My Inquiry
My Account
Infineon Technologies CY62148EV30LL-45ZSXIT
- Part No.:
- CY62148EV30LL-45ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.400", 10.16mm Width)
- Datasheet:
-
CY62148EV30LL-45ZSXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 32TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:1,390
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62148EV30LL-45ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (512K × 8) CMOS static RAM with 45 ns access time, operating across 2.2 V–3.6 V supply, rated for –40 °C to +85 °C industrial/automotive-A environments, and featuring ultra-low standby current (7 µA max) and active current (6 mA max at fmax). It serves as main memory or buffer in portable battery-powered systems requiring fast, low-power volatile storage.
For engineers reviewing the CY62148EV30LL-45ZSXIT datasheet, CY62148EV30LL-45ZSXIT pinout, CY62148EV30LL-45ZSXIT application, or CY62148EV30LL-45ZSXIT equivalent, key selection criteria include VFBGA-36 package compatibility, CE/OE/WE control timing compliance, MoBL® low-power retention behavior, and pin-for-pin replacement feasibility with CY62148DV30 in space-constrained embedded designs.
Technical Context
This SRAM implements a fully decoded 512K × 8 architecture with synchronous address latch and tri-state I/O drivers. Its automatic power-down logic activates when CE is HIGH, reducing ICC to ≤7 µA while maintaining data integrity down to 1.5 V VCC during retention mode.
Timing is governed by strict AC parameters: tRC = 45 ns, tAA = 45 ns, tDOE = 22 ns, and tPD = 45 ns - all guaranteed over full voltage (2.2–3.6 V) and temperature (–40 °C to +85 °C) ranges, enabling reliable integration into high-speed microcontroller bus interfaces without wait states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (512K × 8), providing byte-wide data path compatible with 8-bit MCU buses and legacy controllers. |
| Access Time | 45 ns max - enables direct connection to 22 MHz synchronous bus clocks without cycle stretching. |
| Supply Voltage | 2.2 V to 3.6 V - supports single-supply operation across Li-ion battery discharge profiles (3.6 V → 2.5 V). |
| Standby Current | 7 µA max (Industrial) - extends battery life >10× vs. standard SRAMs in always-on sensor nodes. |
| Operating Temperature | –40 °C to +85 °C - qualified for automotive cabin modules and industrial edge controllers. |
| Package | 36-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch) - optimized for compact PCB layouts in handheld and telematics units. |
| Data Retention Voltage | 1.5 V min - maintains stored contents during brown-out or controlled shutdown sequences. |
Pinout & Package
Package: 36-ball very fine-pitch ball grid array (VFBGA), 6 mm × 8 mm body, 0.5 mm pitch, JEDEC MO-276 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word decoding; no external address latching required. |
| I/O0–I/O7 | Bidirectional Data Bus | CMOS-compatible 8-bit I/O with high-impedance state on CE HIGH, OE HIGH, or WE LOW - enables bus sharing. |
| CE | Chip Enable | Active-LOW enable controlling both access and automatic power-down; dominant control for system-level sleep coordination. |
| OE | Output Enable | Active-LOW output gate; decouples data bus without affecting internal state or power mode. |
| WE | Write Enable | Active-LOW write strobe; combined with CE LOW initiates write cycle; independent of OE state. |
| VCC | Power Supply | Single 2.2–3.6 V supply; internally regulated for stable core voltage across rail variation. |
| VSS | Ground | Dual ground balls (pins B1, H1) minimize noise coupling and improve signal integrity in high-speed reads. |
| NC | No Connect | Pins D1 and F1 are unconnected on die - must be left floating or tied to ground per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power | 2.5 µA typical standby current enables >1-year battery life in coin-cell–powered IoT endpoints. |
| Automatic Power-Down | Hardware-triggered entry into sub-µA retention mode within 45 ns of CE deassertion - no firmware overhead. |
| Pin Compatibility | Direct drop-in replacement for CY62148DV30 in VFBGA and TSOP II packages - simplifies second-source migration. |
| Wide Voltage Operation | Full 45 ns timing guaranteed from 2.2 V to 3.6 V - eliminates need for LDO regulation in multi-rail systems. |
| High-Z Output Control | Independent OE and CE gating ensures glitch-free bus release during multi-master arbitration or reset sequencing. |
Applications
| Wireless Sensor Node Memory | Automotive Body Control Module |
|---|---|
|
Use Scenario: Stores calibration tables and real-time sensor logs in BLE-enabled environmental monitors powered by CR2032 batteries. IC Role / Device Role / Timing Role: Volatile working memory interfaced directly to ARM Cortex-M0+ via 8-bit parallel bus; accessed at 20 MHz burst rates. Use Value: 2.5 µA standby current extends operational lifetime beyond 3 years on single coin cell without duty-cycling overhead. |
Use Scenario: Holds door lock actuator status history and CAN message buffers in vehicle body control units exposed to under-hood thermal cycling. IC Role / Device Role / Timing Role: Non-critical data cache between microcontroller and LIN/CAN transceivers; operates at 45 ns timing margin under 125 °C junction conditions. Use Value: –40 °C to +85 °C qualification and 1.5 V data retention ensure fault-free logging during cold cranking or thermal shutdown events. |
| Portable Medical Diagnostic Device | Industrial PLC I/O Expansion Module |
|
Use Scenario: Buffers ECG waveform samples prior to USB bulk transfer in handheld patient monitors with rechargeable Li-Po batteries. IC Role / Device Role / Timing Role: High-speed FIFO buffer synchronized to ADC clock; supports burst writes at 1 MHz sustained rate with <6 mA active ICC. Use Value: 45 ns access time eliminates pipeline stalls during 12-bit, 1 kSPS acquisition - critical for real-time arrhythmia detection. |
Use Scenario: Stores configuration registers and transient I/O state snapshots in DIN-rail mounted programmable logic controllers with 24 V DC input rails. IC Role / Device Role / Timing Role: Configuration scratchpad memory mapped into microcontroller's external bus interface; accessed during cold start and firmware update phases. Use Value: VFBGA-36 footprint minimizes PCB area in dense I/O carrier boards while maintaining thermal resistance of 44.79 °C/W (θJA). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62148DV30-45ZSXI | Same 4-Mbit organization and 45 ns speed, but older Cypress die revision; lacks updated data retention spec at 1.5 V. | Valid for legacy designs where qualification to AEC-Q100 Grade 2 is not required. | Select only if existing design validation covers original CY62148DV30 timing margins and thermal derating. |
| IS62WV5128BLL-45NLI | 45 ns access, 512K × 8, but requires 3.3 V ±10% supply; higher ISB (15 µA max) and no 2.2 V operation. | Suitable for fixed 3.3 V industrial systems with less stringent battery-life requirements. | Choose when board already uses 3.3 V LDO and thermal profile stays below 70 °C ambient. |
Compared with CY62148DV30-45ZSXI, the CY62148EV30LL-45ZSXIT adds guaranteed 1.5 V data retention and tighter ISB2 spec; versus IS62WV5128BLL-45NLI, it delivers wider voltage range and lower standby power - making it optimal for battery-operated or automotive-grade deployments.
Availability
CY62148EV30LL-45ZSXIT is available at Aetrix Electronics and suitable for wireless sensor nodes, automotive body control modules, and portable medical diagnostic devices requiring stable component supply, long-term lifecycle support, and qualified industrial/automotive temperature performance.
Supply support for CY62148EV30LL-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the MoBL® SRAM portfolio, delivering high-reliability memory solutions for automotive, industrial, and IoT markets.
This device belongs to the MoBL® (More Battery Life™) Static RAM product line, engineered specifically for ultra-low-power, battery-sensitive applications including portable instrumentation, telematics, and energy-harvesting sensor systems.
FAQ
Is CY62148EV30LL-45ZSXIT pin-compatible with CY62148DV30 in VFBGA packages?
Yes - both parts share identical 36-ball VFBGA pinouts, address/data/control signal mapping, and power/ground ball locations. No PCB redesign is needed when migrating from CY62148DV30-45ZSXI to CY62148EV30LL-45ZSXIT, though layout review for thermal pad soldering and decoupling is recommended per Infineon's AN98523.
What is the minimum VCC required to retain data without refresh?
The device guarantees data retention down to 1.5 V VCC when CE is HIGH and ambient temperature remains within –40 °C to +85 °C. At this voltage, ICCDR is specified at 8.8 µA max, enabling extended hold times during brown-out or backup power transitions.
Does CY62148EV30LL-45ZSXIT support partial-address decoding or require full A0–A18?
It requires full 19-bit address decoding (A0–A18) - the internal decoder is hardwired for 512K × 8 organization with no address aliasing or partial decode modes. External address lines must drive all 19 bits; unused upper address bits cannot be masked or ignored without causing unintended memory access.
Can OE and WE be tied together for simplified control in write-only applications?
No - OE and WE serve independent functions: OE controls output driver enable, while WE controls write latch enable. Tying them risks bus contention during read-modify-write sequences and violates timing specs for tLZOE, tHZOE, and tPWE. Separate routing is mandatory for compliant operation per Figure 8 in datasheet Rev. *X.
CY62148EV30LL-45ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP II
CY62148EV30LL-45ZSXIT FAQ
1.How can I place an order for CY62148EV30LL-45ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62148EV30LL-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62148EV30LL-45ZSXIT reliable?
The price and inventory of CY62148EV30LL-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62148EV30LL-45ZSXIT is usually 5 days.
3.What payment methods are accepted for CY62148EV30LL-45ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62148EV30LL-45ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62148EV30LL-45ZSXIT?
CY62148EV30LL-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62148EV30LL-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62148EV30LL-45ZSXIT?
For technical support, including CY62148EV30LL-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62148EV30LL-45ZSXIT requirements.
6.How does Aetrix verify that CY62148EV30LL-45ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY62148EV30LL-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62148EV30LL-45ZSXIT meets industry standards.
7.What is the process for return or replacement of CY62148EV30LL-45ZSXIT?
All CY62148EV30LL-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62148EV30LL-45ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62148EV30LL-45ZSXIT part is unused and in its original packaging.
Return procedure for CY62148EV30LL-45ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62148EV30LL-45ZSXIT Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
