Infineon Technologies CY62157DV30L-55ZSXET

Overview

CY62157DV30L-55ZSXET from Cypress Semiconductor is a 8-Mbit (512K × 16) MoBL® CMOS static RAM with 55 ns access time, 2.2–3.6 V supply range, and industrial temperature rating (–40°C to +85°C). It features ultra-low active current (1.5 mA @ 1 MHz), automatic CE-based power-down, and byte-wide I/O control via BHE/ BLE for embedded memory expansion in portable and battery-sensitive systems.

For engineers reviewing the CY62157DV30L-55ZSXET datasheet, CY62157DV30L-55ZSXET pinout, CY62157DV30L-55ZSXET application, or CY62157DV30L-55ZSXET equivalent, this device supports low-power SRAM replacement in handheld instrumentation, industrial controllers, and real-time data buffering where deterministic timing and standby current <20 µA are critical.

Technical Context

This SRAM implements dual chip enable (CE1/CE2) logic with independent byte enable (BHE/BLE) for 16-bit data partitioning, enabling selective write to high or low bytes without affecting adjacent locations. Its automatic power-down activates when CE1 is HIGH or CE2 is LOW - eliminating external power management circuitry.

The device uses CMOS core design with tri-state outputs controlled by OE, CE, and byte enables, supporting high-impedance states during deselect, write, or output disable. All timing parameters (tRC = 55 ns, tAA = 55 ns, tDOE = 25 ns) are guaranteed over full voltage (2.2–3.6 V) and temperature (–40°C to +85°C) ranges.

Key Specifications

Pinout & Package

Package: 48-ball Fine-Pitch Ball Grid Array (FBGA), RoHS-compliant, 6 mm × 8 mm footprint, 0.8 mm ball pitch, JEDEC MO-276AB compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with IS62WV51216BLL-55NLI and N25S80-55GFT, the CY62157DV30L-55ZSXET uniquely delivers 2.2 V operation, sub-µA-level standby via hardware CE control, and true byte-selectable writes - making it optimal for battery-constrained, voltage-flexible embedded buffers.

Availability

CY62157DV30L-55ZSXET is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC data buffers, and handheld test equipment requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant FBGA packaging.

Supply support for CY62157DV30L-55ZSXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and consumer applications, with emphasis on low-power innovation and mixed-signal integration.

The CY62157DV30 series belongs to Cypress's MoBL® (More Battery Life™) SRAM product line, engineered specifically for energy-constrained portable and embedded systems requiring deterministic timing and ultra-low quiescent current.

FAQ

What is the minimum VCC required to retain data in CY62157DV30L-55ZSXET?

Data retention is guaranteed down to VCC = 1.5 V, with ICCDR ≤ 10 µA typical at that voltage. The device enters data retention mode automatically when CE1 is HIGH or CE2 is LOW, and maintains stored bits without refresh as long as VCC remains ≥1.5 V and ambient temperature stays within specification limits.

Can CY62157DV30L-55ZSXET operate reliably at 2.2 V with 55 ns timing?

Yes - all AC specifications including tRC = 55 ns, tAA = 55 ns, and tDOE = 25 ns are fully guaranteed across the entire 2.2–3.6 V range and –40°C to +85°C temperature span. No derating is required at minimum VCC.

How does the dual CE architecture improve system power management?

CE1 and CE2 allow hierarchical memory mapping: CE1 can serve as global enable while CE2 acts as zone select. When either CE1 goes HIGH or CE2 goes LOW, the device enters automatic power-down with ISB2 ≤ 20 µA - eliminating software-controlled sleep modes and reducing firmware complexity.

Is the 48-ball FBGA package compatible with standard reflow profiles?

Yes - the CY62157DV30L-55ZSXET in 48-ball FBGA conforms to IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles with peak temperature ≤260°C. Board layout must follow Cypress's recommended pad stack and stencil design guidelines for void-free solder joints.