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Infineon Technologies CY62157ELL-55ZSXET

Part No.:
CY62157ELL-55ZSXET
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62157ELL-55ZSXET.pdf
Description:
IC SRAM 8MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,334

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Product details

Overview

CY62157ELL-55ZSXET from Cypress Semiconductor is an 8-Mbit (512 K × 16) CMOS static RAM with 45 ns access time, 4.5–5.5 V supply range, and ultra-low standby current (2 µA typical). It features dual chip enables (CE1/CE2), byte-wide control (BHE/BLE), and automatic power-down on deselect - designed for battery-sensitive portable systems requiring reliable non-volatile data retention during sleep.

For engineers reviewing the CY62157ELL-55ZSXET datasheet, CY62157ELL-55ZSXET pinout, CY62157ELL-55ZSXET application, or CY62157ELL-55ZSXET equivalent, key selection criteria include TTL-compatible I/O levels, TSOP II package compatibility, industrial temperature rating (–40 °C to +85 °C), and MoBL® low-power architecture for extended runtime in handheld instrumentation and embedded controllers.

Technical Context

The CY62157ELL-55ZSXET implements a 512K × 16 asynchronous SRAM array with independent high- and low-byte enables (BHE/ BLE), enabling selective 8-bit writes without read-modify-write cycles. Its dual CE architecture (CE1 active-low, CE2 active-high) supports hierarchical memory mapping and seamless expansion across multiple devices.

It uses CMOS logic with TTL-level input thresholds (VIH = 2.2 V min, VIL = 0.8 V max), ensuring direct interfacing with legacy 5 V microcontrollers. Power management relies on automatic CE-triggered standby mode, reducing ICC to ≤8 µA when CE1 is HIGH or CE2 is LOW - verified under full industrial temperature and voltage range (4.5–5.5 V).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512 K × 16 bits - provides 1 MB of byte-addressable storage with 19 address lines (A0–A18)
Access Time 45 ns - guarantees deterministic read latency for real-time control loops running at ≤22 MHz bus frequency
Supply Voltage 4.5 V to 5.5 V - compatible with standard 5 V logic rails and tolerant of ±10% regulation variation
Standby Current 2 µA typical / 8 µA max (industrial) - enables multi-year battery life in always-on sensor nodes
Operating Current 1.8 mA typical at 1 MHz - scales linearly with activity, supporting dynamic power budgeting
Temperature Range –40 °C to +85 °C - qualified for industrial-grade operation without derating
I/O Interface TTL-compatible inputs - eliminates need for level shifters when interfacing with 8051, Z80, or legacy MCU families

Pinout & Package

Package: 44-pin TSOP II (Thin Small Outline Package, Type II), JEDEC MO-143AC compliant, body size 10.16 mm × 18.42 mm × 1.2 mm.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit address bus supporting full 512K-word addressing; no internal latching - requires stable address during CE/OE assertion
I/O0–I/O7 Data Bus (Low Byte) Bi-directional 8-bit data path enabled only when BLE = LOW and device is selected (CE1 = LOW, CE2 = HIGH)
I/O8–I/O15 Data Bus (High Byte) Bi-directional 8-bit data path enabled only when BHE = LOW and device is selected (CE1 = LOW, CE2 = HIGH)
CE1, CE2 Chip Enable (Dual) CE1 active-low + CE2 active-high enable logic - allows hierarchical decoding; device enters standby if CE1 = HIGH or CE2 = LOW
OE Output Enable Active-low control for output drivers; places I/O pins in high-Z when HIGH, even during valid CE state
WE Write Enable Active-low signal initiating write cycle; concurrent with valid CE and byte enables determines data direction and target byte lane
BHE, BLE Byte High/Low Enable Independent 8-bit write masking - enables partial writes without external glue logic or bus contention
VCC, VSS Power Supply Single 5 V supply; two VCC and two VSS pins reduce IR drop and improve noise immunity in high-speed operation

Key Features

Feature Design Value
MoBL® Ultra-Low Standby Power 2 µA typical ISB - extends battery life in portable medical monitors and handheld test equipment
Dual Chip Enable Architecture CE1 (active-low) + CE2 (active-high) - simplifies address decoding for multi-SRAM systems without external inverters
Independent Byte Enables BHE/ BLE allow simultaneous or separate 8-bit writes - eliminates read-modify-write overhead in firmware-driven buffer management
TTL-Compatible Input Thresholds VIH ≥ 2.2 V, VIL ≤ 0.8 V - ensures interoperability with legacy 5 V microcontrollers without level translation
Automatic Power-Down on Deselect Enters standby within tPD = 45 ns when CE1 goes HIGH or CE2 goes LOW - eliminates software-controlled sleep sequencing

Applications

Portable Data Loggers Industrial PLC I/O Modules

Use Scenario: Battery-powered environmental sensor node recording temperature, humidity, and pressure at 10 Hz for 30 days.

IC Role / Device Role / Timing Role: Primary working memory for firmware-managed circular buffer; retains data during deep-sleep intervals between samples.

Use Value: 2 µA standby current enables >2-year battery life on CR2032; 45 ns access supports real-time timestamping without CPU stalling.

Use Scenario: Modular I/O expansion card in DIN-rail mounted PLC handling analog input scanning and digital output latching.

IC Role / Device Role / Timing Role: Local scratchpad RAM for scan-cycle data aggregation before CAN bus transmission.

Use Value: Dual CE and byte enables allow seamless integration into existing 16-bit ISA-style backplane; TTL compatibility avoids redesign of legacy controller interface.

Medical Handheld Diagnostics Automotive Body Control Units

Use Scenario: Portable ECG analyzer storing waveform segments prior to Bluetooth upload to tablet.

IC Role / Device Role / Timing Role: Frame buffer for digitized analog front-end output; accessed via DMA from ARM Cortex-M4 core.

Use Value: 512 K × 16 organization provides 128 KB contiguous storage for 10-second waveform capture; 45 ns timing meets 20 MSPS sampling pipeline requirements.

Use Scenario: Door module storing window position calibration, mirror angle presets, and fault logs across ignition cycles.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM backed by supercapacitor; retains settings during 12 V brownout events.

Use Value: Data retention down to 2 V VCC enables safe save-on-power-loss; industrial temp rating ensures reliability in under-hood thermal environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-Mbit SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV51216BLL-45NLI 45 ns access, same 512K × 16 organization, but CMOS input thresholds (VIH = 0.7×VCC) and higher ISB (15 µA typical) Requires level-shifting for TTL-based hosts; less suitable for battery-critical designs Select if interfacing with modern 5 V ASICs or FPGAs with CMOS I/O, not legacy MCUs
ON Semiconductor NVSRAM NVTFS51216L-45G Integrated EEPROM backup, same speed/package, but higher ICC (3.5 mA active) and 100k write-cycle endurance limit Eliminates external backup power circuitry but trades off active power and longevity for non-volatility Select only when true data persistence across unlimited power cycles is mandatory - not for general-purpose SRAM replacement

Compared with IS62WV51216BLL-45NLI and NVTFS51216L-45G, the CY62157ELL-55ZSXET delivers superior standby efficiency and native TTL compatibility - critical for extending runtime in portable instrumentation and maintaining drop-in replaceability in legacy industrial control hardware.

Availability

CY62157ELL-55ZSXET is available at Aetrix Electronics and suitable for portable medical devices, industrial PLC modules, and automotive body electronics requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for CY62157ELL-55ZSXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip solutions, memory, and USB connectivity ICs for industrial, automotive, and consumer markets.

The CY62157E MoBL® SRAM product line was engineered specifically for ultra-low-power portable electronics - emphasizing sub-µA standby, fast wake-up, and TTL-level interoperability without external support components.

FAQ

Is CY62157ELL-55ZSXET pin-compatible with CY62157EV-45ZSXI?

No. CY62157ELL-55ZSXET uses a 44-pin TSOP II package with dual CE (CE1/CE2), while CY62157EV-45ZSXI is a 48-ball VFBGA variant with different pin mapping and thermal characteristics. The TSOP II version has dedicated NC pins (A18, A16) and distinct power/ground pin layout - mechanical and routing changes are required for substitution.

Does this SRAM support true 16-bit parallel access without byte masking?

Yes. When both BHE and BLE are asserted LOW simultaneously, all 16 I/O lines (I/O0–I/O15) become active for full-word reads/writes. The device does not require external logic to enable 16-bit mode - it is natively supported per the truth table on page 12 of the datasheet.

Can CY62157ELL-55ZSXET operate reliably at 4.5 V with 45 ns timing?

Yes. The 45 ns access time is fully specified and tested over the entire industrial voltage range (4.5–5.5 V) and temperature range (–40 °C to +85 °C). Electrical Characteristics Table on page 4 confirms tAA ≤ 45 ns and tRC ≤ 45 ns at VCC = 4.5 V, TA = 85 °C.

What happens to data during VCC brownout below 2 V?

Data retention is guaranteed down to VCC = 2 V, with ICCDR ≤ 8 µA (industrial). Below 2 V, the device exits data retention mode and contents become undefined. External circuitry (e.g., supercapacitor or backup battery) must hold VCC ≥ 2 V for minimum tCDR (0 ns) to preserve memory state during power loss.

CY62157ELL-55ZSXET Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62157ELL-55ZSXET FAQ

1.How can I place an order for CY62157ELL-55ZSXET through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62157ELL-55ZSXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62157ELL-55ZSXET reliable?

The price and inventory of CY62157ELL-55ZSXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157ELL-55ZSXET is usually 5 days.

3.What payment methods are accepted for CY62157ELL-55ZSXET?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157ELL-55ZSXET transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62157ELL-55ZSXET?

CY62157ELL-55ZSXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62157ELL-55ZSXET order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62157ELL-55ZSXET?

For technical support, including CY62157ELL-55ZSXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157ELL-55ZSXET requirements.

6.How does Aetrix verify that CY62157ELL-55ZSXET is sourced from the original manufacturer or authorized distributors?

All CY62157ELL-55ZSXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157ELL-55ZSXET meets industry standards.

7.What is the process for return or replacement of CY62157ELL-55ZSXET?

All CY62157ELL-55ZSXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62157ELL-55ZSXET, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62157ELL-55ZSXET part is unused and in its original packaging.

Return procedure for CY62157ELL-55ZSXET:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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