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Infineon Technologies CY62157H30-45BVXAT

Part No.:
CY62157H30-45BVXAT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62157H30-45BVXAT.pdf
Description:
IC SRAM 8MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,555

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Product details

Overview

CY62157H30-45BVXAT from Cypress Semiconductor is an AEC-Q100 qualified automotive-grade 8-Mbit (512K × 16) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 45 ns access time over 2.2–3.6 V supply, with ultra-low 5.5 μA typical standby current and –40 °C to +85 °C temperature range - deployed in ADAS domain controllers for real-time sensor data buffering.

For engineers reviewing the CY62157H30-45BVXAT datasheet, CY62157H30-45BVXAT pinout, CY62157H30-45BVXAT application, or CY62157H30-45BVXAT equivalent, key selection criteria include dual chip-enable timing compatibility, byte-power-down behavior under BHE/BLE deassertion, ECC correction without automatic write-back, and VFBGA-48 thermal resistance (ΘJA = 31.5 °C/W) for thermally constrained ECUs.

Technical Context

This SRAM implements a dual CE architecture (CE1 LOW + CE2 HIGH) for selective device activation and supports independent upper-byte (BHE) and lower-byte (BLE) writes via dedicated I/O0–I/O7 and I/O8–I/O15 paths. Its ECC logic detects and corrects single-bit errors in real time but does not perform automatic write-back on correction.

The "Byte Power Down" feature enables seamless transition to standby mode when both BHE and BLE are deasserted - independent of CE state - reducing power to ≤16 μA. Data retention remains valid down to 1.0 V VCC, with tCDR (chip deselect to retention) unmeasured and tR (recovery time) specified at 45 ns.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 8 Mbit (512K words × 16-bit bus), enabling 1 MB of error-resilient buffer space per device
Access Time 45 ns max - defines minimum read/write cycle timing for 22.2 MHz burst operation
Supply Voltage 2.2 V to 3.6 V - compatible with automotive 3.3 V rails and brown-out tolerant down to 2.2 V
Standby Current 5.5 μA typical / 16 μA max - meets low-power requirements for always-on ECU modules
ECC Function Single-bit error correction (no automatic write-back) - provides fault containment without hidden latency penalties
Operating Temp –40 °C to +85 °C (Automotive-A grade) - validated for under-hood and cabin-mounted control units
Data Retention 1.0 V minimum VCC - sustains memory contents during deep sleep or battery droop events

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm footprint, 0.5 mm pitch, JEDEC MO-276AA compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus supporting full 512K-word addressing; A16–A19 unused in 256K configuration
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE
CE1, CE2 Dual Chip Enable Active-low CE1 AND active-high CE2 required simultaneously for access - prevents partial enable glitches
WE Write Enable Low-active signal initiating write cycles; overlaps with CE and BHE/BLE to define internal write window
OE Output Enable Controls output drivers only; does not affect internal state or power mode
BHE, BLE Byte High/Low Enable Independent gating of upper/lower byte paths; simultaneous deassertion triggers Byte Power Down
VCC, VSS Power Supply Single 2.2–3.6 V supply; no separate I/O or core voltage rails
NC No Connect Unbonded pads (A12, A18, two others) - reserved for future density scaling, must be left floating

Key Features

Feature Design Value
AEC-Q100 Qualified Validated for automotive use per Grade A stress testing - eliminates qualification overhead for Tier 1 suppliers
Embedded ECC On-die single-bit error correction with no external logic or firmware intervention required
Byte Power Down Automatic entry into 5.5 μA standby when BHE and BLE are both inactive - independent of CE state
TTL-Compatible I/O VIH/VIL thresholds defined across full VCC range (2.2–3.6 V) - interoperable with legacy 3.3 V microcontrollers
Dual Chip-Enable Logic Requires CE1 = LOW AND CE2 = HIGH - prevents spurious access during power-up or reset transitions

Applications

ADAS Sensor Fusion Hub Automotive Gateway ECU

Use Scenario: Real-time aggregation of camera, radar, and ultrasonic sensor frames before preprocessing.

IC Role / Device Role / Timing Role: High-speed, ECC-protected frame buffer holding up to 512K 16-bit samples with deterministic 45 ns read latency.

Use Value: Prevents single-event upsets from corrupting fused sensor data - critical for ISO 26262 ASIL-B path integrity.

Use Scenario: Message buffering between CAN FD, Ethernet AVB, and LIN subsystems during protocol translation.

IC Role / Device Role / Timing Role: Dual-port accessible SRAM staging area with byte-select writes for mixed-protocol payload assembly.

Use Value: Enables concurrent ingress/egress handling without software-managed lock arbitration or external FIFO logic.

Infotainment Head Unit UI Cache Electric Powertrain Inverter Control

Use Scenario: Storing rendered GUI tile sets and font glyphs for low-latency display refresh in head units.

IC Role / Device Role / Timing Role: Low-power, high-reliability scratchpad memory accessed during GPU idle cycles.

Use Value: Reduces DDR bandwidth pressure while maintaining pixel-perfect UI rendering under thermal throttling.

Use Scenario: Holding calibrated PWM lookup tables and fault-history logs in traction inverter MCUs.

IC Role / Device Role / Timing Role: Retentive storage for safety-critical calibration data with 1.0 V data retention margin during DC-link dips.

Use Value: Ensures motor control continuity during transient 12 V rail sags - avoids torque interruption or limp-home mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM-with-ECC applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV51216BLL-45NLI No embedded ECC; requires external error detection logic; 45 ns speed, same 512K×16 density Lacks hardware-level error correction - unsuitable for ASIL-B systems without added SW/FW validation Select only where ECC is implemented in host processor or system-level redundancy is acceptable
ON Semiconductor NVSRAM N25S80A16T1G Non-volatile SRAM with EEPROM backup; no ECC; 55 ns access; 1.8 V min VCC Provides data persistence after power loss but adds 10 ms store/retrieve latency and higher cost Prefer when power-loss data retention outweighs ECC need and 45 ns timing is non-critical

Compared with IS62WV51216BLL-45NLI and N25S80A16T1G, CY62157H30-45BVXAT uniquely delivers certified automotive reliability, on-die ECC, and sub-10 μA standby - making it optimal for safety-critical, low-power, real-time buffering where deterministic error containment is mandatory.

Availability

CY62157H30-45BVXAT is available at Aetrix Electronics and suitable for ADAS domain controllers, automotive gateways, infotainment UI caching, and electric powertrain inverter control requiring stable component supply across extended automotive lifecycles.

Supply support for CY62157H30-45BVXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with global manufacturing and AEC-Q100 validation infrastructure.

CY62157H30-45BVXAT belongs to Cypress's MoBL® (More Battery Life) SRAM product line - engineered specifically for low-voltage, low-power, high-reliability automotive memory applications with integrated ECC and extended temperature operation.

FAQ

Does CY62157H30-45BVXAT support automatic error correction write-back?

No. The embedded ECC detects and corrects single-bit errors during read operations, but corrected data is not automatically written back to the memory array. Host firmware must explicitly initiate a write if persistent correction is required. This design avoids hidden write cycles that could interfere with real-time timing guarantees.

What happens when both BHE and BLE are deasserted while CE1/CE2 remain active?

The device enters Byte Power Down mode regardless of CE state, reducing ICC to ≤16 μA. Outputs go Hi-Z, internal clocks halt, and the memory array enters ultra-low-power retention - but address/data lines remain latched and accessible upon re-enabling BHE or BLE without full re-initialization.

Is the 48-ball VFBGA package lead-free and RoHS-compliant?

Yes. CY62157H30-45BVXAT uses a Pb-free, RoHS-compliant VFBGA package with matte tin surface finish. Solder reflow profiles follow IPC/JEDEC J-STD-020D for MSL3 handling, and the package meets JEDEC MO-276AA mechanical specifications.

Can CY62157H30-45BVXAT operate reliably at 2.2 V VCC across the full –40 °C to +85 °C range?

Yes. All AC and DC specifications - including 45 ns access time, 5.5 μA standby current, and TTL-compatible VIH/VIL thresholds - are guaranteed over 2.2–3.6 V and –40 °C to +85 °C per AEC-Q100 Automotive-A qualification. Data retention holds down to 1.0 V at temperature extremes.

CY62157H30-45BVXAT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62157H30-45BVXAT FAQ

1.How can I place an order for CY62157H30-45BVXAT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62157H30-45BVXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62157H30-45BVXAT reliable?

The price and inventory of CY62157H30-45BVXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62157H30-45BVXAT is usually 5 days.

3.What payment methods are accepted for CY62157H30-45BVXAT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62157H30-45BVXAT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62157H30-45BVXAT?

CY62157H30-45BVXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62157H30-45BVXAT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62157H30-45BVXAT?

For technical support, including CY62157H30-45BVXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62157H30-45BVXAT requirements.

6.How does Aetrix verify that CY62157H30-45BVXAT is sourced from the original manufacturer or authorized distributors?

All CY62157H30-45BVXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62157H30-45BVXAT meets industry standards.

7.What is the process for return or replacement of CY62157H30-45BVXAT?

All CY62157H30-45BVXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62157H30-45BVXAT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62157H30-45BVXAT part is unused and in its original packaging.

Return procedure for CY62157H30-45BVXAT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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