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Infineon Technologies CY62157EV18LL-55BVXI

Part No.:
CY62157EV18LL-55BVXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62157EV18LL-55BVXI.pdf
Description:
IC SRAM 8MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,906

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Product details

Overview

CY62157EV18LL-55BVXI from Infineon Technologies (formerly Cypress) is a 512K × 16-bit MoBL® CMOS static RAM with 55 ns access time, 1.65–2.25 V supply range, and ultra-low standby current (2 µA typical). It operates in industrial temperature range (–40 °C to +85 °C) and is packaged in a Pb-free 48-ball VFBGA. Used in battery-powered portable electronics requiring fast, low-power memory retention.

For engineers reviewing the CY62157EV18LL-55BVXI datasheet, CY62157EV18LL-55BVXI pinout, CY62157EV18LL-55BVXI application, or CY62157EV18LL-55BVXI equivalent, key selection criteria include VFBGA package compatibility, byte-enable-controlled 16-bit I/O partitioning, automatic CE-based power-down behavior, and guaranteed 55 ns timing at 1.8 V.

Technical Context

This SRAM implements a synchronous, non-volatile-retentive, high-speed memory array with dual chip enable (CE1/CE2) logic for flexible bank selection and deselection-driven automatic power-down. Its architecture supports independent byte-wide writes via BHE/BLE control signals and high-impedance tri-state outputs during deselect, OE HIGH, or active write cycles.

The device uses CMOS process technology optimized for sub-2 V operation, featuring on-die power management that reduces ICC to 2 µA in standby (ISB2) and limits active current to 6 mA at 1 MHz. Data retention is maintained down to 1.0 V with ICCDR ≤ 9 µA, enabling extended hold mode in brown-out conditions.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization512K × 16-bit (8 Mbit total); enables single-cycle random access without refresh overhead
Access Time55 ns max at VCC = 1.65–2.25 V; ensures deterministic timing for real-time microcontroller interfaces
Supply Voltage Range1.65 V to 2.25 V; compatible with modern low-voltage SoC I/O domains and battery discharge profiles
Standby Current2 µA typical / 8 µA max (ISB2); extends battery life in sleep-mode portable systems
Active Current6 mA typical at f = 1 MHz; balances speed and power for burst-access embedded applications
Data Retention Voltage1.0 V min (VDR); allows memory state preservation during deep-sleep or backup-battery operation
Operating Temperature–40 °C to +85 °C (Industrial grade); validated for automotive infotainment and industrial HMI use

Pinout & Package

Package: 48-ball VFBGA (5 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, Pb-free.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address Inputs19-bit address bus supporting full 512K-word decoding; A18 required for top half of memory map
I/O0–I/O7Data Bus (Low Byte)Bi-directional 8-bit data path enabled when BLE = LOW; isolated during high-byte operations
I/O8–I/O15Data Bus (High Byte)Bi-directional 8-bit data path enabled when BHE = LOW; independent read/write control per byte
CE1, CE2Chip Enable InputsActive-LOW CE1 and active-HIGH CE2 form dual-enable logic; either CE1 HIGH or CE2 LOW forces standby
OEOutput EnableActive-LOW; places I/O pins in high-Z when HIGH, enabling bus sharing in multi-device systems
WEWrite EnableActive-LOW; initiates write cycle only when CE1 LOW, CE2 HIGH, and WE LOW simultaneously
BHE, BLEByte Enable ControlsActive-LOW signals enabling high/low byte writes independently; supports 8-bit or 16-bit host interfaces
VCC, VSSPower SupplySingle 1.65–2.25 V supply with dedicated ground balls; decoupling required per VFBGA layout guidelines

Key Features

FeatureDesign Value
MoBL® Ultra-Low Power ArchitectureReduces system-level energy consumption by limiting ISB2 to 8 µA max and ICC to 7 mA max at fmax
Dual Chip Enable Logic (CE1/CE2)Enables seamless integration into multi-SRAM memory maps with hierarchical enable control and automatic power gating
Independent Byte Write Control (BHE/BLE)Allows partial-word writes without read-modify-write cycles, improving efficiency in 8-bit peripheral interfacing
Automatic Power-Down on DeselectEliminates external power sequencing logic by entering standby when CE1 HIGH or CE2 LOW, reducing BOM count
VFBGA Package with NC Pins48-ball footprint supports high-density PCB layouts; unconnected pins (A16, A18, NC) simplify routing and reduce stub effects

Applications

Smartphone Baseband MemoryIndustrial PLC Data Buffer

Use Scenario: Storing real-time sensor logs and firmware scratchpad in LTE/5G modem subsystems with tight power budgets.

IC Role / Device Role / Timing Role: High-speed, low-leakage SRAM serving as primary working memory for baseband DSP cores.

Use Value: 55 ns access time meets burst-read latency requirements while 2 µA standby current extends battery runtime between transmissions.

Use Scenario: Holding transient I/O status and configuration registers in programmable logic controllers operating in harsh environments.

IC Role / Device Role / Timing Role: Industrial-grade static RAM providing deterministic read/write response under voltage fluctuation and thermal stress.

Use Value: Guaranteed –40 °C to +85 °C operation and 1.0 V data retention support reliable state-hold during brown-out events.

Wearable Health Monitor CacheAutomotive ADAS Pre-Processing Buffer

Use Scenario: Caching biometric sampling data (ECG, SpO₂) prior to Bluetooth LE transmission in compact wearables.

IC Role / Device Role / Timing Role: Low-voltage (1.8 V) SRAM interfaced directly to ARM Cortex-M0+ MCU GPIOs with byte-enable flexibility.

Use Value: VFBGA package minimizes board area; BLE/BHE control allows efficient 8-bit sensor data packing without bus widening.

Use Scenario: Temporarily storing frame metadata and feature vectors from camera radar fusion modules before GPU offload.

IC Role / Device Role / Timing Role: Fast-access buffer synchronizing heterogeneous sensor inputs with deterministic 55 ns latency.

Use Value: Dual CE logic enables dynamic power gating during idle frames, cutting system-level leakage by >90% vs. always-on alternatives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-voltage, high-speed SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY62157DV18LL-55BVXISame 512K×16 organization and 55 ns speed, but rated for 1.7–1.95 V only (narrower VCC range)Limited to 1.8 V nominal systems; not suitable for wide-input-voltage designs or battery-discharge scenarios below 1.7 VSelect when system VCC is tightly regulated at 1.8 V and cost sensitivity outweighs voltage margin needs
AS6C8016-55TIN55 ns speed, 512K×16, but requires 2.7–3.6 V supply and uses TSOP-II package (not VFBGA)Incompatible with sub-2 V platforms; larger footprint increases PCB area and limits portable design scalabilityChoose only for legacy 3.3 V industrial boards where package conversion is acceptable and voltage headroom exists

Compared with CY62157DV18LL-55BVXI and AS6C8016-55TIN, the CY62157EV18LL-55BVXI uniquely supports 1.65–2.25 V operation in VFBGA, enabling direct integration into modern ultra-low-power SoC ecosystems without level-shifting or packaging compromise.

Availability

CY62157EV18LL-55BVXI is available at Aetrix Electronics and suitable for smartphone baseband memory, industrial PLC data buffering, wearable health monitor caching, and automotive ADAS pre-processing requiring stable component supply across extended temperature and voltage ranges.

Supply support for CY62157EV18LL-55BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.

This device belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power, high-speed memory applications in portable and energy-constrained embedded systems.

FAQ

What is the minimum VCC required to retain data in CY62157EV18LL-55BVXI?

The device guarantees data retention down to 1.0 V (VDR), as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤ 9 µA, allowing extended hold mode during brown-out or backup-battery operation without data loss.

How does automatic power-down activate in this SRAM?

Automatic power-down triggers when CE1 is HIGH or CE2 is LOW - no additional control signals needed. The internal circuitry reduces ICC to ISB2 levels (≤ 8 µA) immediately upon deselection, eliminating need for external power-gating logic or software intervention.

Can CY62157EV18LL-55BVXI interface directly with a 1.8 V microcontroller without level shifters?

Yes. Its 1.65–2.25 V VCC range and TTL-compatible input thresholds (VIH ≥ 1.4 V, VIL ≤ 0.4 V) ensure native interoperability with 1.8 V logic families. All I/Os are designed for single-supply operation within this window.

Is the 48-ball VFBGA package lead-free and RoHS compliant?

Yes. The CY62157EV18LL-55BVXI uses a Pb-free VFBGA package fully compliant with RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) reflow profile.

CY62157EV18LL-55BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
1.65V ~ 2.25V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62157EV18LL-55BVXI FAQ

1.How can I place an order for CY62157EV18LL-55BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62157EV18LL-55BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62157EV18LL-55BVXI reliable?

The price and inventory of CY62157EV18LL-55BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157EV18LL-55BVXI is usually 5 days.

3.What payment methods are accepted for CY62157EV18LL-55BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157EV18LL-55BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62157EV18LL-55BVXI?

CY62157EV18LL-55BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62157EV18LL-55BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62157EV18LL-55BVXI?

For technical support, including CY62157EV18LL-55BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157EV18LL-55BVXI requirements.

6.How does Aetrix verify that CY62157EV18LL-55BVXI is sourced from the original manufacturer or authorized distributors?

All CY62157EV18LL-55BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157EV18LL-55BVXI meets industry standards.

7.What is the process for return or replacement of CY62157EV18LL-55BVXI?

All CY62157EV18LL-55BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62157EV18LL-55BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62157EV18LL-55BVXI part is unused and in its original packaging.

Return procedure for CY62157EV18LL-55BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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