to data during power brown-out below 2.2 V?

Data retention is guaranteed down to 1.5 V VCC, as confirmed in the datasheet's Data Retention Characteristics table. Below 1.5 V, contents may be lost. The device enters data retention mode automatically when CE is HIGH and VCC drops into this range, preserving memory until power recovers or resets.

Can CY62148ESL-55ZAXA replace older 5 V-only SRAMs like the HM62256?

Yes - its 55 ns access time, 512K × 8 organization, and TTL-compatible I/O match HM62256 functionality. Key advantages include 99% lower standby current (2.5 µA vs ~1 mA), smaller STSOP-32 footprint, and extended voltage flexibility. No PCB redesign is needed beyond VCC routing adjustments.

Does the STSOP-32 package require special PCB layout considerations?

Yes - the 0.5 mm lead pitch demands controlled impedance routing and strict solder mask definition. Datasheet recommends 0.25 mm trace/space, 0.3 mm pad width, and dedicated ground plane beneath the package. Thermal vias under the exposed pad (if present) are not applicable - STSOP has no thermal pad.