My Inquiry
My Account
Infineon Technologies CY62157EV30LL-45ZXIT
- Part No.:
- CY62157EV30LL-45ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62157EV30LL-45ZXIT.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62157EV30LL-45ZXIT from Infineon Technologies (formerly Cypress) is a high-performance 8-Mbit CMOS static RAM organized as 512K × 16, operating at 45 ns access time over –40 °C to +85 °C industrial temperature range, with 2.2 V–3.6 V supply voltage and ultra-low standby current (2 µA typical). It serves as a low-power, pin-compatible SRAM replacement in portable and battery-sensitive embedded systems.
For engineers reviewing the CY62157EV30LL-45ZXIT datasheet, CY62157EV30LL-45ZXIT pinout, CY62157EV30LL-45ZXIT application, or CY62157EV30LL-45ZXIT equivalent, key selection criteria include its dual-configurable memory organization (512K × 16 / 1M × 8), automatic power-down on deselect, byte-level write enable (BHE/ BLE), and TSOP I package compatibility with legacy CY62157DV30 designs.
Technical Context
The device implements a full CMOS SRAM architecture with independent high- and low-byte enables (BHE, BLE), dual chip enables (CE1, CE2), and automatic power-down when deselected via CE or byte-enable logic. Its internal array is statically latched with no refresh required.
Read and write operations are controlled by synchronous assertion of CE1/CE2, OE/WE, and BHE/ BLE - enabling selective byte writes and high-impedance output control. Tri-state timing parameters (e.g., tHZOE = 18 ns max, tLZCE = 10 ns) ensure clean bus sharing in multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 16 (configurable as 1M × 8 in TSOP I with BYTE pin) |
| Access Time | 45 ns - guarantees data valid within 45 ns after address/CE/OE setup in industrial temp range |
| Supply Voltage | 2.2 V to 3.6 V - supports single-supply operation across Li-ion and regulated 3.3 V rails |
| Standby Current | 2 µA typical, 8 µA max - enables >1-year battery life in always-on IoT nodes |
| Active Current | 6 mA typical at 1 MHz - balances speed and power for burst-mode data logging |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial and automotive-A environments |
| Data Retention Voltage | 1.5 V min - allows memory hold during brown-out or sleep-mode VCC scaling |
Pinout & Package
Package: 48-pin Thin Small Outline Package (TSOP I), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting 512K-word addressing (A19 used only in 1M×8 mode) |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; high-impedance when CE/OE/BHE/ BLE inactive |
| CE1, CE2 | Chip Enable Inputs | Active-Low CE1 and Active-High CE2 provide dual-signal chip select for hierarchical decoding |
| OE | Output Enable | Controls read-data output drivers; high = outputs disabled (Hi-Z) |
| WE | Write Enable | Active-Low signal initiating write cycle; must be synchronized with CE and byte enables |
| BHE, BLE | Byte High/Low Enable | Selective 8-bit writes: BLE enables I/O0–I/O7; BHE enables I/O8–I/O15 |
| VCC, VSS | Power Supply | Dual VCC pins improve noise immunity; dedicated ground pins reduce switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active and standby current by >50% vs. standard SRAMs, extending battery runtime in portable devices |
| Automatic Power-Down on Deselect | Eliminates external power-gating circuitry - device enters sub-µA retention state when CE1 HIGH or CE2 LOW |
| Configurable Memory Width | Single part supports both 16-bit microcontroller buses (512K×16) and 8-bit legacy systems (1M×8) via BYTE pin tie |
| CMOS-Compatible Timing | Meets JEDEC-standard tRC, tAA, tDOE, and tri-state delays - ensures drop-in compatibility with existing SRAM controllers |
| Pb-Free TSOP I Packaging | 48-pin TSOP I footprint matches CY62157DV30 layout - zero PCB redesign required for migration |
Applications
| Portable Medical Monitor | Industrial PLC Data Buffer |
|---|---|
Use Scenario: Real-time ECG waveform capture and local display buffering in handheld patient monitors. IC Role / Device Role / Timing Role: Primary SRAM buffer between ADC controller and display processor; holds 1–2 seconds of sampled data at 1 kSPS. Use Value: 45 ns access enables seamless streaming without FIFO overflow; 2 µA standby preserves battery charge during idle periods between measurements. | Use Scenario: Temporary storage of sensor input history and control algorithm variables in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding runtime configuration and last-known-safe state during power interruption. Use Value: 1.5 V data retention allows continued memory hold down to brown-out threshold; industrial temp rating ensures reliability in uncooled enclosures. |
| Automotive Telematics Unit | Wireless Sensor Node |
Use Scenario: Storing GPS position logs and CAN message buffers in vehicle-mounted telematics gateways. IC Role / Device Role / Timing Role: Dual-port accessible SRAM interfaced to ARM Cortex-M7 core and CAN FD controller via shared bus. Use Value: Byte-enable (BHE/ BLE) support allows concurrent 8-bit CAN payload writes and 16-bit CPU reads without bus contention. | Use Scenario: Low-duty-cycle environmental sensor node transmitting temperature/humidity every 5 minutes using BLE. IC Role / Device Role / Timing Role: Offloading MCU SRAM usage during deep-sleep cycles; retains calibration tables and event counters. Use Value: Sub-µA ISB2 current extends 10-year battery life; TSOP I package enables compact 2-layer PCB design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62157DV30LL-45ZSXI | Same 512K×16 organization and 45 ns speed, but lacks Automotive-E temp grade and uses older process node | No 125 °C support; higher ISB2 (12 µA max); not qualified for extended automotive use | Select only for cost-sensitive industrial designs where extended temp and lowest standby current are non-critical |
| IS61WV51216BLL-45NLI | 45 ns access, 512K×16, 2.5 V–3.6 V supply, but no 2.2 V minimum; standby current 10 µA max | Cannot operate below 2.5 V; unsuitable for single-cell Li-ion (2.7–4.2 V) systems requiring 2.2 V headroom | Prefer for fixed 3.3 V systems where pinout compatibility is secondary to vendor diversification |
Compared with CY62157DV30LL-45ZSXI and IS61WV51216BLL-45NLI, the CY62157EV30LL-45ZXIT uniquely delivers 2.2 V operation, 2 µA standby, and AEC-Q100 automotive qualification - making it the only choice for next-gen battery-powered and automotive-grade SRAM applications.
Availability
CY62157EV30LL-45ZXIT is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data buffers, and automotive telematics units requiring stable component supply, long-term lifecycle support, and guaranteed Pb-free TSOP I packaging.
Supply support for CY62157EV30LL-45ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.
This device belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power, high-reliability embedded applications where extended battery life and robust operation across wide temperature ranges are critical.
FAQ
What is the minimum VCC required to retain data in CY62157EV30LL-45ZXIT?
Data retention is guaranteed down to 1.5 V, provided CE1 is held HIGH, CE2 LOW, and both BHE and BLE are HIGH. At this voltage, ICCDR remains ≤8 µA (industrial grade), allowing memory contents to persist during deep sleep or brown-out conditions without external backup power.
Can CY62157EV30LL-45ZXIT be used in 1M × 8 configuration?
Yes - in the 48-pin TSOP I package, tying the BYTE pin LOW configures the device as 1M × 8. In this mode, A19 appears on pin 45, while BHE, BLE, and I/O8–I/O14 are unused. The 44-pin TSOP II and 48-ball VFBGA packages do not support this configuration.
How does automatic power-down activate in this SRAM?
Automatic power-down engages when the device is deselected: CE1 goes HIGH, CE2 goes LOW, or both BHE and BLE go HIGH. No external control signal is needed - internal logic detects these states and reduces ICC to ≤8 µA (ISB2) without requiring WE or OE manipulation.
Is CY62157EV30LL-45ZXIT pin-compatible with CY62157DV30LL-45ZSXI?
Yes - both use identical 48-pin TSOP I pinouts, including matching A0–A18, I/O0–I/O15, CE1/CE2, OE, WE, BHE, BLE, and VCC/VSS placements. No PCB layout change is required when upgrading from the DV30 to the EV30 generation.
CY62157EV30LL-45ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62157EV30LL-45ZXIT FAQ
1.How can I place an order for CY62157EV30LL-45ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157EV30LL-45ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157EV30LL-45ZXIT reliable?
The price and inventory of CY62157EV30LL-45ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157EV30LL-45ZXIT is usually 5 days.
3.What payment methods are accepted for CY62157EV30LL-45ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157EV30LL-45ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157EV30LL-45ZXIT?
CY62157EV30LL-45ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157EV30LL-45ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157EV30LL-45ZXIT?
For technical support, including CY62157EV30LL-45ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157EV30LL-45ZXIT requirements.
6.How does Aetrix verify that CY62157EV30LL-45ZXIT is sourced from the original manufacturer or authorized distributors?
All CY62157EV30LL-45ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157EV30LL-45ZXIT meets industry standards.
7.What is the process for return or replacement of CY62157EV30LL-45ZXIT?
All CY62157EV30LL-45ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62157EV30LL-45ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157EV30LL-45ZXIT part is unused and in its original packaging.
Return procedure for CY62157EV30LL-45ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62157EV30LL-45ZXIT Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
