Infineon Technologies CY62157G18-55BVXA
- Part No.:
- CY62157G18-55BVXA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62157G18-55BVXA.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,029
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Product details
Overview
CY62157G18-55BVXA from Infineon Technologies (formerly Cypress) is an automotive-grade 8-Mbit (512K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), dual chip-enable architecture, and ultra-low standby current (5 µA typical). It operates across 1.65 V–2.2 V supply, delivers 55 ns access time, and supports byte-level writes via BHE/ BLE control - deployed in ADAS domain controllers requiring deterministic memory integrity.
For engineers reviewing the CY62157G18-55BVXA datasheet, CY62157G18-55BVXA pinout, CY62157G18-55BVXA application, or CY62157G18-55BVXA equivalent, key selection criteria include AEC-Q100 qualification, ECC implementation without automatic write-back, dual CE timing behavior, and VFBGA-48 package compatibility with automotive PCB layout constraints.
Technical Context
The CY62157G18-55BVXA implements a dedicated ECC encoder/decoder block integrated into the SRAM core, correcting single-bit errors on read but not triggering automatic write-back upon detection. Its dual chip-enable logic requires CE1 = LOW and CE2 = HIGH for device selection, decoupling address decoding from chip enable assertion.
It features Byte Power Down: when both BHE and BLE are deasserted, the device enters standby mode regardless of CE state - enabling dynamic power gating per memory access granularity. The 16-bit bidirectional I/O bus (I/O0–I/O15) supports independent upper/lower byte writes and reads under TTL-compatible voltage thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K words × 16-bit) - provides 1 MB of byte-addressable storage space for firmware buffers or sensor data staging. |
| Access Time | 55 ns - guarantees deterministic read latency for real-time interrupt service routines in automotive microcontrollers. |
| Supply Voltage | 1.65 V to 2.2 V - compatible with low-voltage automotive SoC domains and reduces dynamic power vs. 3.3 V SRAMs. |
| Standby Current | 5 µA typical / 35 µA max - enables >10-year battery-backed data retention in always-on vehicle modules. |
| ECC Capability | Single-bit error correction (SER FIT < 0.1 FIT/Mb) - mitigates soft errors from cosmic radiation without system-level intervention. |
| Operating Temp | –40 °C to +85 °C (Automotive-A grade) - qualified for engine bay and cabin-mounted ECUs per AEC-Q100 Rev G. |
| Package | 48-ball VFBGA (6 mm × 8 mm, 0.8 mm pitch) - supports high-density routing and thermal dissipation in compact automotive PCBs. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), JEDEC MO-270AC compliant, 6 mm × 8 mm body, 0.8 mm ball pitch, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 512K-word addressing; A18 used for internal bank selection. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE for byte-select operations. |
| CE1, CE2 | Dual Chip Enable | Active-Low CE1 and Active-High CE2 must both be asserted simultaneously - prevents partial selection during power sequencing transients. |
| WE | Write Enable | Low-active signal initiating write cycle; latches data on rising edge of WE when OE is inactive. |
| OE | Output Enable | Controls output driver enable; I/O pins enter HI-Z when OE is deasserted, even if CE is active. |
| BHE, BLE | Byte High/Low Enable | Independent gating of upper/lower byte drivers; both disabled triggers automatic standby (Byte Power Down). |
| VCC, VSS | Power Supply | Separate VCC (pins 25, 32) and VSS (pins 26, 31) pairs minimize switching noise coupling into memory array. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | On-die Hamming-code encoder/decoder corrects single-bit errors on every read - eliminates need for external ECC logic or software overhead. |
| Byte Power Down | Automatic transition to standby when BHE and BLE are both inactive - reduces leakage during idle memory cycles without CPU coordination. |
| AEC-Q100 Qualified | Stress-tested across temperature, humidity, vibration, and ESD per Automotive Grade A requirements - validated for 15-year vehicle lifecycle. |
| Dual Chip-Enable Logic | CE1 (active-low) and CE2 (active-high) require complementary assertion - improves noise immunity and avoids false enable during rail ramp-up. |
| 1.5-V Data Retention | Maintains stored data at VCC ≥ 1.5 V - enables graceful shutdown and fast wake-up in battery-supplied modules without backup capacitors. |
Applications
| ADAS Sensor Fusion Hub | Automotive Gateway ECU |
|---|---|
Use Scenario: Aggregating raw camera, radar, and ultrasonic sensor streams before preprocessing. IC Role / Device Role / Timing Role: High-speed buffer storing time-aligned frame metadata and intermediate feature vectors with ECC-protected integrity. Use Value: Prevents silent corruption of sensor fusion inputs that could cause false positives/negatives in object detection pipelines. | Use Scenario: Staging CAN FD, Ethernet AVB, and LIN messages for protocol translation and firewall filtering. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for packet buffering and header parsing with deterministic 55 ns access. Use Value: Enables real-time message inspection without introducing jitter or packet loss in safety-critical communication paths. |
| Infotainment Head Unit | Body Control Module (BCM) |
Use Scenario: Caching UI assets and audio codec coefficients during boot and runtime operation. IC Role / Device Role / Timing Role: Fast-access working memory for ARM Cortex-A application processor running QNX or Android Automotive OS. Use Value: Reduces boot time by 120 ms through zero-wait-state execution of cached initialization code. | Use Scenario: Storing configuration profiles, diagnostic trouble codes (DTCs), and calibration parameters across ignition cycles. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding critical settings with ECC-verified persistence during 12 V brownouts. Use Value: Guarantees DTC retention and parameter consistency after 10,000+ cold starts without EEPROM wear-out. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV51216EDBLL-10MLI | No embedded ECC; 10 ns faster access (45 ns); wider VCC range (2.2–3.6 V); no Byte Power Down. | Suitable for non-safety-critical infotainment subsystems where speed outweighs error resilience. | Select only if ECC is handled externally and system-level FIT budget allows uncorrected bit flips. |
| AS6C8016-55TIN | 55 ns access; no ECC; 3.3 V only; TSOP-II package; higher ISB2 (25 µA typical). | Used in legacy BCM designs with existing 3.3 V rails and board space for larger TSOP footprint. | Choose when upgrading legacy platforms with minimal PCB rework and ECC not required by functional safety standard. |
Compared with IS61WV51216EDBLL-10MLI and AS6C8016-55TIN, the CY62157G18-55BVXA uniquely combines AEC-Q100 qualification, on-die ECC, and sub-10 µA standby - making it the only option for ISO 26262 ASIL-B memory subsystems requiring hardware-level error containment.
Availability
CY62157G18-55BVXA is available at Aetrix Electronics and suitable for ADAS sensor fusion hubs, automotive gateway ECUs, and body control modules requiring stable component supply, long-term automotive qualification, and ECC-enabled memory integrity.
Supply support for CY62157G18-55BVXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive ICs, and security solutions - with annual revenue exceeding €14 billion and manufacturing sites across Europe, Asia, and the US.
The CY62157G series belongs to Infineon's automotive SRAM portfolio, designed specifically for functional safety-critical memory applications in ADAS, powertrain, and chassis systems where data integrity, low power, and AEC-Q100 compliance are mandatory.
FAQ
Does CY62157G18-55BVXA support automatic error correction write-back?
No. The device detects and corrects single-bit errors during read operations using embedded ECC, but does not perform automatic write-back to the memory array upon correction. Corrected data is presented to the controller, and any persistent correction must be handled at the system level. This design minimizes latency and avoids unintended writes during transient faults.
What is the function of the BYTE pin in CY62157G18-55BVXA?
The CY62157G18-55BVXA does not have a BYTE pin - that signal exists only in the 48-pin TSOP I variant (e.g., CY62157G18-55ZSXI). The VFBGA-48 package (BVXA suffix) uses fixed 512K × 16-bit organization with no BYTE pin. Pin 45 in TSOP I serves as A19 in 1M × 8 mode, but this configuration is unavailable in the BVXA package.
Can CY62157G18-55BVXA operate at 1.5 V?
No. The absolute minimum operating VCC is 1.65 V per datasheet specifications. While data retention is guaranteed down to 1.5 V, active read/write operations require VCC ≥ 1.65 V. Operating below this threshold risks timing violations, increased bit error rate, and potential bus contention due to degraded noise margins on TTL-compatible I/Os.
How does Byte Power Down interact with chip enable signals?
Byte Power Down overrides chip enable states: when both BHE and BLE are deasserted, the device enters standby mode regardless of CE1/CE2 logic levels. This allows power gating at the byte-access layer - for example, disabling unused I/O lanes during partial writes - without requiring coordinated CE deassertion from the memory controller.
CY62157G18-55BVXA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62157G18-55BVXA FAQ
1.How can I place an order for CY62157G18-55BVXA through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157G18-55BVXA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157G18-55BVXA reliable?
The price and inventory of CY62157G18-55BVXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157G18-55BVXA is usually 5 days.
3.What payment methods are accepted for CY62157G18-55BVXA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157G18-55BVXA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157G18-55BVXA?
CY62157G18-55BVXA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157G18-55BVXA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157G18-55BVXA?
For technical support, including CY62157G18-55BVXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157G18-55BVXA requirements.
6.How does Aetrix verify that CY62157G18-55BVXA is sourced from the original manufacturer or authorized distributors?
All CY62157G18-55BVXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157G18-55BVXA meets industry standards.
7.What is the process for return or replacement of CY62157G18-55BVXA?
All CY62157G18-55BVXA units undergo pre-shipment inspection (PSI). If there is an issue with CY62157G18-55BVXA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157G18-55BVXA part is unused and in its original packaging.
Return procedure for CY62157G18-55BVXA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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