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Infineon Technologies CY62148EV30LL-45BVI

Part No.:
CY62148EV30LL-45BVI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
36-VFBGA
Datasheet:
AetrixCY62148EV30LL-45BVI.pdf
Description:
IC SRAM 4MBIT PARALLEL 36VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,091

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Product details

Overview

CY62148EV30LL-45BVI from Infineon Technologies (formerly Cypress) is a 4-Mbit (512K × 8) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and industrial/automotive-A temperature rating (–40 °C to +85 °C). It delivers ultra-low standby current (2.5 µA typ), active current of 3.5 mA at 1 MHz, and automatic CE-controlled power-down-enabling battery-critical MoBL® applications such as portable medical monitors and automotive telematics modules.

For engineers reviewing the CY62148EV30LL-45BVI datasheet, CY62148EV30LL-45BVI pinout, CY62148EV30LL-45BVI application, or CY62148EV30LL-45BVI equivalent, key selection criteria include verified 45 ns read cycle time, guaranteed 7 µA max ISB2 across industrial temp, VFBGA-36 package compatibility, and functional equivalence to CY62148DV30 in memory expansion designs.

Technical Context

This SRAM implements a synchronous, non-volatile-retention-free CMOS architecture with independent address/data bus separation, full static operation (no refresh required), and dual-active control logic for CE/OE/WE. Its internal sense amplifier array and low-threshold transistors enable sub-50 ns tAA while maintaining <6 mA ICC at fmax under 3.6 V.

The device supports three distinct power states: active (CE/OE LOW, WE HIGH for read; CE/WE LOW for write), standby (CE HIGH), and data retention (VCC ≥ 1.5 V, CE HIGH). Tri-state output control is enforced via OE and CE, with tHZOE ≤ 18 ns and tLZCE = 10 ns-critical for high-speed bus arbitration in multi-SRAM systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 8 bits - provides byte-wide data interface compatible with 8-bit microcontrollers and legacy peripherals without data bus multiplexing.
Access Time (tAA) 45 ns max - ensures reliable read timing at 22.2 MHz system clock when interfaced with FPGA or ARM Cortex-M4 controllers.
Supply Voltage Range 2.2 V to 3.6 V - supports direct connection to single-cell Li-ion (3.0–3.6 V) or dual-cell NiMH (2.4–3.0 V) power rails without LDO regulation.
Standby Current (ISB2) 7 µA max at 3.6 V, –40 °C to +85 °C - enables >1-year battery life in always-on sensor nodes with periodic wake-up intervals.
Operating Temperature –40 °C to +85 °C - qualified for under-hood automotive modules and industrial PLC I/O expansion cards per AEC-Q100 Class 2 requirements.
Package Type 36-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch) - enables high-density PCB layouts in space-constrained handheld diagnostics tools.
Data Retention Voltage 1.5 V min - allows graceful degradation during brown-out events; retains contents through 100 ms VCC dip below nominal operating range.

Pinout & Package

Package: 36-ball Very Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant, Pb-free.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit address bus supporting full 512K-word decoding; no internal latching-requires stable address before CE assertion.
I/O0–I/O7 Bidirectional Data Bus CMOS-compatible 8-bit data path; enters high-Z state within 18 ns of OE or CE deassertion to prevent bus contention.
CE Chip Enable Active-low global enable; forces automatic power-down and high-Z outputs when HIGH-primary control for system-level sleep mode.
OE Output Enable Active-low read strobe; overrides WE state during read cycles; must be LOW with CE LOW and WE HIGH to enable output drivers.
WE Write Enable Active-low write strobe; initiates write when CE and WE both LOW; controls data latch timing with tSD = 25 ns setup requirement.
VCC Power Supply Single 2.2–3.6 V supply; decoupling capacitor (≥100 nF) required within 5 mm of VCC ball per JEDEC MO-220 standards.
VSS Ground Dual ground balls (pins B1, H1) provide low-inductance return path for switching currents; must be connected to solid ground plane.
NC No Connect Pins D1 and F1 are unconnected on die-must remain unpopulated or left floating; not to be tied to VCC/VSS.

Key Features

Feature Design Value
MoBL® Ultra-Low Power Architecture Reduces active current to 3.5 mA at 1 MHz and standby to 2.5 µA typical-enables continuous sensing in wearable ECG patches with CR2032 coin cell.
Automatic CE-Controlled Power-Down Enters sub-µA retention state within 45 ns of CE HIGH-eliminates need for external power-gating circuitry in battery-backed real-time clocks.
Pin Compatibility with CY62148DV30 Identical pinout and timing across VFBGA/TSOP II packages-allows drop-in replacement without PCB redesign in legacy industrial HMIs.
Wide Operating Voltage Range Functions reliably from 2.2 V (end-of-life Li-ion) to 3.6 V (fresh cell)-removes voltage monitoring and shutdown logic in portable test equipment.
High-Speed 45 ns Read Cycle tRC = 45 ns guarantees deterministic response for interrupt-driven data capture in automotive CAN FD gateways with <100 ns latency budgets.

Applications

Portable Medical Monitors Automotive Telematics Units

Use Scenario: Continuous acquisition of ECG waveforms at 1 kS/s with local buffering prior to BLE transmission.

IC Role / Device Role / Timing Role: Byte-addressable SRAM buffer holding 8 seconds of raw waveform data; operates in burst-read mode synchronized to ADC DRDY signal.

Use Value: 45 ns tAA enables zero-wait-state reads by Cortex-M4F core; 2.5 µA ISB2 extends battery life beyond 72 hours on single AAA cell.

Use Scenario: Storing GPS position logs and cellular modem firmware patches in vehicle infotainment head units.

IC Role / Device Role / Timing Role: Non-refreshing memory for volatile cache between eMMC and application processor; accessed via 8-bit parallel bus during boot sequence.

Use Value: –40 °C to +85 °C rating ensures reliability in dashboard-mounted units; VFBGA-36 footprint minimizes board area vs. TSOP alternatives.

Industrial PLC I/O Expansion Cards Handheld Diagnostic Tools

Use Scenario: Local storage of sensor calibration tables and real-time I/O status snapshots in modular automation controllers.

IC Role / Device Role / Timing Role: Memory-mapped peripheral buffer accessible by dual-core RISC-V MCU over parallel address/data bus with CE/OE handshaking.

Use Value: Pin compatibility with CY62148DV30 allows reuse of existing driver firmware; 7 µA max ISB2 meets IEC 61000-6-2 immunity test power budget limits.

Use Scenario: Temporary storage of oscilloscope waveform captures and protocol analyzer packet buffers in field-service multimeters.

IC Role / Device Role / Timing Role: High-speed scratchpad memory enabling 10 MS/s sampling with 128 ksample depth; powered directly from 3.3 V LDO rail.

Use Value: 36-ball VFBGA enables compact 4-layer PCB design; 1.5 V data retention voltage prevents data loss during hot-swap battery changes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS62WV5128BLL-45NLI Same 512K × 8 organization and 45 ns speed, but 2.7–3.6 V only; higher ISB2 (15 µA max); SOIC-32 package only. Lacks wide-voltage support and VFBGA option-unsuitable for single-cell battery systems or high-density layouts. Select only if board already uses SOIC-32 footprint and system VCC is regulated ≥2.7 V.
CY62148EV30LL-45BVIT Identical electrical specs and pinout, but TSOP II-32 package (11.8 × 10.0 mm) instead of VFBGA-36; same 45 ns speed grade. Higher thermal resistance (59.1 °C/W vs. 44.8 °C/W) limits use in sealed enclosures above 70 °C ambient. Choose for manual assembly or cost-sensitive applications where board space permits larger package.

Compared with IS62WV5128BLL-45NLI and CY62148EV30LL-45BVIT, the CY62148EV30LL-45BVI uniquely combines 2.2–3.6 V operation, VFBGA-36 packaging, and 7 µA max ISB2-making it the only option for space-constrained, wide-input-voltage, low-power embedded systems requiring guaranteed industrial temperature performance.

Availability

CY62148EV30LL-45BVI is available at Aetrix Electronics and suitable for portable medical monitors, automotive telematics units, and industrial PLC I/O expansion cards requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant VFBGA packaging.

Supply support for CY62148EV30LL-45BVI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

This device belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power, wide-voltage, industrial-grade memory applications in portable and automotive electronics.

FAQ

What is the minimum VCC required to retain data in CY62148EV30LL-45BVI?

The device guarantees data retention down to VCC = 1.5 V when CE is held HIGH, as specified in the Data Retention Characteristics table (page 6 of datasheet 38-05576 Rev. *X). Below 1.5 V, data integrity is not assured-even with CE HIGH-and retention time becomes unpredictable. This threshold enables operation during brown-out conditions common in battery-powered systems.

Can CY62148EV30LL-45BVI be used with a 1.8 V I/O interface?

No. The input voltage thresholds (VIH/VIL) are defined relative to VCC, not fixed logic levels. With VCC ≥ 2.2 V, VIH minimum is 1.8 V (for VCC = 2.2–2.7 V) or 2.2 V (for VCC = 2.7–3.6 V). A 1.8 V interface cannot reliably meet VIH requirements unless VCC is reduced to 2.2 V-but even then, VOL and VOH margins degrade significantly per Electrical Characteristics table (page 4).

Does CY62148EV30LL-45BVI require an external clock signal?

No. As a static RAM, it operates asynchronously-timing is controlled solely by CE, OE, and WE signal edges. No clock input is present or needed. All read/write operations are initiated and completed based on setup/hold timing relationships between address, control, and data signals, as defined in the Switching Characteristics table (page 7).

What is the maximum junction temperature during continuous operation?

Based on thermal resistance θJA = 44.79 °C/W (VFBGA) and maximum ICC = 20 mA at 3.6 V, power dissipation is ≤72 mW. With 25 °C ambient, junction temperature rise is ≤3.2 °C-well below the absolute maximum rating of +125 °C. Derating is only required above 85 °C ambient, where θJA increases due to reduced convection.

CY62148EV30LL-45BVI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
36-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
512K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
36-VFBGA (6x8)

CY62148EV30LL-45BVI FAQ

1.How can I place an order for CY62148EV30LL-45BVI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62148EV30LL-45BVI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62148EV30LL-45BVI reliable?

The price and inventory of CY62148EV30LL-45BVI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62148EV30LL-45BVI is usually 5 days.

3.What payment methods are accepted for CY62148EV30LL-45BVI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62148EV30LL-45BVI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62148EV30LL-45BVI?

CY62148EV30LL-45BVI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62148EV30LL-45BVI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62148EV30LL-45BVI?

For technical support, including CY62148EV30LL-45BVI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62148EV30LL-45BVI requirements.

6.How does Aetrix verify that CY62148EV30LL-45BVI is sourced from the original manufacturer or authorized distributors?

All CY62148EV30LL-45BVI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62148EV30LL-45BVI meets industry standards.

7.What is the process for return or replacement of CY62148EV30LL-45BVI?

All CY62148EV30LL-45BVI units undergo pre-shipment inspection (PSI). If there is an issue with CY62148EV30LL-45BVI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62148EV30LL-45BVI part is unused and in its original packaging.

Return procedure for CY62148EV30LL-45BVI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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