Infineon Technologies CY62148G30-45SXIT
- Part No.:
- CY62148G30-45SXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.445", 11.30mm Width)
- Datasheet:
-
CY62148G30-45SXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 32SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,680
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62148G30-45SXIT from Infineon is a 4-MB MoBL™ ultra-low-power SRAM with embedded ECC, organized as 512K words × 8-bit. It operates at 45 ns access time across 2.2 V–3.6 V supply, delivers 3.5 µA typical standby current, and supports TTL-compatible I/Os in a 32-pin SOIC package for battery-backed memory subsystems in industrial controllers.
For engineers reviewing the CY62148G30-45SXIT datasheet, CY62148G30-45SXIT pinout, CY62148G30-45SXIT application, or CY62148G30-45SXIT equivalent, this device is selected for low-power embedded systems requiring error-corrected volatile memory with wide voltage tolerance, fast read/write cycles, and data retention down to 1.0 V.
Technical Context
This SRAM implements a synchronous, address-decoded 512K × 8-bit array with dedicated row/column decoders, sense amplifiers, and integrated ECC encoder/decoder logic. It performs single-bit error correction on read data without automatic write-back, and uses standard CMOS control signals (CE, OE, WE) for asynchronous operation.
Memory access is initiated by asserting CE LOW; reads require OE LOW with valid address, while writes require both WE and CE LOW with data present on I/O0–I/O7. All I/Os enter high-impedance state when CE is HIGH or OE is deasserted, ensuring bus isolation during deselect.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 MB (512K × 8-bit), enabling storage of firmware variables or real-time buffers in resource-constrained microcontrollers |
| Access Time | 45 ns at 2.2–3.6 V, supporting 22.22 MHz burst reads in industrial-grade timing-critical applications |
| Standby Current | 3.5 µA typical / 8.7 µA max, allowing multi-year battery life in always-on sensor nodes |
| Voltage Range | 2.2 V to 3.6 V, compatible with Li-ion, Li-Po, and regulated 3.3 V rails without level-shifting |
| ECC Function | Embedded single-bit error correction (no automatic write-back), reducing uncorrectable soft-error risk in harsh EMI environments |
| Data Retention | 1.0 V minimum retention voltage, permitting graceful shutdown and resume after brownout events |
| I/O Interface | TTL-compatible inputs/outputs, simplifying integration with legacy MCU GPIOs and FPGAs without external translators |
Pinout & Package
Package: 32-pin SOIC (Small Outline Integrated Circuit), surface-mount, JEDEC MS-012AC compliant, 12.8 mm × 7.5 mm footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word decoding; A0 LSB, A18 MSB |
| I/O0–I/O7 | Bidirectional Data Lines | 8-bit parallel data path; tri-stated when CE HIGH or OE deasserted |
| /CE | Chip Enable (active LOW) | Primary device select; disables internal circuitry and forces I/Os to HI-Z when HIGH |
| /OE | Output Enable (active LOW) | Controls output drivers only; read data appears on I/Os when /OE and /CE are LOW |
| /WE | Write Enable (active LOW) | Enables write cycle; data latched on rising edge of /WE when /CE is LOW |
| VCC | Power Supply | 2.2–3.6 V main supply; decoupling required within 10 mm of pin |
| VSS | Ground | Digital ground reference; must be connected to low-impedance PCB plane |
Key Features
| Feature | Design Value |
|---|---|
| MoBL™ Ultra-Low-Power Architecture | Reduces active and standby power vs. standard SRAMs, enabling use in energy-harvesting and portable medical devices |
| Embedded Single-Bit ECC | Corrects bit-flips on-the-fly during read without CPU intervention, improving system reliability in industrial automation |
| Multi-Voltage Operation | Single part supports 2.2–3.6 V range, eliminating BOM variants for different power rail designs |
| 1.0-V Data Retention | Preserves memory contents during deep sleep or partial power loss, enabling fast wake-up without reload |
| TTL-Compatible I/Os | Direct interface with 3.3 V MCUs and FPGAs without level shifters, reducing component count and layout complexity |
Applications
| Industrial PLC Data Logging | Medical Wearable Sensor Buffer |
|---|---|
Use Scenario: Storing timestamped sensor readings and alarm history in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Volatile buffer memory with ECC protection for critical operational logs, accessed asynchronously via ARM Cortex-M4 GPIOs. Use Value: 3.5 µA standby current extends backup battery life beyond 5 years; 45 ns access enables real-time logging at 20 kSPS. | Use Scenario: Holding raw ECG and accelerometer samples between Bluetooth LE transmission bursts in a Class II wearable device. IC Role / Device Role / Timing Role: Low-voltage SRAM buffer interfacing directly with an nRF52840 SoC's parallel memory interface. Use Value: 1.0 V data retention allows safe suspend-to-RAM during RF transmit gaps; 2.2–3.6 V range matches coin-cell + LDO output. |
| Smart Meter Firmware Cache | Railway Signaling Event Recorder |
Use Scenario: Caching decryption keys and tariff tables in ANSI C12.19-compliant electricity meters exposed to wide temperature swings. IC Role / Device Role / Timing Role: Secure, error-corrected RAM for sensitive configuration data, accessed under strict EMVCo timing constraints. Use Value: Embedded ECC prevents corruption from cosmic rays in outdoor deployments; 8.7 µA max ISB ensures compliance with IEC 62056 leakage limits. | Use Scenario: Capturing train position, speed, and signal aspect transitions for post-event forensic analysis in EN 50128 SIL-2 systems. IC Role / Device Role / Timing Role: High-reliability buffer memory with deterministic 45 ns read latency, synchronized to safety-critical FPGA logic. Use Value: MoBL™ architecture sustains operation at –40°C to +85°C; single-bit ECC meets DO-254 fault coverage requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power SRAM with ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV5128BLL-45NLI | No embedded ECC; requires external error-handling logic; 45 ns access at 2.7–3.6 V only | Suitable where system-level ECC is already implemented in FPGA or MCU firmware | Select if cost sensitivity outweighs reliability requirement and board space permits external ECC logic |
| Cypress S27KL0641DPBHI020 | Serial Quad SPI NOR Flash with ECC; 64 Mbit density; not pin-compatible; slower random access (~8 µs) | Used for code storage, not volatile data buffering; requires different controller interface | Choose only when non-volatility and boot-code storage are primary needs over fast SRAM-like access |
Compared with IS62WV5128BLL-45NLI and S27KL0641DPBHI020, CY62148G30-45SXIT uniquely delivers integrated ECC, true 45 ns parallel access, and 1.0 V data retention-making it optimal for safety-critical, battery-sensitive volatile memory roles where external error handling or serial latency is unacceptable.
Availability
CY62148G30-45SXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical wearables, smart meters, and railway signaling systems requiring stable component supply across extended temperature and long product lifecycles.
Supply support for CY62148G30-45SXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
CY62148G belongs to the MoBL™ (Mobile Bitline) SRAM product line, designed specifically for ultra-low-power, high-reliability embedded applications where data integrity and extended battery life are mandatory.
FAQ
Does CY62148G30-45SXIT support automatic error correction write-back?
No. The embedded ECC corrects single-bit errors during read operations only and does not trigger automatic write-back to the memory array. Error detection flags are not exposed externally, and correction is transparent to the host system. This design minimizes latency and power but requires higher-layer software to manage uncorrectable multi-bit errors.
What is the maximum clock frequency supported for continuous read/write cycling?
CY62148G30-45SXIT is an asynchronous SRAM and does not use a clock signal. Its maximum sustained operation rate is determined by AC timing: for 45 ns access, the minimum cycle time is 90 ns, enabling up to 11.1 MHz random read/write throughput. Continuous burst access is limited by address setup/hold and control signal timing margins per the datasheet's AC switching characteristics table.
Can this device operate reliably at 2.0 V supply?
No. CY62148G30-45SXIT is specified only for the 2.2 V to 3.6 V operating range. At 2.0 V, parameters including access time, standby current, and VIH/VIL thresholds are outside guaranteed specifications. For sub-2.2 V operation, consider the CY62148G18 variant (1.65 V–2.2 V range), which has different speed and power ratings.
Is the 32-pin SOIC package RoHS and REACH compliant?
Yes. CY62148G30-45SXIT carries the "XIT" suffix indicating lead-free (Pb-free), RoHS-compliant packaging per EU Directive 2011/65/EU and REACH SVHC screening. The SOIC package uses matte tin terminations and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) for standard SMT reflow profiles.
CY62148G30-45SXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.445", 11.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
CY62148G30-45SXIT FAQ
1.How can I place an order for CY62148G30-45SXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62148G30-45SXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62148G30-45SXIT reliable?
The price and inventory of CY62148G30-45SXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62148G30-45SXIT is usually 5 days.
3.What payment methods are accepted for CY62148G30-45SXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62148G30-45SXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62148G30-45SXIT?
CY62148G30-45SXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62148G30-45SXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62148G30-45SXIT?
For technical support, including CY62148G30-45SXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62148G30-45SXIT requirements.
6.How does Aetrix verify that CY62148G30-45SXIT is sourced from the original manufacturer or authorized distributors?
All CY62148G30-45SXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62148G30-45SXIT meets industry standards.
7.What is the process for return or replacement of CY62148G30-45SXIT?
All CY62148G30-45SXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62148G30-45SXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62148G30-45SXIT part is unused and in its original packaging.
Return procedure for CY62148G30-45SXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62148G30-45SXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

