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Infineon Technologies CY62157G30-45ZSXAT
- Part No.:
- CY62157G30-45ZSXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62157G30-45ZSXAT.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,975
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Product details
Overview
CY62157G30-45ZSXAT from Infineon Technologies (formerly Cypress) is an automotive-grade 8-Mbit (512K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), dual chip-enable interface, and 45 ns access time. It operates across 2.2 V to 3.6 V, delivers 18 mA typical active current at fMAX, and supports –40 °C to +85 °C ambient temperature. Used in ADAS domain controllers for real-time data buffering with ECC integrity.
For engineers reviewing the CY62157G30-45ZSXAT datasheet, CY62157G30-45ZSXAT pinout, CY62157G30-45ZSXAT application, or CY62157G30-45ZSXAT equivalent, key selection criteria include AEC-Q100 qualification, 45 ns timing at 3.0 V, 1.4 µA typical standby current (ISB2), byte-select power-down capability, and VFBGA-48 package compatibility with high-density automotive PCB layouts.
Technical Context
The CY62157G30 implements a dual CE architecture (CE1 LOW + CE2 HIGH required for access) with independent BHE/ BLE controls enabling upper- and lower-byte writes to the 16-bit data bus. Its on-die ECC encoder/decoder corrects single-bit errors per 16-bit word without external logic or software intervention.
It features automatic "Byte Power Down": when both BHE and BLE are deasserted, the device enters ISB2 standby mode regardless of CE state-enabling dynamic power gating in partial-access memory subsystems common in automotive microcontroller co-processors and sensor fusion units.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K words × 16-bit); supports full-word parallel access for real-time control buffers. |
| Access Time | 45 ns at VCC = 3.0 V; enables tight timing margins in 20 MHz+ synchronous bus interfaces. |
| Supply Voltage Range | 2.2 V to 3.6 V; compatible with automotive 3.3 V rail and brown-out tolerant down to 2.2 V. |
| Standby Current (ISB2) | 1.4 µA typical / 6.5 µA max at 3.0 V; enables >10-year battery-backed data retention in always-on modules. |
| ECC Function | Single-bit error correction per 16-bit word; reduces SER FIT rate to <0.1 FIT/Mb per AN88889. |
| Operating Temperature | –40 °C to +85 °C (Automotive-A grade); qualified per AEC-Q100 Rev G for under-hood ECUs. |
| Data Retention | 1.5 V minimum VCC; allows low-power hold mode during sleep states without data loss. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 512K-word addressing; A18 used for internal ECC parity generation. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE for byte-level granularity. |
| CE1, CE2 | Dual Chip Enable | Active-Low CE1 AND Active-High CE2 must both be asserted for device selection-prevents partial enable glitches. |
| WE, OE | Write/Output Enable | Asynchronous control: WE LOW initiates write; OE LOW enables read output drivers; both HI-Z when inactive. |
| BHE, BLE | Byte High/Low Enable | Independent gating of upper/lower byte; simultaneous deassertion forces automatic ISB2 standby mode. |
| VCC, VSS | Power/Termination | Dual VCC pins (Balls A16, D1) and dual VSS pins (Balls C2, E1) reduce IR drop and improve noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Hardware-based SEC (single-error correction) per 16-bit word-no CPU overhead or firmware dependency. |
| Byte Power Down | Automatic transition to ISB2 standby when BHE and BLE are both inactive-enables fine-grained power management. |
| AEC-Q100 Qualified | Automotive-A grade (–40 °C to +85 °C) with full reliability stress testing per Rev G requirements. |
| TTL-Compatible I/O | VIH/VIL thresholds meet TTL logic levels across full VCC range-ensures interoperability with legacy MCU buses. |
| Multi-Package Support | Also available in 44-pin TSOP II and 48-pin TSOP I-enables footprint flexibility for cost-optimized or space-constrained designs. |
Applications
| ADAS Sensor Fusion Hub | Automotive Gateway Controller |
|---|---|
Use Scenario: Aggregating timestamped radar, camera, and ultrasonic data streams before preprocessing. IC Role / Device Role / Timing Role: High-speed SRAM buffer with ECC protection for transient frame storage between sensor interface and SoC DMA engine. Use Value: 45 ns access ensures sub-µs latency for burst transfers; ECC prevents silent corruption in safety-critical sensor metadata. | Use Scenario: Storing protocol translation tables and message queue buffers in multi-bus gateways (CAN FD, Ethernet AVB, LIN). IC Role / Device Role / Timing Role: Shared memory resource for inter-processor communication between gateway MCU and network coprocessors. Use Value: Dual CE architecture isolates memory access domains; 1.4 µA ISB2 enables ultra-low-power sleep modes during bus idle periods. |
| Electric Powertrain Inverter Control | Infotainment Head Unit Audio Buffer |
Use Scenario: Holding real-time PWM lookup tables and fault-history logs in traction inverter MCUs. IC Role / Device Role / Timing Role: Non-volatile-retentive SRAM for deterministic control loop variables and diagnostic snapshots. Use Value: 1.5 V data retention allows operation during 12 V battery dips; AEC-Q100 qualification ensures reliability at 105 °C junction temp. | Use Scenario: Low-latency audio sample buffering between DSP and HDMI/MIPI-DSI display pipeline. IC Role / Device Role / Timing Role: Dual-port-capable SRAM acting as ping-pong buffer for zero-jitter audio playback. Use Value: Byte-select enables efficient stereo channel separation; 16-bit bus width matches standard audio word length. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV51216BLL-45MLI | No embedded ECC; 45 ns access at 3.3 V; 2.7–3.6 V only; 44-pin TSOP II package. | Lacks hardware ECC-requires external error handling or software mitigation. | Select when ECC is not required and board layout uses TSOP II footprint. |
| AS6C8016-45TIN | 45 ns at 2.7–3.6 V; no AEC-Q100 qualification; 10 µA typical ISB; 48-pin TSOP I package. | Not automotive-qualified; higher standby current limits use in always-on modules. | Select for industrial or infotainment non-safety subsystems where qualification is not mandated. |
Compared with IS62WV51216BLL-45MLI and AS6C8016-45TIN, CY62157G30-45ZSXAT uniquely combines AEC-Q100 qualification, embedded ECC, and sub-2 µA standby-making it the only choice for ASIL-B–capable memory buffering in powertrain and ADAS domains.
Availability
CY62157G30-45ZSXAT is available at Aetrix Electronics and suitable for automotive ADAS sensor hubs, electric powertrain inverters, and gateway controllers requiring stable component supply across extended product lifecycles.
Supply support for CY62157G30-45ZSXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive ICs, and security solutions.
CY62157G belongs to Infineon's MoBL® (More Battery Life) SRAM product line, engineered specifically for low-power, high-reliability automotive memory applications requiring ECC and AEC-Q100 compliance.
FAQ
Does CY62157G30-45ZSXAT support automatic error correction without external logic?
Yes. The device integrates dedicated ECC encoder/decoder circuitry that performs single-bit error correction transparently on every 16-bit word read. No external controller, firmware, or additional components are required-correction occurs within the SRAM die during normal read cycles.
What is the significance of dual chip-enable (CE1/CE2) in system design?
Dual CE requires CE1 LOW and CE2 HIGH simultaneously to enable the device-this two-signal handshake prevents spurious activation during power-up, reset, or signal skew. It enhances robustness in noisy automotive environments and simplifies address decoding in multi-SRAM systems.
Can CY62157G30-45ZSXAT operate reliably during cold-crank battery conditions?
Yes. With guaranteed operation down to 2.2 V and 1.5 V data retention, the device maintains valid memory contents and functional I/O even during automotive cold-crank events where battery voltage drops below 6 V-critical for preserving fault logs and calibration data.
Is the VFBGA-48 package compatible with standard reflow profiles for lead-free assembly?
Yes. The 48-ball VFBGA package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260 °C. Its 0.5 mm pitch and exposed thermal pad support automated optical inspection and thermal management in high-density automotive PCBs.
CY62157G30-45ZSXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62157G30-45ZSXAT FAQ
1.How can I place an order for CY62157G30-45ZSXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157G30-45ZSXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157G30-45ZSXAT reliable?
The price and inventory of CY62157G30-45ZSXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157G30-45ZSXAT is usually 5 days.
3.What payment methods are accepted for CY62157G30-45ZSXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157G30-45ZSXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157G30-45ZSXAT?
CY62157G30-45ZSXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157G30-45ZSXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157G30-45ZSXAT?
For technical support, including CY62157G30-45ZSXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157G30-45ZSXAT requirements.
6.How does Aetrix verify that CY62157G30-45ZSXAT is sourced from the original manufacturer or authorized distributors?
All CY62157G30-45ZSXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157G30-45ZSXAT meets industry standards.
7.What is the process for return or replacement of CY62157G30-45ZSXAT?
All CY62157G30-45ZSXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62157G30-45ZSXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157G30-45ZSXAT part is unused and in its original packaging.
Return procedure for CY62157G30-45ZSXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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