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Infineon Technologies CY62157EV30LL-45BVXAT
- Part No.:
- CY62157EV30LL-45BVXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62157EV30LL-45BVXAT.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,040
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Product details
Overview
CY62157EV30LL-45BVXAT from Infineon Technologies (formerly Cypress) is a 8-Mbit MoBL® CMOS static RAM organized as 512K × 16, operating at 45 ns access time over –40 °C to +85 °C, with supply voltage range 2.2 V–3.6 V and ultra-low standby current (max 8 µA). It supports byte-wide and word-wide configurations via BHE/ BLE controls and is used in battery-sensitive portable electronics requiring fast, low-power volatile memory.
For engineers reviewing the CY62157EV30LL-45BVXAT datasheet, CY62157EV30LL-45BVXAT pinout, CY62157EV30LL-45BVXAT application, or CY62157EV30LL-45BVXAT equivalent, key selection criteria include industrial temperature rating, TSOP I package compatibility, 45 ns timing compliance, dual chip enable (CE1/CE2) logic, and MoBL®-optimized active/standby current specs for portable system design.
Technical Context
The device implements a high-speed, low-power SRAM core with automatic power-down when deselected via CE1 HIGH, CE2 LOW, or both BHE and BLE HIGH - enabling dynamic power gating without external control logic. Its dual-chip-enable architecture allows seamless memory expansion in multi-bank systems while maintaining independent byte-access capability through dedicated BHE and BLE inputs.
It supports two memory configurations: fixed 512K × 16 mode (default), and reconfigurable 1M × 8 mode in 48-pin TSOP I packages by tying BYTE pin LOW - where A19 appears on pin 45 and I/O8–I/O14 are unused. All timing parameters are guaranteed across full VCC (2.2–3.6 V) and temperature (–40 °C to +85 °C) ranges per Industrial/Automotive-A specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization); enables compact 16-bit data bus interfacing without external demultiplexing. |
| Access Time | 45 ns max at VCC = 2.2–3.6 V, TA = –40 °C to +85 °C; meets real-time microcontroller and DSP interface timing budgets. |
| Supply Voltage | 2.2 V to 3.6 V; compatible with single-supply 2.5 V or 3.3 V system rails and mixed-voltage SoC interfaces. |
| Standby Current | Max 8 µA at VCC = 3.6 V, TA = 85 °C; ensures multi-year battery life in always-on portable devices. |
| Active Current | Typ 6 mA at f = 1 MHz, VCC = 3.0 V; balances performance and power for intermittent burst read/write operations. |
| Operating Temperature | –40 °C to +85 °C (Industrial/Automotive-A grade); qualified for under-hood and industrial control environments. |
| Data Retention Voltage | 1.5 V min; allows graceful low-power suspend-to-RAM states during brown-out or sleep modes. |
Pinout & Package
Package: 48-pin Thin Small Outline Package (TSOP I), RoHS-compliant, lead-free. Pin pitch: 0.5 mm. Body size: 12 mm × 20 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting 512K-word addressing; A19 available only in 1M×8 mode (pin 45). |
| I/O0–I/O15 | Bi-directional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 controlled by BHE for true byte-select writes. |
| CE1, CE2 | Chip Enable Inputs | Two-level enable logic: CE1 LOW AND CE2 HIGH activates device; enables hierarchical memory banking. |
| OE | Output Enable | Controls output drivers only; does not affect internal power state - critical for bus sharing with other peripherals. |
| WE | Write Enable | Active-LOW write strobe; combined with CE and BHE/ BLE to define precise write window boundaries. |
| BHE, BLE | Byte High/Low Enable | Independent 8-bit write masking; eliminates need for external byte-lane gating logic in 16-bit systems. |
| VCC, VSS | Power Supply | Dual VCC pins (pins 24, 48) and dual VSS pins (pins 25, 47) reduce IR drop and improve noise immunity. |
| NC | No Connect | Pins 11, 23, 45 (in 512K×16 mode) are unconnected on die - must be left floating or tied to GND per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active current to 6 mA typical at 1 MHz and standby to 2 µA typical - extends battery runtime in handheld medical and IoT edge nodes. |
| Automatic Power-Down on Deselect | Enters sub-8 µA standby automatically when CE1 HIGH, CE2 LOW, or both BHE/ BLE HIGH - no firmware or external logic required. |
| Configurable Memory Width | Supports 512K × 16 (default) or 1M × 8 (via BYTE pin) in same TSOP I package - simplifies BOM consolidation across 8-bit and 16-bit host platforms. |
| CMOS-Compatible Interface | VIH/VIL thresholds scale with VCC (e.g., VIH ≥ 2.2 V at VCC ≥ 2.7 V), ensuring robust noise margin across voltage corners. |
| High-Z Output Control | Outputs enter high-impedance state within 18 ns of OE/CE/BHE/ BLE deactivation - prevents bus contention during multi-device arbitration. |
Applications
| Portable Medical Monitor | Automotive ADAS Camera Module |
|---|---|
Use Scenario: Real-time waveform buffering in handheld ECG units with coin-cell battery power budget. IC Role / Device Role / Timing Role: Volatile frame buffer storing 16-bit sensor samples prior to Bluetooth LE transmission. Use Value: 2 µA typical standby current enables >3-year shelf life; 45 ns access supports 22 kHz sampling with zero DMA latency penalty. | Use Scenario: Pre-processing buffer between image sensor and SoC in rear-view camera systems. IC Role / Device Role / Timing Role: Temporary storage for Bayer-pattern pixel data during ISP pipeline staging. Use Value: Dual CE support allows concurrent access by sensor interface and video processor; –40 °C to +85 °C rating ensures operation in vehicle cabin extremes. |
| Industrial PLC I/O Expansion Card | Wireless Sensor Node Gateway |
Use Scenario: Local status register mirroring and command queueing in DIN-rail mounted controller modules. IC Role / Device Role / Timing Role: Non-blocking shared memory between ARM Cortex-M7 CPU and isolated CAN/FlexRay co-processor. Use Value: Byte-enable (BHE/ BLE) permits atomic 8-bit updates to status flags without disturbing adjacent control registers. | Use Scenario: Edge-data aggregation buffer in LoRaWAN gateway aggregating 10+ sensor endpoints. IC Role / Device Role / Timing Role: Intermediate store-and-forward memory for encrypted payload assembly before RF transmission. Use Value: 1.5 V data retention threshold allows safe suspend during RF transmit bursts, minimizing energy per packet. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV51216BLL-45NLI | 45 ns access, 512K × 16, 2.5–3.6 V supply, but lacks dual CE and automatic power-down circuitry. | Requires external logic for multi-bank enable sequencing and manual power gating. | Select when cost sensitivity outweighs power autonomy needs and board space permits discrete control logic. |
| AS6C4008-45TIN | 45 ns access, 512K × 16, 2.7–3.6 V only, no automotive qualification, higher ISB (25 µA max). | Not rated for industrial temperature; unsuitable for under-hood or factory-floor deployments. | Select only for commercial-grade consumer products with stable ambient conditions and relaxed lifetime requirements. |
Compared with IS62WV51216BLL-45NLI and AS6C4008-45TIN, CY62157EV30LL-45BVXAT uniquely integrates dual CE logic and autonomous power-down - reducing system-level component count and enabling certified industrial/automotive operation without design compromises.
Availability
CY62157EV30LL-45BVXAT is available at Aetrix Electronics and suitable for portable medical monitors, automotive ADAS camera modules, industrial PLC I/O expansion cards, and wireless sensor node gateways requiring stable component supply across extended product lifecycles.
Supply support for CY62157EV30LL-45BVXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with strong industrial and automotive focus.
This part belongs to the MoBL® (More Battery Life™) SRAM product line, designed specifically for ultra-low-power portable and embedded systems where extended battery life and reliable operation across harsh thermal environments are mandatory.
FAQ
What is the function of the BYTE pin on CY62157EV30LL-45BVXAT?
The BYTE pin is present only in the 48-pin TSOP I package and determines memory configuration: tied HIGH for standard 512K × 16 operation; tied LOW to enable 1M × 8 mode, which repurposes pin 45 as A19 and disables I/O8–I/O14. It has no effect in VFBGA or TSOP II packages.
Can CY62157EV30LL-45BVXAT operate reliably at 2.2 V?
Yes - it is fully specified down to 2.2 V across all timing and current parameters (tRC ≤ 45 ns, ISB ≤ 8 µA, ICC ≤ 25 mA), making it suitable for direct connection to Li-ion battery outputs or low-dropout regulators in energy-constrained designs.
How does automatic power-down activate without software intervention?
Power-down triggers autonomously when any of these conditions occur: CE1 HIGH, CE2 LOW, or both BHE and BLE HIGH. No clock, register write, or firmware action is needed - the internal power controller detects input states and gates VCC internally within 45 ns.
Is CY62157EV30LL-45BVXAT pin-compatible with CY62157DV30?
Yes - it is explicitly stated as pin-compatible with CY62157DV30 in the datasheet, sharing identical 48-pin TSOP I footprint, signal mapping, and AC/DC electrical specifications, enabling drop-in replacement in legacy designs with enhanced low-power performance.
CY62157EV30LL-45BVXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62157EV30LL-45BVXAT FAQ
1.How can I place an order for CY62157EV30LL-45BVXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157EV30LL-45BVXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157EV30LL-45BVXAT reliable?
The price and inventory of CY62157EV30LL-45BVXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157EV30LL-45BVXAT is usually 5 days.
3.What payment methods are accepted for CY62157EV30LL-45BVXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157EV30LL-45BVXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157EV30LL-45BVXAT?
CY62157EV30LL-45BVXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157EV30LL-45BVXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157EV30LL-45BVXAT?
For technical support, including CY62157EV30LL-45BVXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157EV30LL-45BVXAT requirements.
6.How does Aetrix verify that CY62157EV30LL-45BVXAT is sourced from the original manufacturer or authorized distributors?
All CY62157EV30LL-45BVXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157EV30LL-45BVXAT meets industry standards.
7.What is the process for return or replacement of CY62157EV30LL-45BVXAT?
All CY62157EV30LL-45BVXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62157EV30LL-45BVXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157EV30LL-45BVXAT part is unused and in its original packaging.
Return procedure for CY62157EV30LL-45BVXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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