Infineon Technologies CY62157EV18LL-55BVXIT
- Part No.:
- CY62157EV18LL-55BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62157EV18LL-55BVXIT.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62157EV18LL-55BVXIT from Infineon Technologies (formerly Cypress) is a 8-Mbit (512K × 16) low-voltage CMOS static RAM with 55 ns access time, 1.65–2.25 V supply range, and ultra-low standby current (max 8 µA). It serves as main or buffer memory in portable battery-powered systems requiring fast random access and minimal power during sleep modes, such as cellular handsets and handheld medical monitors.
For engineers reviewing the CY62157EV18LL-55BVXIT datasheet, CY62157EV18LL-55BVXIT pinout, CY62157EV18LL-55BVXIT application, or CY62157EV18LL-55BVXIT equivalent, key selection criteria include its MoBL®-optimized active/standby current profile, VFBGA-48 package compatibility, byte-level write enable (BHE/ BLE), and automatic CE-driven power-down behavior under static address conditions.
Technical Context
This SRAM implements a synchronous, non-volatile-retentive 512K × 16-bit array with dual chip enables (CE1/CE2) and independent byte write controls (BHE/BLE), enabling flexible memory partitioning and partial-word writes. Its CMOS architecture supports full rail-to-rail input thresholds (VIH ≥ 1.4 V, VIL ≤ 0.4 V at VCC = 1.65–2.25 V) and guarantees 55 ns read/write cycle timing across industrial temperature (–40 °C to +85 °C).
Power management relies on hardware-triggered automatic power-down when CE1 is HIGH or CE2 is LOW - reducing ICC to ≤8 µA without external control logic. Data retention is maintained down to 1.0 V VCC, with ICCDR ≤9 µA, supporting brown-out operation in energy-constrained embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K words × 16 bits); supports 16-bit data bus interface without glue logic |
| Access Time | 55 ns max; ensures sub-18 MHz random read/write throughput for real-time buffering |
| VCC Range | 1.65 V–2.25 V; compatible with single-cell Li-ion or regulated 1.8 V rails |
| Standby Current | Max 8 µA at VCC = 2.25 V; enables multi-year battery life in always-on sensor nodes |
| Active Current | Typ 6 mA at f = 1 MHz; balances speed and efficiency for burst-mode data logging |
| Data Retention VCC | Min 1.0 V; allows memory state hold during deep-sleep or backup-battery switchover |
| Operating Temp | –40 °C to +85 °C (Industrial grade); validated for automotive infotainment and industrial HMI |
Pinout & Package
Package: 48-ball Very Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant, moisture-sensitive level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word decoding; A18 required for top half addressing |
| I/O0–I/O7 | Data I/O (Low Byte) | Bi-directional 8-bit data path enabled by BLE = LOW; high-impedance when deselected or OE HIGH |
| I/O8–I/O15 | Data I/O (High Byte) | Bi-directional 8-bit data path enabled by BHE = LOW; independent of low-byte control |
| CE1, CE2 | Chip Enable Inputs | Active-LOW CE1 AND active-HIGH CE2 required for device selection; either signal HIGH/LOW forces standby |
| OE | Output Enable | Active-LOW; gates output drivers only - does not affect internal array power state |
| WE | Write Enable | Active-LOW; initiates write cycle when CE1/CE2 active; latches data on rising edge of WE |
| BHE, BLE | Byte Enable Inputs | Active-LOW controls high/low byte write masking; enables 8-bit partial writes without read-modify-write |
| VCC, VSS | Power Supply | Dual VCC (1.65–2.25 V) and ground balls distributed for low-noise operation and EMI reduction |
| NC | No Connect | Three unconnected balls (A16, A18, and one VSS-adjacent ball); must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces typical active current to 6 mA at 1 MHz and standby to 2 µA - extending battery runtime in portable devices |
| Automatic CE-Driven Power Down | Hardware-initiated transition to <8 µA standby when CE1 HIGH or CE2 LOW - no firmware overhead required |
| Independent Byte Write Control | BHE/BLE pins allow simultaneous or selective 8-bit writes to upper/lower data bytes - eliminating bus contention in mixed-data-width systems |
| Pb-Free VFBGA-48 Packaging | Enables high-density PCB layouts with 0.5 mm pitch and thermal resistance θJA = 36.92 °C/W - suitable for compact handheld designs |
| Data Retention at 1.0 V | Maintains stored data down to 1.0 V VCC - supports graceful degradation during power failure or battery depletion |
Applications
| Cellular Baseband Processing | Portable Medical Monitoring |
|---|---|
Use Scenario: Real-time buffering of voice codec samples and protocol stack packets in 4G/5G mobile handsets. IC Role / Device Role / Timing Role: High-speed, low-power SRAM acting as L1 instruction/data cache between baseband processor and RF transceiver. Use Value: 55 ns access time meets TDMA frame timing constraints; 8 µA standby extends talk time between charges. | Use Scenario: Continuous acquisition and local storage of ECG waveforms in battery-powered wearable monitors. IC Role / Device Role / Timing Role: Primary data buffer holding raw sensor samples prior to Bluetooth LE transmission or on-device analysis. Use Value: 1.65–2.25 V operation matches coin-cell or energy-harvesting regulators; data retention at 1.0 V prevents loss during battery swap. |
| Industrial HMI Display Controller | Automotive Infotainment Head Unit |
Use Scenario: Frame buffer and command queue storage for touch-responsive LCD panels in factory HMIs. IC Role / Device Role / Timing Role: Dual-port-accessible SRAM interfacing with display controller and ARM Cortex-M host MCU via shared 16-bit bus. Use Value: Byte-enable capability allows efficient glyph rendering updates; industrial temp rating ensures reliability in uncooled enclosures. | Use Scenario: Audio buffer and navigation map tile cache in automotive head units with start-stop engine cycles. IC Role / Device Role / Timing Role: Non-volatile-retentive SRAM storing critical UI state and audio decode buffers during ignition-off periods. Use Value: Data retention at 1.0 V supports seamless resume after 12 V battery dip; VFBGA-48 footprint fits constrained dashboard PCB space. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-voltage, low-power SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV51216BLL-55NLI | Same density, speed, and voltage range; higher max standby current (15 µA) and larger 48-TSOP package | Lacks VFBGA option; less suitable for space-constrained portable designs | Prefer when board layout uses through-hole or legacy TSOP footprints and thermal budget allows higher ISB |
| Renesas R1LV51216ASB-5SI#S0 | Identical 512K × 16 organization and 55 ns speed; supports 2.5 V max VCC and offers 48-VFBGA but no data retention below 1.4 V | Not rated for sub-1.4 V data retention - unsuitable for brown-out recovery use cases | Select when system VCC regulation exceeds 2.25 V or when Renesas ecosystem integration is prioritized |
Compared with IS62WV51216BLL-55NLI and R1LV51216ASB-5SI#S0, CY62157EV18LL-55BVXIT delivers the lowest guaranteed standby current (8 µA), smallest VFBGA footprint, and unique 1.0 V data retention - making it optimal for ultra-low-power portable and automotive applications where battery life and physical size are critical.
Availability
CY62157EV18LL-55BVXIT is available at Aetrix Electronics and suitable for cellular baseband processing, portable medical monitoring, industrial HMI display controllers, and automotive infotainment head units requiring stable component supply across extended product lifecycles.
Supply support for CY62157EV18LL-55BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.
CY62157EV18 belongs to Infineon's MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power, high-speed memory in portable and energy-sensitive embedded systems.
FAQ
What is the minimum VCC required to retain data in CY62157EV18LL-55BVXIT?
The device guarantees data retention down to 1.0 V VCC, as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤9 µA, and no external refresh or backup power is needed - enabling operation during brown-out events or battery voltage sag before shutdown.
How does automatic power-down activate, and does it require software control?
Automatic power-down activates purely in hardware when CE1 is driven HIGH or CE2 is driven LOW - no firmware intervention or clock gating is required. The internal power-down circuit reduces ICC to ≤8 µA within tCDR (chip deselect to data retention time), which is not specified but occurs within nanoseconds per functional description.
Can CY62157EV18LL-55BVXIT operate reliably at 1.65 V VCC with 55 ns timing?
Yes - all AC specifications including 55 ns access time, VIH/VIL thresholds, and ICC/ISB limits are fully characterized and guaranteed over the entire 1.65–2.25 V range. Electrical Characteristics tables explicitly list test conditions at VCC = 1.65 V, confirming full-speed operation at minimum supply.
Are the NC pins on the VFBGA package required to be grounded or left floating?
The three NC pins (A16, A18, and one adjacent to VSS) are not connected internally and must be left electrically floating per datasheet Note 2. Grounding them may cause unintended coupling or violate thermal/mechanical design rules for the VFBGA package; routing or solder mask should isolate these balls.
CY62157EV18LL-55BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 1.65V ~ 2.25V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62157EV18LL-55BVXIT FAQ
1.How can I place an order for CY62157EV18LL-55BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157EV18LL-55BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157EV18LL-55BVXIT reliable?
The price and inventory of CY62157EV18LL-55BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157EV18LL-55BVXIT is usually 5 days.
3.What payment methods are accepted for CY62157EV18LL-55BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157EV18LL-55BVXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157EV18LL-55BVXIT?
CY62157EV18LL-55BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157EV18LL-55BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157EV18LL-55BVXIT?
For technical support, including CY62157EV18LL-55BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157EV18LL-55BVXIT requirements.
6.How does Aetrix verify that CY62157EV18LL-55BVXIT is sourced from the original manufacturer or authorized distributors?
All CY62157EV18LL-55BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157EV18LL-55BVXIT meets industry standards.
7.What is the process for return or replacement of CY62157EV18LL-55BVXIT?
All CY62157EV18LL-55BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62157EV18LL-55BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157EV18LL-55BVXIT part is unused and in its original packaging.
Return procedure for CY62157EV18LL-55BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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