Infineon Technologies CY62148GN30-45ZSXI
- Part No.:
- CY62148GN30-45ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.400", 10.16mm Width)
- Datasheet:
-
CY62148GN30-45ZSXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 32TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:3,800
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Product details
Overview
CY62148GN30-45ZSXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (512K × 8) CMOS static RAM with 45 ns access time, operating across dual voltage ranges (2.2–3.6 V and 4.5–5.5 V), ultra-low standby current (3.5 µA typical), and automatic CE-controlled power-down. It serves as main or buffer memory in portable industrial controllers requiring deterministic timing and battery longevity.
For engineers reviewing the CY62148GN30-45ZSXI datasheet, CY62148GN30-45ZSXI pinout, CY62148GN30-45ZSXI application, or CY62148GN30-45ZSXI equivalent, key selection criteria include guaranteed 45 ns read/write cycle timing, dual-voltage compatibility, sub-10 µA max standby current, TSOP II/SOIC package footprint, and MoBL® low-power architecture for energy-constrained embedded systems.
Technical Context
This SRAM implements a fully static 512K × 8 array with complementary metal oxide semiconductor (CMOS) process technology, enabling zero-refresh operation and deterministic timing without clock dependency. Its logic-level control interface uses asynchronous CE/OE/WE signals to manage read, write, and automatic power-down states.
The device supports two distinct VCC operating ranges-2.2–3.6 V and 4.5–5.5 V-with separate AC/DC specifications per range. Standby current drops below 10 µA when CE is HIGH, and data retention remains valid down to 1.0 V with ICCDR ≤ 13 µA, enabling robust brown-out resilience in portable instrumentation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (512K × 8) - provides byte-wide data bus interface with 19-bit address space (A0–A18) |
| Access Time | 45 ns - guarantees maximum read latency under worst-case voltage/temperature conditions |
| VCC Operating Ranges | 2.2–3.6 V and 4.5–5.5 V - enables direct integration into mixed-voltage systems without level-shifting |
| Standby Current (ISB2) | 3.5 µA typical / 8.7 µA max - ensures multi-year battery life in always-on sensor nodes |
| Data Retention Voltage | 1.0 V minimum (VDR) - maintains stored data during deep sleep or partial power loss |
| Input/Output Capacitance | 10 pF (CIN/COUT) - minimizes signal integrity impact on high-speed parallel buses |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade environmental reliability |
Pinout & Package
Package: 32-pin Thin Small Outline Package (TSOP II), 10.16 mm × 13.10 mm body, 0.5 mm lead pitch, RoHS-compliant Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word decoding; no internal latching |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel interface; high-impedance state asserted when CE HIGH, OE HIGH, or WE LOW |
| CE | Chip Enable | Active-LOW enable controlling device selection and automatic power-down entry/exit |
| OE | Output Enable | Active-LOW control for output buffer gating; does not affect power state |
| WE | Write Enable | Active-LOW control for write operations; combined with CE defines write cycle boundaries |
| VCC | Power Supply | Supports dual voltage rails: 2.2–3.6 V or 4.5–5.5 V; decoupling required per datasheet layout guidelines |
| VSS | Ground | Digital ground reference; must be connected to system common ground plane |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces standby current to ≤8.7 µA, extending battery life in handheld test equipment and remote sensors |
| Automatic CE-Controlled Power-Down | Enters low-power mode within 45 ns of CE HIGH assertion, eliminating need for external power management logic |
| Dual-Voltage Operation | Eliminates level shifters in systems with both 3.3 V and 5 V subsystems, simplifying PCB routing and BOM |
| High-Impedance Output Control | Ensures clean bus sharing across multiple SRAMs or peripherals without contention during deselect or write cycles |
| Industrial Temperature Range | Validated operation from –40 °C to +85 °C supports deployment in factory automation and outdoor metering |
Applications
| Portable Medical Monitors | Industrial PLC I/O Modules |
|---|---|
|
Use Scenario: Real-time waveform buffering in battery-powered ECG and pulse oximetry devices. IC Role / Device Role / Timing Role: Byte-wide static RAM storing sampled analog data prior to wireless transmission or local analysis. Use Value: 45 ns access enables sub-millisecond sampling intervals; 3.5 µA standby current extends single-charge operation beyond 3 years. |
Use Scenario: Local data staging for digital input/output status and configuration registers in modular PLC backplanes. IC Role / Device Role / Timing Role: Non-refreshing memory for deterministic scan-cycle storage between CPU reads/writes. Use Value: Dual-voltage support allows direct interfacing with both 3.3 V logic and legacy 5 V fieldbus interfaces without translation. |
| Smart Utility Meters | Automotive Diagnostic Tools |
|
Use Scenario: Tamper-resilient event logging and tariff history storage in AMI meters with intermittent RF wake-up. IC Role / Device Role / Timing Role: Retentive memory holding critical billing and fault records during mains dropout. Use Value: Data retention at 1.0 V VCC ensures integrity through brown-outs; ISB2 ≤ 8.7 µA minimizes self-discharge of backup capacitors. |
Use Scenario: Protocol translation buffer between OBD-II CAN bus and USB/Bluetooth host in handheld diagnostic scanners. IC Role / Device Role / Timing Role: Temporary storage for CAN frame assembly/disassembly and command queueing. Use Value: High-impedance tri-state outputs prevent bus contention during protocol handshaking; 45 ns timing aligns with microcontroller burst reads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV5128BLL-45NLI | Same density and speed (45 ns), but only supports 2.7–3.6 V; no 4.5–5.5 V mode | Not suitable for mixed-voltage 5 V legacy systems; requires level-shifting if interfacing with 5 V microcontrollers | Select when design operates exclusively in 3.3 V domain and cost sensitivity outweighs voltage flexibility |
| ON Semiconductor NVSRAM NVMFS0418M08T1G | Nonvolatile SRAM with integrated EEPROM backup; higher standby current (25 µA typical) | Provides automatic data retention on power loss without external capacitor or battery; adds write endurance limits | Select when data persistence across uncontrolled power cycles is mandatory, accepting higher quiescent draw and cost premium |
Compared with IS62WV5128BLL-45NLI and NVMFS0418M08T1G, CY62148GN30-45ZSXI uniquely balances dual-voltage operation, ultra-low standby power, and pure SRAM determinism-making it optimal for battery-critical, mixed-rail industrial edge nodes where nonvolatility is unnecessary.
Availability
CY62148GN30-45ZSXI is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC I/O modules, and smart utility meters requiring stable component supply, long-lifecycle support, and guaranteed industrial temperature performance.
Supply support for CY62148GN30-45ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions acquired from Cypress Semiconductor.
CY62148GN30-45ZSXI belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power, high-reliability embedded systems where deterministic timing and extended battery runtime are primary design constraints.
FAQ
Does CY62148GN30-45ZSXI require an external clock or refresh circuitry?
No. This is a fully static RAM: all timing is asynchronous and governed solely by CE, OE, and WE control signals. No clock input or periodic refresh is needed-data remains valid indefinitely as long as VCC is maintained above VDR (1.0 V) and CE is held HIGH in standby. The 45 ns access time applies to both read and write cycles without internal timing dependencies.
Can CY62148GN30-45ZSXI operate reliably at 3.3 V and 5.0 V within the same system?
Yes-this device is explicitly characterized for two disjoint VCC ranges: 2.2–3.6 V and 4.5–5.5 V. It cannot operate continuously across the 3.6–4.5 V gap, but supports seamless migration between 3.3 V and 5.0 V domains via board-level voltage selection. Each range has independent AC/DC specs validated per datasheet tables.
What happens to data during a brown-out condition where VCC drops below 2.2 V but stays above 1.0 V?
When VCC falls between 1.0 V (VDR) and 2.2 V, the device enters data retention mode: CE must remain HIGH, all inputs held at valid logic levels, and ICCDR remains ≤13 µA. Data is preserved without corruption, and full functionality resumes within 45 ns after VCC rises above VCC(min) and stabilizes-no reset or reinitialization required.
Is the TSOP II package of CY62148GN30-45ZSXI compatible with standard SOIC socket footprints?
No. The 32-pin TSOP II (10.16 mm × 13.10 mm, 0.5 mm pitch) and 32-pin SOIC (11.9 mm × 19.8 mm, 1.27 mm pitch) are mechanically and solder-profile incompatible. Pinout is identical between packages, but PCB land patterns, stencil apertures, and reflow profiles differ significantly-separate layouts are required for each variant.
CY62148GN30-45ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP II
CY62148GN30-45ZSXI FAQ
1.How can I place an order for CY62148GN30-45ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62148GN30-45ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62148GN30-45ZSXI reliable?
The price and inventory of CY62148GN30-45ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62148GN30-45ZSXI is usually 5 days.
3.What payment methods are accepted for CY62148GN30-45ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62148GN30-45ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62148GN30-45ZSXI?
CY62148GN30-45ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62148GN30-45ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62148GN30-45ZSXI?
For technical support, including CY62148GN30-45ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62148GN30-45ZSXI requirements.
6.How does Aetrix verify that CY62148GN30-45ZSXI is sourced from the original manufacturer or authorized distributors?
All CY62148GN30-45ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62148GN30-45ZSXI meets industry standards.
7.What is the process for return or replacement of CY62148GN30-45ZSXI?
All CY62148GN30-45ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62148GN30-45ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62148GN30-45ZSXI part is unused and in its original packaging.
Return procedure for CY62148GN30-45ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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