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Infineon Technologies CY62157G30-45ZXA
- Part No.:
- CY62157G30-45ZXA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62157G30-45ZXA.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:4,588
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Product details
Overview
CY62157G30-45ZXA from Infineon Technologies (formerly Cypress) is an automotive-grade 8-Mbit (512K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), dual chip-enable architecture, 45 ns access time, and AEC-Q100 qualification for Automotive-A (–40 °C to +85 °C) operation. It operates across 2.2 V to 3.6 V supply, delivers 18 mA typical active current at fMAX, and supports byte-level write control via BHE/ BLE.
For engineers reviewing the CY62157G30-45ZXA datasheet, CY62157G30-45ZXA pinout, CY62157G30-45ZXA application, or CY62157G30-45ZXA equivalent, this device is selected for safety-critical automotive memory subsystems requiring ECC integrity, ultra-low standby power (1.4 µA typ), TTL-compatible I/O, and Pb-free 48-ball VFBGA packaging.
Technical Context
The CY62157G30-45ZXA implements a dedicated ECC encoder/decoder block integrated into the SRAM core, correcting single-bit errors on read without automatic write-back. Its dual chip-enable logic (CE1 LOW & CE2 HIGH) enables hierarchical memory mapping in multi-bank systems.
It features Byte Power Down: asserting both BHE and BLE inactive forces automatic transition to ISB1/ISB2 standby regardless of CE state-enabling dynamic per-byte power gating. Address range spans A0–A19 (20-bit), supporting full 512K-word addressing with no internal bank switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K words × 16-bit); provides 1 MB of word-accessible, non-refreshing volatile storage. |
| Access Time | 45 ns max at VCC = 2.2–3.6 V; ensures deterministic timing for real-time automotive microcontroller interfaces. |
| ECC Function | Single-bit error correction (SEC) with SER FIT rate < 0.1 FIT/Mb; detects and corrects bit flips in stored data without software intervention. |
| Standby Current | 1.4 µA typical (ISB2), 6.5 µA max at VCC = 3.6 V; enables low-power sleep modes in ADAS ECUs and gateway modules. |
| Supply Voltage | 2.2 V to 3.6 V; compatible with 3.3 V automotive power rails and tolerant of transient droop down to 2.2 V. |
| Operating Temperature | –40 °C to +85 °C (Automotive-A grade); qualified per AEC-Q100 Rev G for under-hood and cabin control units. |
| I/O Interface | TTL-compatible inputs/outputs; eliminates level-shifting requirements when interfacing with legacy MCU buses. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 5 mm × 6 mm, 0.5 mm pitch, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 512K-word linear addressing; no internal multiplexing or bank select required. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; supports simultaneous read/write of full word or byte-selectable access via BHE/ BLE. |
| CE1, CE2 | Dual Chip Enable | Active-Low CE1 and Active-High CE2 must both be asserted for device selection; enables hierarchical memory decoding. |
| WE, OE | Write Enable / Output Enable | Asynchronous control: WE LOW initiates write; OE LOW enables output drivers during read; both high place I/O in HI-Z. |
| BHE, BLE | Byte High/Low Enable | BHE controls I/O8–I/O15; BLE controls I/O0–I/O7; both inactive triggers automatic Byte Power Down mode. |
| VCC, VSS | Power Supply / Ground | Single VCC rail (2.2–3.6 V); two VSS balls provide low-inductance return paths for noise-sensitive SRAM operation. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded SEC ECC | Hardware-based single-bit error correction with no CPU overhead; meets ASIL-B data integrity requirements for memory subsystems. |
| Byte Power Down | Automatic entry into ultra-low-power standby (ISB1/ISB2) when both BHE and BLE are deasserted-enabling per-byte power gating. |
| Dual Chip-Enable Logic | CE1 (active-low) and CE2 (active-high) enable precise memory window selection in multi-SRAM systems without external decode logic. |
| AEC-Q100 Qualified | Qualified to Automotive-A temperature grade (–40 °C to +85 °C) with full reliability testing including HTOL, TC, and ESD. |
| Pb-Free VFBGA Packaging | 48-ball VFBGA (5 × 6 mm) supports automated SMT assembly and thermal performance suitable for automotive PCB layouts. |
Applications
| Advanced Driver Assistance Systems (ADAS) | Automotive Gateway Modules |
|---|---|
|
Use Scenario: Storing real-time sensor fusion buffers and radar preprocessing results in front-camera ECU. IC Role / Device Role / Timing Role: Volatile working memory with ECC-protected data path between SoC and image signal processor. Use Value: Prevents silent data corruption in safety-critical vision processing pipelines; 45 ns access enables sub-100 µs latency for frame buffering. |
Use Scenario: Holding protocol translation tables and CAN/FlexRay message queues in vehicle communication gateways. IC Role / Device Role / Timing Role: Shared SRAM for multi-protocol message buffering with hardware ECC ensuring integrity across bus bridges. Use Value: Eliminates need for software checksum overhead; 1.4 µA standby current extends sleep-mode duration during vehicle ignition-off states. |
| Engine Control Units (ECU) | Infotainment Head Units |
|
Use Scenario: Caching real-time engine calibration maps and knock sensor history in gasoline/diesel ECUs. IC Role / Device Role / Timing Role: Fast-access scratchpad memory for closed-loop combustion control algorithms running on 32-bit MCUs. Use Value: 2.2–3.6 V operating range tolerates battery voltage fluctuations; AEC-Q100 qualification ensures reliability under under-hood thermal stress. |
Use Scenario: Buffering audio DSP coefficients and UI rendering assets in head unit application processors. IC Role / Device Role / Timing Role: Low-latency, ECC-secured memory for multimedia subsystems requiring deterministic access timing. Use Value: TTL-compatible I/O simplifies interface to legacy audio SoCs; VFBGA package enables compact layout in space-constrained dashboards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV51216BLL-45NLI | No embedded ECC; 45 ns access, 2.5–3.6 V supply, –40 °C to +85 °C; 512K × 16-bit, 48-pin TSOP II. | Lacks hardware SEC; requires external error detection or software ECC layer for functional safety compliance. | Select when ECC is handled at system level and cost sensitivity outweighs ASIL-B memory integrity requirements. |
| ON Semiconductor NVSRAM N25S80A-45GQF | Non-volatile SRAM (nvSRAM); 45 ns access, 2.7–3.6 V, –40 °C to +85 °C; retains data without backup battery. | Provides data retention on power loss but higher standby current (15 µA typ) and no ECC correction capability. | Select when power-fail data persistence is prioritized over real-time error correction and ultra-low standby power. |
Compared with IS62WV51216BLL-45NLI and N25S80A-45GQF, CY62157G30-45ZXA uniquely combines hardware SEC ECC, sub-2 µA standby, and AEC-Q100 Automotive-A qualification-making it the only choice for ASIL-B-compliant memory where both integrity and ultra-low power are mandatory.
Availability
CY62157G30-45ZXA is available at Aetrix Electronics and suitable for advanced driver assistance systems (ADAS), automotive gateway modules, and engine control units (ECU) requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant memory solutions.
Supply support for CY62157G30-45ZXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and security solutions with strong vertical integration and automotive qualification expertise.
CY62157G30-45ZXA belongs to Infineon's MoBL® (Mobile Low-Power) SRAM product line, designed specifically for automotive and industrial applications demanding ultra-low standby power, ECC-enabled data integrity, and extended temperature reliability.
FAQ
Does CY62157G30-45ZXA support automatic error correction during read operations?
Yes. The device performs real-time single-bit error correction (SEC) on every read access using its integrated ECC encoder/decoder. Detected errors are corrected before data is driven onto the I/O bus. However, it does not perform automatic write-back after correction-corrupted bits remain uncorrected in the array unless rewritten by the host system.
What is the function of the BYTE pin mentioned in the TSOP I package documentation?
The BYTE pin exists only in the 48-pin TSOP I variant (not in the VFBGA ZXA package). When tied to VCC, it configures the device as a 512K × 16 SRAM; when tied to VSS, it operates as a 1M × 8 SRAM using A19 (pin 45) as the extra address line. This pin is absent and irrelevant for CY62157G30-45ZXA, which uses the 48-ball VFBGA footprint.
Can CY62157G30-45ZXA operate reliably at 2.2 V supply during cold-cranking conditions?
Yes. The device is fully specified for 2.2 V to 3.6 V operation across –40 °C to +85 °C. At 2.2 V and –40 °C, access time remains within 45 ns (per datasheet AC characteristics), and all DC parameters-including VIH/VIL thresholds and ICC-meet guaranteed limits, making it suitable for cold-cranking scenarios in automotive power domains.
Is the 48-ball VFBGA package of CY62157G30-45ZXA compatible with standard reflow profiles?
Yes. The Pb-free VFBGA package complies with IPC/JEDEC J-STD-020 moisture sensitivity level (MSL) 3 and is qualified for standard lead-free reflow profiles (peak temperature ≤ 260 °C, 20–40 sec above 217 °C). Board design must follow Infineon's recommended pad layout and stencil specifications to ensure solder joint reliability.
CY62157G30-45ZXA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62157G30-45ZXA FAQ
1.How can I place an order for CY62157G30-45ZXA through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157G30-45ZXA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157G30-45ZXA reliable?
The price and inventory of CY62157G30-45ZXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157G30-45ZXA is usually 5 days.
3.What payment methods are accepted for CY62157G30-45ZXA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157G30-45ZXA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157G30-45ZXA?
CY62157G30-45ZXA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157G30-45ZXA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157G30-45ZXA?
For technical support, including CY62157G30-45ZXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157G30-45ZXA requirements.
6.How does Aetrix verify that CY62157G30-45ZXA is sourced from the original manufacturer or authorized distributors?
All CY62157G30-45ZXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157G30-45ZXA meets industry standards.
7.What is the process for return or replacement of CY62157G30-45ZXA?
All CY62157G30-45ZXA units undergo pre-shipment inspection (PSI). If there is an issue with CY62157G30-45ZXA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157G30-45ZXA part is unused and in its original packaging.
Return procedure for CY62157G30-45ZXA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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