Infineon Technologies CY62157ELL-55ZSXE
- Part No.:
- CY62157ELL-55ZSXE
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62157ELL-55ZSXE.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:115
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62157ELL-55ZSXE from Cypress Semiconductor is an 8-Mbit (512 K × 16) CMOS static RAM with 45 ns access time, 4.5–5.5 V supply range, and ultra-low standby current (2 µA typical). It supports byte-level write control via BHE/ BLE, automatic power-down on deselect, and operates across –40 °C to +85 °C for industrial applications. Used in portable instrumentation and battery-powered microcontroller systems requiring non-volatile data buffering.
For engineers reviewing the CY62157ELL-55ZSXE datasheet, CY62157ELL-55ZSXE pinout, CY62157ELL-55ZSXE application, or CY62157ELL-55ZSXE equivalent, key selection criteria include TSOP II package compatibility, TTL-level I/O interface requirements, CE1/CE2 dual-chip-enable logic, and sub-8 µA industrial standby current compliance.
Technical Context
The CY62157ELL-55ZSXE implements a 512K × 16 asynchronous SRAM architecture with independent high- and low-byte enables (BHE/ BLE), dual chip enables (CE1 active-low, CE2 active-low), and OE-controlled read output gating. Its automatic power-down activates when CE1 is HIGH, CE2 is LOW, or both BHE and BLE are HIGH - placing I/Os in high-impedance state without external control logic.
It features TTL-compatible input thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V) and requires CMOS-level tie-offs on CE/BE pins to guarantee ISB2 ≤ 8 µA. The device does not support CMOS input voltage thresholds and is incompatible with processors requiring VIH > 3.5 V without level-shifting per AN6081.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512 K × 16 bits - provides 1 MB of fast, random-access storage with byte-selectable writes. |
| Access Time | 45 ns - ensures compatibility with 16-bit microcontrollers running at ≤22 MHz bus frequency. |
| Supply Voltage | 4.5 V to 5.5 V - supports legacy 5 V systems and tolerates ±10% rail variation without regulation. |
| Standby Current | 2 µA typical / 8 µA max (industrial) - enables multi-year battery life in always-on sensor nodes. |
| Operating Current | 1.8 mA typical at 1 MHz - reduces thermal load in dense PCB layouts with multiple SRAMs. |
| Temperature Range | –40 °C to +85 °C - qualified for industrial automation, test equipment, and medical diagnostics hardware. |
| Data Retention Voltage | 2.0 V minimum - allows graceful shutdown and memory hold during brown-out conditions. |
Pinout & Package
Package: 44-pin TSOP II (Thin Small Outline Package, Type II), body size 10.16 mm × 18.42 mm, 0.8 mm lead pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1, CE2 | Dual Chip Enable inputs | Active-low CE1 and active-low CE2 enable memory access only when CE1 = LOW AND CE2 = HIGH - prevents accidental writes during reset or power sequencing. |
| OE | Output Enable | Controls tri-state output drivers; outputs go high-Z when OE = HIGH, enabling bus sharing without external transceivers. |
| WE | Write Enable | Active-low signal initiating write cycle; combined with CE1/CE2 and BHE/ BLE determines byte-write granularity. |
| BHE, BLE | Byte High/Low Enable | Independent 8-bit write masking: BLE = LOW writes I/O0–I/O7; BHE = LOW writes I/O8–I/O15 - eliminates need for external byte demux. |
| I/O0–I/O15 | Bi-directional Data Bus | 16-bit multiplexed data path; placed in high-Z during deselect, OE HIGH, or active write - simplifies PCB routing and reduces contention risk. |
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; no internal address latching - requires stable address before CE/OE assertion. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low standby power | 2 µA typical ISB2 enables >5-year operation on coin-cell batteries in data-logger applications. |
| Automatic power-down mode | Hardware-triggered entry into low-power state upon CE/BHE/ BLE deassertion - no firmware overhead or clock gating required. |
| TTL-compatible I/O interface | VIH ≥ 2.2 V and VIL ≤ 0.8 V allow direct connection to legacy 5 V microcontrollers (e.g., 8051, PIC18F) without level shifters. |
| Byte-selectable write capability | Independent BHE/ BLE control permits partial-word updates - critical for real-time control registers and ring-buffer management. |
| High-speed 45 ns access | Meets timing closure for 16-bit bus interfaces operating up to 22 MHz without wait states. |
Applications
| Portable Data Logger | Industrial PLC I/O Buffer |
|---|---|
|
Use Scenario: Battery-powered environmental sensor node recording temperature, humidity, and pressure at 10 Hz for 30 days. IC Role / Device Role: Primary data buffer storing timestamped samples before periodic RF upload. Use Value: 2 µA standby current extends CR2032 battery life beyond 3 years; 45 ns access enables rapid burst reads during transmission. |
Use Scenario: Modular programmable logic controller with hot-swappable I/O modules requiring local register mirroring. IC Role / Device Role: Dual-port accessible SRAM holding mirrored status and configuration registers for each I/O channel. Use Value: Byte-enable writes allow atomic updates to individual module registers without disturbing adjacent channels' data. |
| Medical Diagnostic Handheld | Automotive ECU Calibration Storage |
|
Use Scenario: Portable ultrasound probe with embedded FPGA processing raw echo data before display rendering. IC Role / Device Role: Frame buffer SRAM interfacing directly with FPGA's 16-bit Avalon-MM bus. Use Value: TTL-level compatibility eliminates level-shifter components; 44-pin TSOP II footprint fits constrained handheld PCB area. |
Use Scenario: Engine control unit storing adaptive fuel trim tables updated during closed-loop operation. IC Role / Device Role: Non-volatile shadow RAM holding calibration parameters during ECU reset or flash reprogramming. Use Value: Data retention down to 2.0 V ensures parameter integrity during cranking-induced brownouts (≥4.2 V nominal). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-Mbit asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV51216AL-10TLI | 10 ns faster (35 ns), but higher ISB = 30 µA typical; 3.3 V only; LVTTL I/O. | Requires 3.3 V rail and level-shifting for 5 V MCU interfaces; unsuitable for battery-critical designs. | Select only if system uses 3.3 V logic and demands <35 ns access - not drop-in compatible due to voltage and interface mismatch. |
| AS6C8016-55TIN | Same 45 ns speed and 5 V supply, but no dual CE (single CE only); ISB = 5 µA typical. | Lacks CE1/CE2 arbitration - cannot support memory-mapped peripheral partitioning or hierarchical decode schemes. | Choose when board layout lacks space for 44-pin TSOP II or when simplified chip-select logic suffices. |
Compared with IS61LV51216AL-10TLI and AS6C8016-55TIN, the CY62157ELL-55ZSXE uniquely balances ultra-low industrial standby power (2 µA), dual CE flexibility for complex address decoding, and native 5 V TTL compatibility - making it optimal for legacy 5 V embedded systems where power and interface fidelity are co-constrained.
Availability
CY62157ELL-55ZSXE is available at Aetrix Electronics and suitable for portable instrumentation, industrial PLC I/O modules, and medical diagnostic handhelds requiring stable component supply across extended product lifecycles.
Supply support for CY62157ELL-55ZSXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and IoT applications, with focus on low-power innovation and long-term supply assurance.
The CY62157E MoBL® (More Battery Life) SRAM product line targets portable and energy-constrained systems requiring fast, reliable, and ultra-low-quiescent static RAM - optimized for battery longevity without sacrificing performance.
FAQ
Is CY62157ELL-55ZSXE compatible with 3.3 V microcontrollers?
No. The CY62157ELL-55ZSXE is specified for 4.5–5.5 V operation and features TTL-compatible input thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V), not 3.3 V CMOS levels. Interfacing with 3.3 V controllers requires level-shifting circuitry per AN6081 guidance, and VCC must remain within 4.5–5.5 V regardless of I/O voltage.
What happens to I/O pins during power-down mode?
When deselected (CE1 HIGH or CE2 LOW or both BHE and BLE HIGH), all I/O0–I/O15 pins enter high-impedance state automatically - no external pull-ups or bus-hold circuits needed. This behavior is hardware-enforced and occurs independently of OE or WE state.
Can CY62157ELL-55ZSXE replace a 512K × 8 SRAM?
Not directly. It is a 512K × 16 device requiring a 16-bit data bus. To interface with an 8-bit system, external logic would be needed to split I/O0–I/O7 and I/O8–I/O15 across two cycles or use only half the bus - resulting in reduced bandwidth and added complexity versus native 8-bit SRAMs.
Does this SRAM support battery backup or non-volatile operation?
No. The CY62157ELL-55ZSXE is volatile static RAM. It retains data only while powered above 2.0 V (VDR). For true non-volatility, external battery-backed power supply or NVSRAM companion IC is required - the device itself has no integrated EEPROM or flash.
CY62157ELL-55ZSXE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62157ELL-55ZSXE FAQ
1.How can I place an order for CY62157ELL-55ZSXE through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157ELL-55ZSXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157ELL-55ZSXE reliable?
The price and inventory of CY62157ELL-55ZSXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157ELL-55ZSXE is usually 5 days.
3.What payment methods are accepted for CY62157ELL-55ZSXE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157ELL-55ZSXE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157ELL-55ZSXE?
CY62157ELL-55ZSXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157ELL-55ZSXE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157ELL-55ZSXE?
For technical support, including CY62157ELL-55ZSXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157ELL-55ZSXE requirements.
6.How does Aetrix verify that CY62157ELL-55ZSXE is sourced from the original manufacturer or authorized distributors?
All CY62157ELL-55ZSXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157ELL-55ZSXE meets industry standards.
7.What is the process for return or replacement of CY62157ELL-55ZSXE?
All CY62157ELL-55ZSXE units undergo pre-shipment inspection (PSI). If there is an issue with CY62157ELL-55ZSXE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157ELL-55ZSXE part is unused and in its original packaging.
Return procedure for CY62157ELL-55ZSXE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62157ELL-55ZSXE Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

