My Inquiry
My Account
Infineon Technologies CY62148GN30-45SXI
- Part No.:
- CY62148GN30-45SXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.400", 10.16mm Width)
- Datasheet:
-
CY62148GN30-45SXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 32TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,646
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62148GN30-45SXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (512K × 8) CMOS static RAM with 45 ns access time, operating across dual voltage ranges (2.2–3.6 V and 4.5–5.5 V), ultra-low standby current (3.5 µA typical), and automatic CE-controlled power-down. It serves as main or buffer memory in portable industrial controllers requiring deterministic timing and battery longevity.
For engineers reviewing the CY62148GN30-45SXI datasheet, CY62148GN30-45SXI pinout, CY62148GN30-45SXI application, or CY62148GN30-45SXI equivalent, key selection criteria include guaranteed 45 ns read/write cycle timing, dual-voltage compatibility, sub-10 µA max ISB2 standby current, TSOP II/SOIC package footprint, and MoBL® low-power architecture for extended runtime in energy-constrained systems.
Technical Context
This SRAM implements a full CMOS 512K × 8 array with independent address decoding (A0–A18), eight bidirectional I/O lines (I/O0–I/O7), and three control inputs (CE, OE, WE) enabling precise bus arbitration and seamless memory expansion. Its automatic power-down logic activates when CE is HIGH, reducing ICC to ≤8.7 µA without external sequencing.
The device supports two distinct VCC operating bands: low-voltage mode (2.2–3.6 V) optimized for battery-powered instrumentation, and 5 V mode (4.5–5.5 V) for legacy industrial backplanes. All AC parameters-including tRC = 45 ns, tAA = 45 ns, and tHZOE ≤ 18 ns-are fully specified and tested across –40 °C to +85 °C industrial temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (512K × 8) - provides byte-wide data path compatible with 8-bit microcontrollers and FPGA configuration buffers |
| Access Time | 45 ns - guarantees deterministic read latency for real-time control loops with ≤22 MHz bus clocking |
| VCC Range | 2.2–3.6 V or 4.5–5.5 V - enables direct integration into mixed-supply systems without level shifters |
| Standby Current | Max 8.7 µA at VCC(max) - extends battery life >10 years in always-on sensor nodes with periodic wake-up |
| Operating Temperature | –40 °C to +85 °C - qualified for deployment in industrial PLCs, motor drives, and outdoor metering hardware |
| Package | 32-pin TSOP II (0.4 mm pitch) - surface-mount compatible with automated SMT assembly and high-density PCB layouts |
| Power-Down Trigger | CE HIGH at CMOS level - eliminates need for external sleep controllers; transitions to retention mode within 45 ns |
Pinout & Package
Available in Pb-free 32-pin thin small outline package (TSOP II), 10.2 mm × 14.2 mm body, 0.4 mm lead pitch, JEDEC MO-143AC compliant. Pin 1 index marked by notch or dot.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; no internal latching - requires stable address during CE LOW |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristate I/O lines; high-impedance when CE HIGH, OE HIGH, or WE LOW - prevents bus contention during write or deselect |
| CE | Chip Enable | Active-LOW enable controlling power state; HIGH forces automatic power-down and disables outputs regardless of OE/WE |
| OE | Output Enable | Active-LOW control for read data output; must be LOW with CE LOW and WE HIGH to drive I/O pins with valid data |
| WE | Write Enable | Active-LOW signal initiating write cycle; concurrent CE LOW and WE LOW latches data from I/O0–I/O7 into addressed location |
| VCC | Supply Voltage | Single supply input supporting dual voltage ranges; decoupling capacitor required at pin for noise immunity and transient response |
| VSS | Ground | Reference return path for all signals; separate VSS pin ensures stable reference under dynamic switching conditions |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces standby current to ≤8.7 µA while maintaining full data retention - critical for coin-cell-powered IoT edge nodes |
| Automatic CE-Controlled Power-Down | Eliminates external power management ICs; enters low-power state within 45 ns of CE deassertion without software intervention |
| Dual-Voltage Operation | Supports both 2.5 V/3.3 V and 5 V system rails without voltage translation - simplifies BOM in multi-generation designs |
| High-Speed 45 ns Timing | Meets strict timing budgets for 22 MHz synchronous buses; tHZOE ≤ 18 ns enables fast bus turnaround in shared-memory architectures |
| Industrial Temperature Range | Validated operation from –40 °C to +85 °C - suitable for uncontrolled environments including factory floors and utility substations |
Applications
| Portable Data Loggers | Industrial PLC I/O Modules |
|---|---|
|
Use Scenario: Battery-operated environmental sensors record temperature, humidity, and pressure at 1-second intervals for 30 days before upload. IC Role / Device Role / Timing Role: Primary data buffer storing timestamped samples; retains data during deep-sleep cycles between measurements. Use Value: 3.5 µA typical ISB2 enables >5-year battery life on CR2032; 45 ns access allows rapid burst writes during active sampling windows. |
Use Scenario: Modular PLC base unit interfaces with analog input cards, digital I/O expanders, and communication gateways via shared backplane. IC Role / Device Role / Timing Role: Local scratchpad memory for firmware patch storage and real-time process variable buffering. Use Value: Dual-voltage support (2.2–3.6 V / 4.5–5.5 V) accommodates mixed-voltage backplane designs; TSOP II footprint fits constrained card-edge space. |
| Smart Utility Meters | Medical Diagnostic Handhelds |
|
Use Scenario: Electricity meters store tariff data, consumption history, and event logs for remote retrieval over RF or PLC networks. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding critical billing records during mains failure or firmware updates. Use Value: Automatic CE power-down preserves data integrity during brownouts; 1 V data retention capability (VDR ≥ 1.0 V) ensures reliability down to near-zero supply. |
Use Scenario: Portable ultrasound or ECG devices acquire and preprocess waveform data before wireless transmission to cloud platforms. IC Role / Device Role / Timing Role: High-speed frame buffer staging raw ADC samples prior to DSP compression and encryption. Use Value: 45 ns tRC and tWC support 22 MHz parallel bus throughput; low capacitance (CIN/COUT ≤ 10 pF) minimizes signal distortion on high-frequency traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV5128BLL-45NLI | Same density (512K × 8), 45 ns speed, but single 2.7–3.6 V supply only; no 5 V mode | Not suitable for 5 V legacy industrial backplanes; requires level-shifting in mixed-rail systems | Select when design uses only 3.3 V rail and prioritizes lower cost over voltage flexibility |
| ON Semiconductor NVSRAM NVTFS4M8T1G | Nonvolatile SRAM with integrated EEPROM backup; higher standby current (15 µA typ); 55 ns access | Provides automatic data retention after power loss; trades speed and power for nonvolatility | Select when data persistence through unexpected power interruption is mandatory, not just low-power operation |
Compared with IS62WV5128BLL-45NLI and NVTFS4M8T1G, CY62148GN30-45SXI uniquely balances dual-voltage support, 45 ns performance, and sub-10 µA standby-making it optimal for portable industrial equipment where supply voltage variation and battery runtime are primary constraints.
Availability
CY62148GN30-45SXI is available at Aetrix Electronics and suitable for portable data loggers, industrial PLC I/O modules, and smart utility meters requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for CY62148GN30-45SXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with strong industrial and automotive focus.
CY62148GN30-45SXI belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power, high-reliability memory in portable and energy-sensitive industrial electronics.
FAQ
What is the minimum VCC required for data retention in CY62148GN30-45SXI?
The device guarantees data retention down to VCC = 1.0 V (VDR ≥ 1.0 V), as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤13 µA, and the chip maintains stored contents without refresh. This enables reliable operation during brownout conditions or gradual battery discharge in portable systems.
Can CY62148GN30-45SXI operate reliably at 2.5 V and still meet its 45 ns timing specifications?
Yes. The 45 ns access time (tRC, tAA, tWC) is fully specified and tested across the entire 2.2–3.6 V range, including 2.5 V operation. Electrical characteristics tables confirm VOH, VOL, and switching parameters remain compliant at VCC = 2.5 V with appropriate load conditions per Figure 2 test setup.
Does the TSOP II package of CY62148GN30-45SXI support reflow soldering per J-STD-020?
Yes. The Pb-free 32-pin TSOP II package is qualified for standard lead-free reflow profiles per J-STD-020D, with peak temperature up to 260 °C and time above liquidus (TAL) of 60–150 seconds. Thermal resistance data (θJA = 79.03 °C/W) confirms suitability for convection-reflow processes on standard four-layer PCBs.
How does the automatic power-down feature interact with OE and WE during CE HIGH assertion?
When CE is driven HIGH at CMOS level, the device immediately enters power-down mode regardless of OE or WE state. I/O pins go high-impedance, internal arrays are gated, and ICC drops to ≤8.7 µA. OE and WE become irrelevant for power control - only CE determines active vs. retention state.
CY62148GN30-45SXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP II
CY62148GN30-45SXI FAQ
1.How can I place an order for CY62148GN30-45SXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62148GN30-45SXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62148GN30-45SXI reliable?
The price and inventory of CY62148GN30-45SXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62148GN30-45SXI is usually 5 days.
3.What payment methods are accepted for CY62148GN30-45SXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62148GN30-45SXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62148GN30-45SXI?
CY62148GN30-45SXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62148GN30-45SXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62148GN30-45SXI?
For technical support, including CY62148GN30-45SXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62148GN30-45SXI requirements.
6.How does Aetrix verify that CY62148GN30-45SXI is sourced from the original manufacturer or authorized distributors?
All CY62148GN30-45SXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62148GN30-45SXI meets industry standards.
7.What is the process for return or replacement of CY62148GN30-45SXI?
All CY62148GN30-45SXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62148GN30-45SXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62148GN30-45SXI part is unused and in its original packaging.
Return procedure for CY62148GN30-45SXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62148GN30-45SXI Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
