Infineon Technologies CY62157ELL-55ZSXET
- Part No.:
- CY62157ELL-55ZSXET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62157ELL-55ZSXET.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:4,334
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Product details
Overview
CY62157ELL-55ZSXET from Cypress Semiconductor is an 8-Mbit (512 K × 16) CMOS static RAM with 45 ns access time, 4.5–5.5 V supply range, and ultra-low standby current (2 µA typical). It features dual chip enables (CE1/CE2), byte-wide control (BHE/BLE), and automatic power-down on deselect - designed for battery-sensitive portable systems requiring reliable non-volatile data retention during sleep.
For engineers reviewing the CY62157ELL-55ZSXET datasheet, CY62157ELL-55ZSXET pinout, CY62157ELL-55ZSXET application, or CY62157ELL-55ZSXET equivalent, key selection criteria include TTL-compatible I/O levels, TSOP II package compatibility, industrial temperature rating (–40 °C to +85 °C), and MoBL® low-power architecture for extended runtime in handheld instrumentation and embedded controllers.
Technical Context
The CY62157ELL-55ZSXET implements a 512K × 16 asynchronous SRAM array with independent high- and low-byte enables (BHE/ BLE), enabling selective 8-bit writes without read-modify-write cycles. Its dual CE architecture (CE1 active-low, CE2 active-high) supports hierarchical memory mapping and seamless expansion across multiple devices.
It uses CMOS logic with TTL-level input thresholds (VIH = 2.2 V min, VIL = 0.8 V max), ensuring direct interfacing with legacy 5 V microcontrollers. Power management relies on automatic CE-triggered standby mode, reducing ICC to ≤8 µA when CE1 is HIGH or CE2 is LOW - verified under full industrial temperature and voltage range (4.5–5.5 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512 K × 16 bits - provides 1 MB of byte-addressable storage with 19 address lines (A0–A18) |
| Access Time | 45 ns - guarantees deterministic read latency for real-time control loops running at ≤22 MHz bus frequency |
| Supply Voltage | 4.5 V to 5.5 V - compatible with standard 5 V logic rails and tolerant of ±10% regulation variation |
| Standby Current | 2 µA typical / 8 µA max (industrial) - enables multi-year battery life in always-on sensor nodes |
| Operating Current | 1.8 mA typical at 1 MHz - scales linearly with activity, supporting dynamic power budgeting |
| Temperature Range | –40 °C to +85 °C - qualified for industrial-grade operation without derating |
| I/O Interface | TTL-compatible inputs - eliminates need for level shifters when interfacing with 8051, Z80, or legacy MCU families |
Pinout & Package
Package: 44-pin TSOP II (Thin Small Outline Package, Type II), JEDEC MO-143AC compliant, body size 10.16 mm × 18.42 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; no internal latching - requires stable address during CE/OE assertion |
| I/O0–I/O7 | Data Bus (Low Byte) | Bi-directional 8-bit data path enabled only when BLE = LOW and device is selected (CE1 = LOW, CE2 = HIGH) |
| I/O8–I/O15 | Data Bus (High Byte) | Bi-directional 8-bit data path enabled only when BHE = LOW and device is selected (CE1 = LOW, CE2 = HIGH) |
| CE1, CE2 | Chip Enable (Dual) | CE1 active-low + CE2 active-high enable logic - allows hierarchical decoding; device enters standby if CE1 = HIGH or CE2 = LOW |
| OE | Output Enable | Active-low control for output drivers; places I/O pins in high-Z when HIGH, even during valid CE state |
| WE | Write Enable | Active-low signal initiating write cycle; concurrent with valid CE and byte enables determines data direction and target byte lane |
| BHE, BLE | Byte High/Low Enable | Independent 8-bit write masking - enables partial writes without external glue logic or bus contention |
| VCC, VSS | Power Supply | Single 5 V supply; two VCC and two VSS pins reduce IR drop and improve noise immunity in high-speed operation |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Standby Power | 2 µA typical ISB - extends battery life in portable medical monitors and handheld test equipment |
| Dual Chip Enable Architecture | CE1 (active-low) + CE2 (active-high) - simplifies address decoding for multi-SRAM systems without external inverters |
| Independent Byte Enables | BHE/ BLE allow simultaneous or separate 8-bit writes - eliminates read-modify-write overhead in firmware-driven buffer management |
| TTL-Compatible Input Thresholds | VIH ≥ 2.2 V, VIL ≤ 0.8 V - ensures interoperability with legacy 5 V microcontrollers without level translation |
| Automatic Power-Down on Deselect | Enters standby within tPD = 45 ns when CE1 goes HIGH or CE2 goes LOW - eliminates software-controlled sleep sequencing |
Applications
| Portable Data Loggers | Industrial PLC I/O Modules |
|---|---|
|
Use Scenario: Battery-powered environmental sensor node recording temperature, humidity, and pressure at 10 Hz for 30 days. IC Role / Device Role / Timing Role: Primary working memory for firmware-managed circular buffer; retains data during deep-sleep intervals between samples. Use Value: 2 µA standby current enables >2-year battery life on CR2032; 45 ns access supports real-time timestamping without CPU stalling. |
Use Scenario: Modular I/O expansion card in DIN-rail mounted PLC handling analog input scanning and digital output latching. IC Role / Device Role / Timing Role: Local scratchpad RAM for scan-cycle data aggregation before CAN bus transmission. Use Value: Dual CE and byte enables allow seamless integration into existing 16-bit ISA-style backplane; TTL compatibility avoids redesign of legacy controller interface. |
| Medical Handheld Diagnostics | Automotive Body Control Units |
|
Use Scenario: Portable ECG analyzer storing waveform segments prior to Bluetooth upload to tablet. IC Role / Device Role / Timing Role: Frame buffer for digitized analog front-end output; accessed via DMA from ARM Cortex-M4 core. Use Value: 512 K × 16 organization provides 128 KB contiguous storage for 10-second waveform capture; 45 ns timing meets 20 MSPS sampling pipeline requirements. |
Use Scenario: Door module storing window position calibration, mirror angle presets, and fault logs across ignition cycles. IC Role / Device Role / Timing Role: Non-volatile shadow RAM backed by supercapacitor; retains settings during 12 V brownout events. Use Value: Data retention down to 2 V VCC enables safe save-on-power-loss; industrial temp rating ensures reliability in under-hood thermal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-Mbit SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV51216BLL-45NLI | 45 ns access, same 512K × 16 organization, but CMOS input thresholds (VIH = 0.7×VCC) and higher ISB (15 µA typical) | Requires level-shifting for TTL-based hosts; less suitable for battery-critical designs | Select if interfacing with modern 5 V ASICs or FPGAs with CMOS I/O, not legacy MCUs |
| ON Semiconductor NVSRAM NVTFS51216L-45G | Integrated EEPROM backup, same speed/package, but higher ICC (3.5 mA active) and 100k write-cycle endurance limit | Eliminates external backup power circuitry but trades off active power and longevity for non-volatility | Select only when true data persistence across unlimited power cycles is mandatory - not for general-purpose SRAM replacement |
Compared with IS62WV51216BLL-45NLI and NVTFS51216L-45G, the CY62157ELL-55ZSXET delivers superior standby efficiency and native TTL compatibility - critical for extending runtime in portable instrumentation and maintaining drop-in replaceability in legacy industrial control hardware.
Availability
CY62157ELL-55ZSXET is available at Aetrix Electronics and suitable for portable medical devices, industrial PLC modules, and automotive body electronics requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.
Supply support for CY62157ELL-55ZSXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip solutions, memory, and USB connectivity ICs for industrial, automotive, and consumer markets.
The CY62157E MoBL® SRAM product line was engineered specifically for ultra-low-power portable electronics - emphasizing sub-µA standby, fast wake-up, and TTL-level interoperability without external support components.
FAQ
Is CY62157ELL-55ZSXET pin-compatible with CY62157EV-45ZSXI?
No. CY62157ELL-55ZSXET uses a 44-pin TSOP II package with dual CE (CE1/CE2), while CY62157EV-45ZSXI is a 48-ball VFBGA variant with different pin mapping and thermal characteristics. The TSOP II version has dedicated NC pins (A18, A16) and distinct power/ground pin layout - mechanical and routing changes are required for substitution.
Does this SRAM support true 16-bit parallel access without byte masking?
Yes. When both BHE and BLE are asserted LOW simultaneously, all 16 I/O lines (I/O0–I/O15) become active for full-word reads/writes. The device does not require external logic to enable 16-bit mode - it is natively supported per the truth table on page 12 of the datasheet.
Can CY62157ELL-55ZSXET operate reliably at 4.5 V with 45 ns timing?
Yes. The 45 ns access time is fully specified and tested over the entire industrial voltage range (4.5–5.5 V) and temperature range (–40 °C to +85 °C). Electrical Characteristics Table on page 4 confirms tAA ≤ 45 ns and tRC ≤ 45 ns at VCC = 4.5 V, TA = 85 °C.
What happens to data during VCC brownout below 2 V?
Data retention is guaranteed down to VCC = 2 V, with ICCDR ≤ 8 µA (industrial). Below 2 V, the device exits data retention mode and contents become undefined. External circuitry (e.g., supercapacitor or backup battery) must hold VCC ≥ 2 V for minimum tCDR (0 ns) to preserve memory state during power loss.
CY62157ELL-55ZSXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62157ELL-55ZSXET FAQ
1.How can I place an order for CY62157ELL-55ZSXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157ELL-55ZSXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157ELL-55ZSXET reliable?
The price and inventory of CY62157ELL-55ZSXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157ELL-55ZSXET is usually 5 days.
3.What payment methods are accepted for CY62157ELL-55ZSXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157ELL-55ZSXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157ELL-55ZSXET?
CY62157ELL-55ZSXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157ELL-55ZSXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157ELL-55ZSXET?
For technical support, including CY62157ELL-55ZSXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157ELL-55ZSXET requirements.
6.How does Aetrix verify that CY62157ELL-55ZSXET is sourced from the original manufacturer or authorized distributors?
All CY62157ELL-55ZSXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157ELL-55ZSXET meets industry standards.
7.What is the process for return or replacement of CY62157ELL-55ZSXET?
All CY62157ELL-55ZSXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62157ELL-55ZSXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157ELL-55ZSXET part is unused and in its original packaging.
Return procedure for CY62157ELL-55ZSXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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