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Infineon Technologies CY62157G30-45ZXI
- Part No.:
- CY62157G30-45ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62157G30-45ZXI.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:4,792
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Product details
Overview
CY62157G30-45ZXI from Infineon Technologies (formerly Cypress) is an industrial-grade 8-Mbit MoBL® SRAM with embedded Error-Correcting Code (ECC), 512K × 16-bit organization, 45 ns access time, and 1.65–3.6 V supply range. It delivers single-bit error correction in memory arrays and supports ultra-low-power standby operation (1.4 µA typical) for battery-backed systems in medical data loggers and avionics control units.
For engineers reviewing the CY62157G30-45ZXI datasheet, CY62157G30-45ZXI pinout, CY62157G30-45ZXI application, or CY62157G30-45ZXI equivalent, key selection criteria include ECC-enabled reliability, dual CE architecture, byte-selectable write capability, and compatibility with 48-ball VFBGA footprint in space-constrained embedded designs.
Technical Context
This SRAM implements a dedicated on-die ECC encoder/decoder pair that detects and corrects single-bit errors per 16-bit word during read operations without external logic. Its dual chip enable (CE1 LOW / CE2 HIGH) architecture enables hierarchical memory mapping in multi-bank controllers.
The device integrates Byte Power Down logic: when both BHE and BLE are deasserted, it enters automatic standby mode regardless of CE state-enabling dynamic power gating in firmware-controlled memory subsystems. Address range spans A0–A18 (512K words), with optional 1M × 8 configuration supported only in 48-pin TSOP I package (not applicable to -ZXI).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 8 Mbit (512K × 16-bit organization); supports deterministic addressing without bank switching |
| Access Time | 45 ns at VCC = 2.2–3.6 V; ensures timing closure in 22.22 MHz synchronous bus interfaces |
| Supply Voltage | 1.65 V to 3.6 V; compatible with mixed-voltage SoC domains including 1.8 V and 3.3 V I/O rails |
| Standby Current | 1.4 µA typical / 6.5 µA max at 85 °C; enables >10-year battery life in always-on monitoring nodes |
| ECC Function | On-die single-bit error correction per 16-bit word; eliminates need for external Hamming logic or software scrubbing |
| Data Retention | 1.0 V minimum retention voltage; allows graceful shutdown and low-VCC hibernation without data loss |
| I/O Compatibility | TTL-compatible inputs/outputs; simplifies interface to legacy microcontrollers and FPGAs without level shifters |
Pinout & Package
The CY62157G30-45ZXI is packaged in a Pb-free 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) with 0.5 mm pitch and 6.0 mm × 8.0 mm body size. This package supports high-density PCB layouts and automated reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word decoding; no A19 required (unlike 1M×8 mode) |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; split into upper (I/O8–I/O15) and lower (I/O0–I/O7) bytes via BHE/BLE |
| CE1, CE2 | Dual Chip Enable | Active-Low CE1 and Active-High CE2 must both be asserted for device selection; enables memory banking |
| WE, OE, BHE, BLE | Control Inputs | WE controls write strobe; OE enables output drivers; BHE/BLE gate upper/lower byte writes and reads |
| VCC, VSS | Power Supply | Single-supply operation; two VCC and two VSS balls provide low-impedance power distribution and noise reduction |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Logic | Hardware-accelerated single-bit error correction per 16-bit word, reducing CPU overhead and eliminating uncorrectable soft errors |
| Byte Power Down | Automatic transition to standby when BHE and BLE are both inactive-enables firmware-triggered power gating without CE manipulation |
| Ultra-Low ISB2 | 6.5 µA max standby current at 85 °C ensures compliance with stringent energy budgets in sealed industrial enclosures |
| Wide VCC Range | 1.65–3.6 V operation supports direct connection to Li-ion battery rails (2.7–3.6 V) and 1.8 V FPGA I/O banks |
| TTL-Compatible I/O | Eliminates need for external level translators when interfacing with legacy 3.3 V or 5 V microcontrollers |
Applications
| Avionics Data Recorders | Medical Diagnostic Imaging Buffers |
|---|---|
Use Scenario: Continuous capture of flight parameter telemetry with guaranteed data integrity over extended mission durations. IC Role / Device Role / Timing Role: Primary volatile buffer storing sensor streams before ECC-protected flash write; operates under DO-160E temperature and vibration stress. Use Value: On-die ECC prevents latent bit flips from cosmic radiation, avoiding corrupted black-box data without increasing system latency or BOM cost. | Use Scenario: Real-time buffering of ultrasound frame data prior to GPU-accelerated reconstruction. IC Role / Device Role / Timing Role: High-bandwidth 16-bit parallel SRAM interfaced directly to ADC controller; 45 ns access sustains >20 MB/s sustained throughput. Use Value: Dual CE architecture allows seamless interleaving with auxiliary memory banks, while 1.4 µA standby extends portable device runtime between charges. |
| Industrial PLC I/O Caching | Railway Signaling Controllers |
Use Scenario: Local storage of distributed I/O status snapshots synchronized across redundant safety channels. IC Role / Device Role / Timing Role: Deterministic-access SRAM used as mirrored cache between primary and backup CPUs; ECC ensures identical state recovery after failover. Use Value: Automatic Byte Power Down reduces average power by >90% during polling intervals, meeting EN 50121-3-2 EMC thermal limits. | Use Scenario: Storing critical interlocking logic tables in wayside signaling cabinets exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Industrial-grade SRAM operating from –40 °C to +85 °C; 1.0 V data retention enables safe power-loss recovery during grid fluctuations. Use Value: VFBGA package withstands mechanical shock per EN 50125-3, while dual CE support enables hot-swap memory module replacement without system reset. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC-enhanced SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV51216BLL-10MLI | No integrated ECC; requires external error detection logic or software correction | Suitable for non-safety-critical buffering where bit error rate is negligible | Select when cost sensitivity outweighs ECC requirement and system-level error handling is already implemented |
| AS6C8016-45TIN | 45 ns speed grade but no ECC; higher standby current (25 µA typical) | Used in consumer electronics where radiation-induced errors are not a design concern | Prefer for high-volume cost-driven designs lacking functional safety certification requirements |
Compared with IS61WV51216BLL-10MLI and AS6C8016-45TIN, CY62157G30-45ZXI uniquely delivers hardware ECC, sub-µA standby, and industrial temperature support in a single VFBGA package-making it the only drop-in solution for IEC 61508 SIL-2 or DO-178C Level C systems requiring zero-error memory integrity.
Availability
CY62157G30-45ZXI is available at Aetrix Electronics and suitable for avionics data recorders, medical diagnostic imaging buffers, and industrial PLC I/O caching requiring stable component supply across extended product lifecycles.
Supply support for CY62157G30-45ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with emphasis on reliability and industrial longevity.
CY62157G30-45ZXI belongs to the MoBL® (Mobile Bitline) SRAM product line, engineered specifically for ultra-low-power, ECC-protected memory in mission-critical embedded systems operating across harsh environmental conditions.
FAQ
Does CY62157G30-45ZXI support 1M × 8-bit configuration?
No. The CY62157G30-45ZXI is factory-configured exclusively for 512K × 16-bit operation. The 1M × 8-bit mode is only available in the 48-pin TSOP I package variant (e.g., CY62157G30-45ZI), which uses pin A19 and disables BHE/BLE functionality-neither supported in the VFBGA (-ZXI) package.
What is the function of the ERR pin on CY62157GE devices?
The ERR pin is specific to the CY62157GE variant and asserts LOW when an uncorrectable multi-bit error is detected. CY62157G30-45ZXI is a G-series part and does not include the ERR output; its ECC logic performs silent correction without status reporting.
Can CE1 and CE2 be tied together for simplified control?
No. The dual CE architecture requires CE1 LOW and CE2 HIGH simultaneously for device selection. Tying them together violates the logic condition and renders the device permanently deselected or non-functional. External logic or MCU GPIOs must drive CE1 and CE2 independently.
Is the 48-ball VFBGA footprint compatible with JEDEC MO-276AA standard?
Yes. The CY62157G30-45ZXI's 48-ball VFBGA adheres to JEDEC MO-276AA (6.0 mm × 8.0 mm, 0.5 mm pitch, ball layout A1–H6), enabling drop-in replacement with other MO-276AA-compliant memory devices and compatibility with standard stencil and reflow profiles.
CY62157G30-45ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62157G30-45ZXI FAQ
1.How can I place an order for CY62157G30-45ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62157G30-45ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62157G30-45ZXI reliable?
The price and inventory of CY62157G30-45ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157G30-45ZXI is usually 5 days.
3.What payment methods are accepted for CY62157G30-45ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157G30-45ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62157G30-45ZXI?
CY62157G30-45ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62157G30-45ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62157G30-45ZXI?
For technical support, including CY62157G30-45ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157G30-45ZXI requirements.
6.How does Aetrix verify that CY62157G30-45ZXI is sourced from the original manufacturer or authorized distributors?
All CY62157G30-45ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157G30-45ZXI meets industry standards.
7.What is the process for return or replacement of CY62157G30-45ZXI?
All CY62157G30-45ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62157G30-45ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62157G30-45ZXI part is unused and in its original packaging.
Return procedure for CY62157G30-45ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62157G30-45ZXI Tags
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